Search

Sheila V. Clark

Examiner (ID: 7169, Phone: (571)272-1725 , Office: P/2896 )

Most Active Art Unit
2815
Art Unit(s)
2607, 2896, 2891, 2504, 2503, 2508, 2815, 2823
Total Applications
3274
Issued Applications
2860
Pending Applications
49
Abandoned Applications
366

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6508225 [patent_doc_number] => 20100219532 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-02 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/160387 [patent_app_country] => US [patent_app_date] => 2007-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5040 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0219/20100219532.pdf [firstpage_image] =>[orig_patent_app_number] => 12160387 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/160387
SEMICONDUCTOR DEVICE Dec 20, 2007 Abandoned
Array ( [id] => 5499297 [patent_doc_number] => 20090159985 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-25 [patent_title] => 'INTEGRATED CIRCUIT SYSTEM WITH CONTACT INTEGRATION' [patent_app_type] => utility [patent_app_number] => 11/963254 [patent_app_country] => US [patent_app_date] => 2007-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3327 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0159/20090159985.pdf [firstpage_image] =>[orig_patent_app_number] => 11963254 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/963254
Integrated circuit system with contact integration Dec 20, 2007 Issued
Array ( [id] => 6301615 [patent_doc_number] => 20100068044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-03-18 [patent_title] => 'COMPRESSOR' [patent_app_type] => utility [patent_app_number] => 12/447985 [patent_app_country] => US [patent_app_date] => 2007-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6455 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0068/20100068044.pdf [firstpage_image] =>[orig_patent_app_number] => 12447985 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/447985
Compressor Dec 19, 2007 Issued
Array ( [id] => 4749224 [patent_doc_number] => 20080157295 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING' [patent_app_type] => utility [patent_app_number] => 11/961984 [patent_app_country] => US [patent_app_date] => 2007-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3703 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157295.pdf [firstpage_image] =>[orig_patent_app_number] => 11961984 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/961984
METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING Dec 19, 2007 Abandoned
Array ( [id] => 5501021 [patent_doc_number] => 20090161709 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-25 [patent_title] => 'MULTICHIP PACKAGE, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/960903 [patent_app_country] => US [patent_app_date] => 2007-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4664 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0161/20090161709.pdf [firstpage_image] =>[orig_patent_app_number] => 11960903 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/960903
Multichip package, methods of manufacture thereof and articles comprising the same Dec 19, 2007 Issued
Array ( [id] => 4870613 [patent_doc_number] => 20080197347 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-21 [patent_title] => 'Active organic semiconductor devices and methods for making the same' [patent_app_type] => utility [patent_app_number] => 12/002926 [patent_app_country] => US [patent_app_date] => 2007-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 8982 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20080197347.pdf [firstpage_image] =>[orig_patent_app_number] => 12002926 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/002926
Active organic semiconductor devices and methods for making the same Dec 18, 2007 Issued
Array ( [id] => 113930 [patent_doc_number] => 07714454 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-11 [patent_title] => 'Chip module and method for producing a chip module' [patent_app_type] => utility [patent_app_number] => 11/959973 [patent_app_country] => US [patent_app_date] => 2007-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 3992 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/714/07714454.pdf [firstpage_image] =>[orig_patent_app_number] => 11959973 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/959973
Chip module and method for producing a chip module Dec 18, 2007 Issued
Array ( [id] => 4876779 [patent_doc_number] => 20080150162 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/958943 [patent_app_country] => US [patent_app_date] => 2007-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5807 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20080150162.pdf [firstpage_image] =>[orig_patent_app_number] => 11958943 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/958943
SEMICONDUCTOR DEVICE Dec 17, 2007 Abandoned
Array ( [id] => 4634423 [patent_doc_number] => 08012874 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-06 [patent_title] => 'Semiconductor chip substrate with multi-capacitor footprint' [patent_app_type] => utility [patent_app_number] => 11/956434 [patent_app_country] => US [patent_app_date] => 2007-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 4919 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/012/08012874.pdf [firstpage_image] =>[orig_patent_app_number] => 11956434 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/956434
Semiconductor chip substrate with multi-capacitor footprint Dec 13, 2007 Issued
Array ( [id] => 211906 [patent_doc_number] => 07622812 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-11-24 [patent_title] => 'Semiconductor module' [patent_app_type] => utility [patent_app_number] => 11/955504 [patent_app_country] => US [patent_app_date] => 2007-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 4442 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/622/07622812.pdf [firstpage_image] =>[orig_patent_app_number] => 11955504 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/955504
