Sikyin Ip

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Array ( [id] => 531589 [patent_doc_number] => 07172726 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-02-06 [patent_title] => 'Lead-free solder' [patent_app_type] => utility [patent_app_number] => 10/682305 [patent_app_country] => US [patent_app_date] => 2003-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3269 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/172/07172726.pdf [firstpage_image] =>[orig_patent_app_number] => 10682305 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7248786 [patent_doc_number] => 20040258556 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-23 [patent_title] => 'Lead-free solder alloys and methods of making same' [patent_app_type] => new [patent_app_number] => 10/678655 [patent_app_country] => US [patent_app_date] => 2003-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8035 [patent_no_of_claims] => 51 [patent_no_of_ind_claims] => 14 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0258/20040258556.pdf [firstpage_image] =>[orig_patent_app_number] => 10678655 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7269687 [patent_doc_number] => 20040058205 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-25 [patent_title] => 'Metal alloys forming passivating conductive oxides for durable electrical contact surfaces' [patent_app_type] => new [patent_app_number] => 10/674245 [patent_app_country] => US [patent_app_date] => 2003-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2684 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0058/20040058205.pdf [firstpage_image] =>[orig_patent_app_number] => 10674245 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7299253 [patent_doc_number] => 20040126269 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-01 [patent_title] => 'Solder for use on surfaces coated with nickel by electroless plating' [patent_app_type] => new [patent_app_number] => 10/668377 [patent_app_country] => US [patent_app_date] => 2003-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3944 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0126/20040126269.pdf [firstpage_image] =>[orig_patent_app_number] => 10668377 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7303112 [patent_doc_number] => 20040115089 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-17 [patent_title] => 'Weld-solder filler' [patent_app_type] => new [patent_app_number] => 10/670165 [patent_app_country] => US [patent_app_date] => 2003-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 617 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20040115089.pdf [firstpage_image] =>[orig_patent_app_number] => 10670165 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 400869 [patent_doc_number] => 07291232 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-11-06 [patent_title] => 'Process for high strength, high conductivity copper alloy of Cu-Ni-Si group' [patent_app_type] => utility [patent_app_number] => 10/668931 [patent_app_country] => US [patent_app_date] => 2003-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 1376 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/291/07291232.pdf [firstpage_image] =>[orig_patent_app_number] => 10668931 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5847115 [patent_doc_number] => 20060231173 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-10-19 [patent_title] => 'Magnesium alloy sheet and its production' [patent_app_type] => utility [patent_app_number] => 10/546471 [patent_app_country] => US [patent_app_date] => 2003-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4891 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0231/20060231173.pdf [firstpage_image] =>[orig_patent_app_number] => 10546471 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 883511 [patent_doc_number] => 07351372 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-01 [patent_title] => 'Copper base alloy and method for producing same' [patent_app_type] => utility [patent_app_number] => 10/667709 [patent_app_country] => US [patent_app_date] => 2003-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7755 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/351/07351372.pdf [firstpage_image] =>[orig_patent_app_number] => 10667709 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7280302 [patent_doc_number] => 20040062679 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-01 [patent_title] => 'Lead-free solder alloy' [patent_app_type] => new [patent_app_number] => 10/666129 [patent_app_country] => US [patent_app_date] => 2003-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2919 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20040062679.pdf [firstpage_image] =>[orig_patent_app_number] => 10666129 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 220502 [patent_doc_number] => 07608157 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-27 [patent_title] => 'Heat resistance copper alloy materials' [patent_app_type] => utility [patent_app_number] => 10/529804 [patent_app_country] => US [patent_app_date] => 2003-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12684 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/608/07608157.pdf [firstpage_image] =>[orig_patent_app_number] => 10529804 [rel_patent_id] =>[rel_patent_doc_number] =>)

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