
Sheila V. Clark
Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823 |
| Total Applications | 3274 |
| Issued Applications | 2860 |
| Pending Applications | 49 |
| Abandoned Applications | 366 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4614368
[patent_doc_number] => 07989943
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-02
[patent_title] => 'Staircase shaped stacked semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 12/492224
[patent_app_country] => US
[patent_app_date] => 2009-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 5652
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/989/07989943.pdf
[firstpage_image] =>[orig_patent_app_number] => 12492224
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/492224 | Staircase shaped stacked semiconductor package | Jun 25, 2009 | Issued |
Array
(
[id] => 8630535
[patent_doc_number] => 08362607
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-01-29
[patent_title] => 'Integrated circuit package including a thermally and electrically conductive package lid'
[patent_app_type] => utility
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[patent_app_date] => 2009-06-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/455574 | Integrated circuit package including a thermally and electrically conductive package lid | Jun 2, 2009 | Issued |
Array
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[patent_issue_date] => 2014-10-14
[patent_title] => 'Stacked electronic device and method of making such an electronic device'
[patent_app_type] => utility
[patent_app_number] => 12/737060
[patent_app_country] => US
[patent_app_date] => 2009-06-02
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[patent_drawing_sheets_cnt] => 16
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12737060
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Array
(
[id] => 5300310
[patent_doc_number] => 20090294962
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-03
[patent_title] => 'PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/474654
[patent_app_country] => US
[patent_app_date] => 2009-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0294/20090294962.pdf
[firstpage_image] =>[orig_patent_app_number] => 12474654
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/474654 | Packaging substrate and method for fabricating the same | May 28, 2009 | Issued |
Array
(
[id] => 5551701
[patent_doc_number] => 20090285687
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-19
[patent_title] => 'Blade, impeller, turbo fluid machine, method and apparatus for manufacturing blade'
[patent_app_type] => utility
[patent_app_number] => 12/453692
[patent_app_country] => US
[patent_app_date] => 2009-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/453692 | Blade, impeller, turbo fluid machine, method and apparatus for manufacturing blade | May 18, 2009 | Issued |
Array
(
[id] => 4624778
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[patent_issue_date] => 2011-08-23
[patent_title] => 'Chip package structure and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/464873
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[pdf_file] => patents/08/004/08004079.pdf
[firstpage_image] =>[orig_patent_app_number] => 12464873
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/464873 | Chip package structure and manufacturing method thereof | May 12, 2009 | Issued |
Array
(
[id] => 6472561
[patent_doc_number] => 20100284781
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[patent_kind] => A1
[patent_issue_date] => 2010-11-11
[patent_title] => 'MITIGATING MECHANICAL VIBRATIONS CAUSED BY A FAN IN A COMPUTER SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 12/435976
[patent_app_country] => US
[patent_app_date] => 2009-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0284/20100284781.pdf
[firstpage_image] =>[orig_patent_app_number] => 12435976
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/435976 | Mitigating mechanical vibrations caused by a fan in a computer system | May 4, 2009 | Issued |
Array
(
[id] => 6372160
[patent_doc_number] => 20100080710
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-01
[patent_title] => 'Stator vanes of a stator vane cascade of an aircraft gas turbine'
[patent_app_type] => utility
[patent_app_number] => 12/453130
[patent_app_country] => US
[patent_app_date] => 2009-04-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0080/20100080710.pdf
[firstpage_image] =>[orig_patent_app_number] => 12453130
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/453130 | Stator vanes of a stator vane cascade of an aircraft gas turbine | Apr 28, 2009 | Issued |
Array
(
[id] => 6417900
[patent_doc_number] => 20100276892
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-11-04
[patent_title] => 'PACKING SEAL ROTOR LANDS'
[patent_app_type] => utility
[patent_app_number] => 12/432272
[patent_app_country] => US
[patent_app_date] => 2009-04-29
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[firstpage_image] =>[orig_patent_app_number] => 12432272
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/432272 | Packing seal rotor lands | Apr 28, 2009 | Issued |
Array
(
[id] => 7724691
[patent_doc_number] => 08097963
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2012-01-17
[patent_title] => 'Electrically conductive matrix for z-axis interconnect'
[patent_app_type] => utility
[patent_app_number] => 12/431694
[patent_app_country] => US
[patent_app_date] => 2009-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/08/097/08097963.pdf
[firstpage_image] =>[orig_patent_app_number] => 12431694
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/431694 | Electrically conductive matrix for z-axis interconnect | Apr 27, 2009 | Issued |
Array
(
[id] => 6624839
[patent_doc_number] => 20100172758
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-08
[patent_title] => 'HEAT DISSIPATION FAN'
[patent_app_type] => utility
[patent_app_number] => 12/430850
[patent_app_country] => US
[patent_app_date] => 2009-04-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0172/20100172758.pdf
[firstpage_image] =>[orig_patent_app_number] => 12430850
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/430850 | Heat dissipation fan | Apr 26, 2009 | Issued |
| 12/426000 | SEMICONDUCTOR PACKAGE | Apr 16, 2009 | Abandoned |
Array
(
[id] => 6264274
[patent_doc_number] => 20100252920
[patent_country] => US
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[patent_title] => 'Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates'
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Array
(
[id] => 5456113
[patent_doc_number] => 20090256265
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[patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE'
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Array
(
[id] => 8340679
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/148993 | Semiconductor device | Feb 26, 2009 | Issued |
Array
(
[id] => 6495052
[patent_doc_number] => 20100200984
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[patent_issue_date] => 2010-08-12
[patent_title] => 'ADJUSTABLE THREADED CORES FOR LED THERMAL MANAGEMENT'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/370453 | Adjustable threaded cores for LED thermal management | Feb 11, 2009 | Issued |
Array
(
[id] => 4443703
[patent_doc_number] => 07928541
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[patent_title] => 'Copper alloy sheet and QFN package'
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[pdf_file] => patents/07/928/07928541.pdf
[firstpage_image] =>[orig_patent_app_number] => 12363974
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/363974 | Copper alloy sheet and QFN package | Feb 1, 2009 | Issued |
Array
(
[id] => 5378481
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/362354 | Semiconductor device | Jan 28, 2009 | Issued |
Array
(
[id] => 5996306
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[patent_title] => 'ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE'
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/360644 | Integrated circuit packaging system with carrier and method of manufacture thereof | Jan 26, 2009 | Issued |