Sonya C. Harris

Array ( [id] => 18905991 [patent_doc_number] => 20240021476 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => Transistor Contacts and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/151181 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13424 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151181 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18570522 [patent_doc_number] => 20230260859 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/149301 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7562 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149301 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20441592 [patent_doc_number] => 12512434 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-30 [patent_title] => Semiconductor package for stress isolation [patent_app_type] => utility [patent_app_number] => 18/090922 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 1031 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18090922 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18346660 [patent_doc_number] => 20230134770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS [patent_app_type] => utility [patent_app_number] => 18/090795 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14935 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 499 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18090795 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18821214 [patent_doc_number] => 20230395555 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => POWER MODULE [patent_app_type] => utility [patent_app_number] => 18/087951 [patent_app_country] => US [patent_app_date] => 2022-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12215 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18087951 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18555372 [patent_doc_number] => 20230253389 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => SEMICONDUCTOR PACKAGE ASSEMBLY [patent_app_type] => utility [patent_app_number] => 18/145211 [patent_app_country] => US [patent_app_date] => 2022-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9413 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -37 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18145211 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18774332 [patent_doc_number] => 20230369163 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => POWER MODULE PACKAGE [patent_app_type] => utility [patent_app_number] => 18/069944 [patent_app_country] => US [patent_app_date] => 2022-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5680 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18069944 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20175965 [patent_doc_number] => 12394721 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-19 [patent_title] => Package structure including at least two electronic components [patent_app_type] => utility [patent_app_number] => 18/084676 [patent_app_country] => US [patent_app_date] => 2022-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4529 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18084676 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19183795 [patent_doc_number] => 11990396 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Substrate and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/068032 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 14245 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18068032 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19252825 [patent_doc_number] => 20240203822 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-20 [patent_title] => THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING [patent_app_type] => utility [patent_app_number] => 18/083554 [patent_app_country] => US [patent_app_date] => 2022-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6675 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18083554 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18310684 [patent_doc_number] => 20230114584 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-13 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/080674 [patent_app_country] => US [patent_app_date] => 2022-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8331 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18080674 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20161352 [patent_doc_number] => 12387987 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-12 [patent_title] => Housing, semiconductor module comprising a housing and method for producing a housing [patent_app_type] => utility [patent_app_number] => 18/075892 [patent_app_country] => US [patent_app_date] => 2022-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 0 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 193 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18075892 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20455960 [patent_doc_number] => 12519022 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-06 [patent_title] => Packaging structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/073108 [patent_app_country] => US [patent_app_date] => 2022-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 2294 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18073108 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19206198 [patent_doc_number] => 20240178097 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => PERMANENT LAYER FOR BUMP CHIP ATTACH [patent_app_type] => utility [patent_app_number] => 18/071961 [patent_app_country] => US [patent_app_date] => 2022-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3980 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18071961 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18267553 [patent_doc_number] => 20230088795 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => ELECTRO-MIGRATION BARRIER FOR INTERCONNECT [patent_app_type] => utility [patent_app_number] => 17/994494 [patent_app_country] => US [patent_app_date] => 2022-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3184 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17994494 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18269036 [patent_doc_number] => 20230090278 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS [patent_app_type] => utility [patent_app_number] => 17/992766 [patent_app_country] => US [patent_app_date] => 2022-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8530 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17992766 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19046721 [patent_doc_number] => 11935841 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Semiconductor package structure and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/990645 [patent_app_country] => US [patent_app_date] => 2022-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 27 [patent_no_of_words] => 7749 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17990645 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19176181 [patent_doc_number] => 20240162155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK [patent_app_type] => utility [patent_app_number] => 17/988642 [patent_app_country] => US [patent_app_date] => 2022-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 23075 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -27 [patent_words_short_claim] => 211 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17988642 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20484260 [patent_doc_number] => 12532741 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-20 [patent_title] => Semiconductor devices and methods of manufacturing semiconductor devices [patent_app_type] => utility [patent_app_number] => 17/985476 [patent_app_country] => US [patent_app_date] => 2022-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 30 [patent_no_of_words] => 4590 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17985476 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18473130 [patent_doc_number] => 20230207418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 18/054299 [patent_app_country] => US [patent_app_date] => 2022-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2439 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054299 [rel_patent_id] =>[rel_patent_doc_number] =>)