Search

Sonya C. Harris

Examiner (ID: 12542)

Most Active Art Unit
3309
Art Unit(s)
3739, 3309, 3311, 3736
Total Applications
399
Issued Applications
311
Pending Applications
46
Abandoned Applications
42

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18362464 [patent_doc_number] => 20230144055 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => HEAT SINKING BY THRU-MOLD VIAS IN SHIELDED MODULES [patent_app_type] => utility [patent_app_number] => 17/985101 [patent_app_country] => US [patent_app_date] => 2022-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9179 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 268 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17985101 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/985101
Heat sinking by thru-mold vias in shielded modules Nov 9, 2022 Issued
Array ( [id] => 18308329 [patent_doc_number] => 20230112229 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-13 [patent_title] => SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/053957 [patent_app_country] => US [patent_app_date] => 2022-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10577 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18053957 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/053957
Semiconductor structure Nov 8, 2022 Issued
Array ( [id] => 19123549 [patent_doc_number] => 11967543 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-23 [patent_title] => Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold [patent_app_type] => utility [patent_app_number] => 18/052456 [patent_app_country] => US [patent_app_date] => 2022-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 75 [patent_figures_cnt] => 103 [patent_no_of_words] => 19545 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18052456 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/052456
Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold Nov 2, 2022 Issued
Array ( [id] => 18821324 [patent_doc_number] => 20230395665 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SUPERLATTICE STRUCTURE INCLUDING TWO-DIMENSIONAL MATERIAL AND DEVICE INCLUDING THE SUPERLATTICE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/052017 [patent_app_country] => US [patent_app_date] => 2022-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7337 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18052017 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/052017
Superlattice structure including two-dimensional material and device including the superlattice structure Nov 1, 2022 Issued
Array ( [id] => 18696396 [patent_doc_number] => 20230326834 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => BUSBAR WITH DIELECTRIC COATING [patent_app_type] => utility [patent_app_number] => 17/976943 [patent_app_country] => US [patent_app_date] => 2022-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5694 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17976943 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/976943
Busbar with dielectric coating Oct 30, 2022 Issued
Array ( [id] => 18179587 [patent_doc_number] => 20230040316 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-09 [patent_title] => SEMICONDUCTOR DEVICE AND POWER CONVERTER [patent_app_type] => utility [patent_app_number] => 17/976370 [patent_app_country] => US [patent_app_date] => 2022-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18454 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 223 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17976370 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/976370
SEMICONDUCTOR DEVICE AND POWER CONVERTER Oct 27, 2022 Pending
Array ( [id] => 18473115 [patent_doc_number] => 20230207403 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => METHODS AND APPARATUS FOR USING EPOXY-BASED OR INK-BASED SPACER TO SUPPORT LARGE DIE IN SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/975557 [patent_app_country] => US [patent_app_date] => 2022-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17975557 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/975557
METHODS AND APPARATUS FOR USING EPOXY-BASED OR INK-BASED SPACER TO SUPPORT LARGE DIE IN SEMICONDUCTOR DEVICES Oct 26, 2022 Pending
Array ( [id] => 18473246 [patent_doc_number] => 20230207534 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS [patent_app_type] => utility [patent_app_number] => 18/048348 [patent_app_country] => US [patent_app_date] => 2022-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5311 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18048348 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/048348
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS Oct 19, 2022 Pending
Array ( [id] => 20132290 [patent_doc_number] => 12374608 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-29 [patent_title] => Hybrid chip carrier package [patent_app_type] => utility [patent_app_number] => 17/965583 [patent_app_country] => US [patent_app_date] => 2022-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 1041 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17965583 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/965583
Hybrid chip carrier package Oct 12, 2022 Issued
Array ( [id] => 18164608 [patent_doc_number] => 20230031204 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-02 [patent_title] => RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL [patent_app_type] => utility [patent_app_number] => 17/963149 [patent_app_country] => US [patent_app_date] => 2022-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7146 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17963149 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/963149
Resonant inductive-capacitive isolated data channel Oct 9, 2022 Issued
Array ( [id] => 18394828 [patent_doc_number] => 20230163049 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/936447 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3209 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17936447 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/936447
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Sep 28, 2022 Pending
Array ( [id] => 20161426 [patent_doc_number] => 12388062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-12 [patent_title] => Electronic package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/956653 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 0 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17956653 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/956653
Electronic package and manufacturing method thereof Sep 28, 2022 Issued
Array ( [id] => 18146832 [patent_doc_number] => 20230020689 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS [patent_app_type] => utility [patent_app_number] => 17/935019 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5532 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17935019 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/935019
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS Sep 22, 2022 Pending
Array ( [id] => 18943546 [patent_doc_number] => 20240038685 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/950914 [patent_app_country] => US [patent_app_date] => 2022-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4998 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17950914 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/950914
Electronic package and manufacturing method thereof Sep 21, 2022 Issued
Array ( [id] => 18285278 [patent_doc_number] => 20230100750 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => HEAT DISSIPATING ELEMENT [patent_app_type] => utility [patent_app_number] => 17/945638 [patent_app_country] => US [patent_app_date] => 2022-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4781 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17945638 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/945638
Heat dissipating element Sep 14, 2022 Issued
Array ( [id] => 18623818 [patent_doc_number] => 11756874 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-12 [patent_title] => Electronic device comprising a chip and at least one SMT electronic component [patent_app_type] => utility [patent_app_number] => 17/945822 [patent_app_country] => US [patent_app_date] => 2022-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2559 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17945822 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/945822
Electronic device comprising a chip and at least one SMT electronic component Sep 14, 2022 Issued
Array ( [id] => 18865954 [patent_doc_number] => 20230420391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/944453 [patent_app_country] => US [patent_app_date] => 2022-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5353 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 211 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17944453 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/944453
Electronic package and manufacturing method thereof Sep 13, 2022 Issued
Array ( [id] => 20496916 [patent_doc_number] => 12538810 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-27 [patent_title] => Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die [patent_app_type] => utility [patent_app_number] => 17/944657 [patent_app_country] => US [patent_app_date] => 2022-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 0 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17944657 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/944657
Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die Sep 13, 2022 Issued
Array ( [id] => 18250345 [patent_doc_number] => 20230077384 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => Power Semiconductor Modules [patent_app_type] => utility [patent_app_number] => 17/942317 [patent_app_country] => US [patent_app_date] => 2022-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6821 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17942317 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/942317
Power semiconductor modules Sep 11, 2022 Issued
Array ( [id] => 20307096 [patent_doc_number] => 12453107 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-21 [patent_title] => Semiconductor device and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 17/901386 [patent_app_country] => US [patent_app_date] => 2022-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 2340 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17901386 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/901386
Semiconductor device and semiconductor package including the same Aug 31, 2022 Issued
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