Son Luu Mai

Array ( [id] => 19790100 [patent_doc_number] => 20250063779 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-20 [patent_title] => DEVICES AND METHODS FOR FORMING DEVICES WITH INNER SPACERS [patent_app_type] => utility [patent_app_number] => 18/449348 [patent_app_country] => US [patent_app_date] => 2023-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10283 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18449348 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18819874 [patent_doc_number] => 20230394214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => MEMORY CELL ARRAY CIRCUIT AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/448117 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19433 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18448117 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19733780 [patent_doc_number] => 12211782 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-28 [patent_title] => Semiconductor package dielectric susbtrate including a trench [patent_app_type] => utility [patent_app_number] => 18/232523 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 9103 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18232523 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18789415 [patent_doc_number] => 20230378077 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/230546 [patent_app_country] => US [patent_app_date] => 2023-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12235 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18230546 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19760076 [patent_doc_number] => 20250048641 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-06 [patent_title] => MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCKING DIELECTRIC AND TUNGSTEN NITRIDE BARRIER AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/229489 [patent_app_country] => US [patent_app_date] => 2023-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11695 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18229489 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18975251 [patent_doc_number] => 20240055343 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/363645 [patent_app_country] => US [patent_app_date] => 2023-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8492 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363645 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20467659 [patent_doc_number] => 12523695 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-13 [patent_title] => Semiconductor device including bonding pad [patent_app_type] => utility [patent_app_number] => 18/353894 [patent_app_country] => US [patent_app_date] => 2023-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4493 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353894 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19007932 [patent_doc_number] => 20240072003 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/221465 [patent_app_country] => US [patent_app_date] => 2023-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9078 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18221465 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18743601 [patent_doc_number] => 20230352589 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => SOURCE/DRAIN REGIONS OF FINFET DEVICES AND METHODS OF FORMING SAME [patent_app_type] => utility [patent_app_number] => 18/346511 [patent_app_country] => US [patent_app_date] => 2023-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8593 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346511 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20190155 [patent_doc_number] => 12401285 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-26 [patent_title] => Magnetically coupled galvanically isolated communication using lead frame [patent_app_type] => utility [patent_app_number] => 18/345259 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 4406 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18345259 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19858300 [patent_doc_number] => 12261151 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-25 [patent_title] => Integrated circuit packages [patent_app_type] => utility [patent_app_number] => 18/342749 [patent_app_country] => US [patent_app_date] => 2023-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 20 [patent_no_of_words] => 9460 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18342749 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20483975 [patent_doc_number] => 12532454 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-20 [patent_title] => Semiconductor device and method for fabricating the same [patent_app_type] => utility [patent_app_number] => 18/340032 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 59 [patent_no_of_words] => 4579 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340032 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19733874 [patent_doc_number] => 12211876 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-28 [patent_title] => Extra doped region for back-side deep trench isolation [patent_app_type] => utility [patent_app_number] => 18/336100 [patent_app_country] => US [patent_app_date] => 2023-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 5494 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18336100 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19146288 [patent_doc_number] => 20240145317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => SEMICONDUCTOR PACKAGES HAVING TEST PADS [patent_app_type] => utility [patent_app_number] => 18/210114 [patent_app_country] => US [patent_app_date] => 2023-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6469 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210114 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19414817 [patent_doc_number] => 12080654 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Flexible circuit board and chip package including same [patent_app_type] => utility [patent_app_number] => 18/197245 [patent_app_country] => US [patent_app_date] => 2023-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 37 [patent_no_of_words] => 24635 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18197245 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19306034 [patent_doc_number] => 20240234614 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-11 [patent_title] => ULTRAVIOLET SENSOR [patent_app_type] => utility [patent_app_number] => 18/561205 [patent_app_country] => US [patent_app_date] => 2023-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6436 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18561205 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19828741 [patent_doc_number] => 12249532 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-11 [patent_title] => Multi-level micro-device tethers [patent_app_type] => utility [patent_app_number] => 18/140427 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 34 [patent_no_of_words] => 9139 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18140427 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18601913 [patent_doc_number] => 20230276719 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => QUANTUM CHIP AND FABRICATION METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 18/308539 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7516 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308539 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19546530 [patent_doc_number] => 20240363566 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES [patent_app_type] => utility [patent_app_number] => 18/139896 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11546 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18139896 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18570621 [patent_doc_number] => 20230260958 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => Flip-Chip Package Assembly [patent_app_type] => utility [patent_app_number] => 18/306832 [patent_app_country] => US [patent_app_date] => 2023-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7746 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18306832 [rel_patent_id] =>[rel_patent_doc_number] =>)