Search

Sonya C. Harris

Examiner (ID: 12542)

Most Active Art Unit
3309
Art Unit(s)
3739, 3309, 3311, 3736
Total Applications
399
Issued Applications
311
Pending Applications
46
Abandoned Applications
42

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18631812 [patent_doc_number] => 20230290717 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => Structures With Deformable Conductors [patent_app_type] => utility [patent_app_number] => 18/114420 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8225 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18114420 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/114420
Structures with deformable conductors Feb 26, 2023 Issued
Array ( [id] => 20455972 [patent_doc_number] => 12519034 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-06 [patent_title] => Thermal management system for electronic device [patent_app_type] => utility [patent_app_number] => 18/113585 [patent_app_country] => US [patent_app_date] => 2023-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 25 [patent_no_of_words] => 2400 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18113585 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/113585
Thermal management system for electronic device Feb 22, 2023 Issued
Array ( [id] => 19176133 [patent_doc_number] => 20240162107 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => INTEGRATED HYBRID HEAT DISSIPATION SYSTEM THAT MAXIMIZES HEAT TRANSFER FROM HETEROGENEOUS INTEGRATION [patent_app_type] => utility [patent_app_number] => 18/113393 [patent_app_country] => US [patent_app_date] => 2023-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11560 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18113393 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/113393
INTEGRATED HYBRID HEAT DISSIPATION SYSTEM THAT MAXIMIZES HEAT TRANSFER FROM HETEROGENEOUS INTEGRATION Feb 22, 2023 Pending
Array ( [id] => 19392852 [patent_doc_number] => 20240282722 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => BALL GRID ARRAY RF PACKAGE CONFIGURATIONS [patent_app_type] => utility [patent_app_number] => 18/112494 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2259 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18112494 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/112494
BALL GRID ARRAY RF PACKAGE CONFIGURATIONS Feb 20, 2023 Pending
Array ( [id] => 18456360 [patent_doc_number] => 20230197642 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => CERAMIC SEMICONDUCTOR PACKAGE SEAL RINGS [patent_app_type] => utility [patent_app_number] => 18/172208 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4466 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18172208 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/172208
Ceramic semiconductor package seal rings Feb 20, 2023 Issued
Array ( [id] => 18913096 [patent_doc_number] => 11876084 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-16 [patent_title] => Power supply system [patent_app_type] => utility [patent_app_number] => 18/171686 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 43 [patent_no_of_words] => 12264 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18171686 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/171686
Power supply system Feb 20, 2023 Issued
Array ( [id] => 18585982 [patent_doc_number] => 20230268247 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS [patent_app_type] => utility [patent_app_number] => 18/171734 [patent_app_country] => US [patent_app_date] => 2023-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9084 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18171734 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/171734
HEAT TRANSFER FROM NON-GROUNDABLE ELECTRONIC COMPONENTS Feb 20, 2023 Pending
Array ( [id] => 19392845 [patent_doc_number] => 20240282715 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/111433 [patent_app_country] => US [patent_app_date] => 2023-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 39826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18111433 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/111433
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Feb 16, 2023 Pending
Array ( [id] => 19269408 [patent_doc_number] => 20240213112 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF [patent_app_type] => utility [patent_app_number] => 18/169212 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3787 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169212 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169212
Semiconductor packaging device and heat dissipation cover thereof Feb 14, 2023 Issued
Array ( [id] => 19138086 [patent_doc_number] => 11973062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => High density pillar interconnect conversion with stack to substrate connection [patent_app_type] => utility [patent_app_number] => 18/169735 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 33 [patent_no_of_words] => 8955 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169735 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169735
High density pillar interconnect conversion with stack to substrate connection Feb 14, 2023 Issued
Array ( [id] => 20496642 [patent_doc_number] => 12538533 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-27 [patent_title] => Semiconductor device structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/164177 [patent_app_country] => US [patent_app_date] => 2023-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 52 [patent_figures_cnt] => 52 [patent_no_of_words] => 5359 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18164177 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/164177
Semiconductor device structure and method for forming the same Feb 2, 2023 Issued
Array ( [id] => 19335566 [patent_doc_number] => 20240249996 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-25 [patent_title] => PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER [patent_app_type] => utility [patent_app_number] => 18/099949 [patent_app_country] => US [patent_app_date] => 2023-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5843 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18099949 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/099949
PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER Jan 21, 2023 Pending
Array ( [id] => 19063148 [patent_doc_number] => 11942399 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-26 [patent_title] => Semiconductor devices having a serial power system [patent_app_type] => utility [patent_app_number] => 18/098668 [patent_app_country] => US [patent_app_date] => 2023-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6786 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18098668 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/098668
Semiconductor devices having a serial power system Jan 17, 2023 Issued
Array ( [id] => 18857341 [patent_doc_number] => 11854936 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/155067 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 39 [patent_no_of_words] => 16142 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18155067 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/155067
Semiconductor device Jan 16, 2023 Issued
Array ( [id] => 18379723 [patent_doc_number] => 20230154812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module [patent_app_type] => utility [patent_app_number] => 18/154993 [patent_app_country] => US [patent_app_date] => 2023-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4216 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18154993 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/154993
Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module Jan 15, 2023 Issued
Array ( [id] => 18766958 [patent_doc_number] => 11817367 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Power module [patent_app_type] => utility [patent_app_number] => 18/096997 [patent_app_country] => US [patent_app_date] => 2023-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 4397 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18096997 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/096997
Power module Jan 12, 2023 Issued
Array ( [id] => 18900472 [patent_doc_number] => 20240015957 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/152979 [patent_app_country] => US [patent_app_date] => 2023-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9018 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152979 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152979
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Jan 10, 2023 Pending
Array ( [id] => 20416845 [patent_doc_number] => 12500139 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Package with heat dissipation structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/152463 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 26 [patent_no_of_words] => 6890 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152463 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152463
Package with heat dissipation structure and method for forming the same Jan 9, 2023 Issued
Array ( [id] => 20274941 [patent_doc_number] => 12444727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Semiconductor package structure and manufacturing method [patent_app_type] => utility [patent_app_number] => 18/152188 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3503 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152188 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152188
Semiconductor package structure and manufacturing method Jan 9, 2023 Issued
Array ( [id] => 18943488 [patent_doc_number] => 20240038627 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same [patent_app_type] => utility [patent_app_number] => 18/150853 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7731 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150853 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/150853
Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same Jan 5, 2023 Pending
Menu