Sherman Ng

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Array ( [id] => 18731315 [patent_doc_number] => 20230345623 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-26 [patent_title] => Efficient Wave Guide Transition Between Package and PCB Using Solder Wall [patent_app_type] => utility [patent_app_number] => 17/726426 [patent_app_country] => US [patent_app_date] => 2022-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9211 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17726426 [rel_patent_id] =>[rel_patent_doc_number] =>)

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Array ( [id] => 20189659 [patent_doc_number] => 12400782 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-26 [patent_title] => Structural arrangement for attachment of a standoff insulator to an air core reactor [patent_app_type] => utility [patent_app_number] => 17/718363 [patent_app_country] => US [patent_app_date] => 2022-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17718363 [rel_patent_id] =>[rel_patent_doc_number] =>)

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