Semiconductor module Dec 12, 2007 Issued
Array ( [id] => 4715335 [patent_doc_number] => 20080237857 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 12/000245 [patent_app_country] => US [patent_app_date] => 2007-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 3386 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 20 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0237/20080237857.pdf [firstpage_image] =>[orig_patent_app_number] => 12000245 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/000245
Semiconductor package Dec 10, 2007 Abandoned
Array ( [id] => 4532537 [patent_doc_number] => 07923819 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-12 [patent_title] => 'Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/514173 [patent_app_country] => US [patent_app_date] => 2007-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 21 [patent_no_of_words] => 8172 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/923/07923819.pdf [firstpage_image] =>[orig_patent_app_number] => 12514173 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/514173
Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the same Nov 7, 2007 Issued
Array ( [id] => 9869740 [patent_doc_number] => 08957515 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-17 [patent_title] => 'Integrated circuit package system with array of external interconnects' [patent_app_type] => utility [patent_app_number] => 11/936516 [patent_app_country] => US [patent_app_date] => 2007-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4484 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11936516 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/936516
Integrated circuit package system with array of external interconnects Nov 6, 2007 Issued
Array ( [id] => 4768804 [patent_doc_number] => 20080054460 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP' [patent_app_type] => utility [patent_app_number] => 11/934793 [patent_app_country] => US [patent_app_date] => 2007-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4518 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20080054460.pdf [firstpage_image] =>[orig_patent_app_number] => 11934793 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/934793
Structure of wafer level package with area bump Nov 4, 2007 Issued
Array ( [id] => 4749256 [patent_doc_number] => 20080157327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'PACKAGE ON PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 11/933703 [patent_app_country] => US [patent_app_date] => 2007-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3213 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157327.pdf [firstpage_image] =>[orig_patent_app_number] => 11933703 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/933703
PACKAGE ON PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD OF THE SAME Oct 31, 2007 Abandoned
Array ( [id] => 583119 [patent_doc_number] => 07445969 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-04 [patent_title] => 'Method of manufacturing a semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/926331 [patent_app_country] => US [patent_app_date] => 2007-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 37 [patent_no_of_words] => 11667 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 278 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/445/07445969.pdf [firstpage_image] =>[orig_patent_app_number] => 11926331 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/926331
Method of manufacturing a semiconductor device Oct 28, 2007 Issued
Array ( [id] => 4820799 [patent_doc_number] => 20080122069 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-29 [patent_title] => 'Heat sink' [patent_app_type] => utility [patent_app_number] => 11/976774 [patent_app_country] => US [patent_app_date] => 2007-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1184 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0122/20080122069.pdf [firstpage_image] =>[orig_patent_app_number] => 11976774 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/976774
Heat sink Oct 28, 2007 Abandoned
Array ( [id] => 8921461 [patent_doc_number] => 08487400 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-16 [patent_title] => 'High performance system-on-chip using post passivation process' [patent_app_type] => utility [patent_app_number] => 11/877649 [patent_app_country] => US [patent_app_date] => 2007-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 8911 [patent_no_of_claims] => 51 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11877649 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/877649
High performance system-on-chip using post passivation process Oct 22, 2007 Issued
Array ( [id] => 4685680 [patent_doc_number] => 20080029861 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-07 [patent_title] => 'MICRO CHIP-SCALE-PACKAGE SYSTEM' [patent_app_type] => utility [patent_app_number] => 11/869737 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3850 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20080029861.pdf [firstpage_image] =>[orig_patent_app_number] => 11869737 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/869737
Micro chip-scale-package system Oct 8, 2007 Issued
Array ( [id] => 6433234 [patent_doc_number] => 20100187682 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-29 [patent_title] => 'ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/442192 [patent_app_country] => US [patent_app_date] => 2007-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4240 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20100187682.pdf [firstpage_image] =>[orig_patent_app_number] => 12442192 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/442192
ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME Sep 20, 2007 Abandoned
Menu