Search

Sonya C. Harris

Examiner (ID: 12542)

Most Active Art Unit
3309
Art Unit(s)
3739, 3309, 3311, 3736
Total Applications
399
Issued Applications
311
Pending Applications
46
Abandoned Applications
42

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20118394 [patent_doc_number] => 12368112 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-22 [patent_title] => Electronic component and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/901784 [patent_app_country] => US [patent_app_date] => 2022-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 0 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17901784 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/901784
Electronic component and manufacturing method thereof Aug 31, 2022 Issued
Array ( [id] => 19007821 [patent_doc_number] => 20240071892 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS [patent_app_type] => utility [patent_app_number] => 17/900446 [patent_app_country] => US [patent_app_date] => 2022-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7168 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17900446 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/900446
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS Aug 30, 2022 Pending
Array ( [id] => 20496941 [patent_doc_number] => 12538835 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-27 [patent_title] => Integrated chip package including a crack-resistant lid structure and methods of forming the same [patent_app_type] => utility [patent_app_number] => 17/898834 [patent_app_country] => US [patent_app_date] => 2022-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 37 [patent_figures_cnt] => 39 [patent_no_of_words] => 8809 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17898834 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/898834
Integrated chip package including a crack-resistant lid structure and methods of forming the same Aug 29, 2022 Issued
Array ( [id] => 19007876 [patent_doc_number] => 20240071947 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD [patent_app_type] => utility [patent_app_number] => 17/823157 [patent_app_country] => US [patent_app_date] => 2022-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16018 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17823157 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/823157
SEMICONDUCTOR PACKAGE AND METHOD Aug 29, 2022 Issued
Array ( [id] => 19524014 [patent_doc_number] => 12125754 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Sensor package substrate, sensor module including the same, and electronic component embedded substrate [patent_app_type] => utility [patent_app_number] => 17/894584 [patent_app_country] => US [patent_app_date] => 2022-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 6624 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17894584 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/894584
Sensor package substrate, sensor module including the same, and electronic component embedded substrate Aug 23, 2022 Issued
Array ( [id] => 18827664 [patent_doc_number] => 11842954 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-12 [patent_title] => Method of manufacturing semiconductor devices and corresponding semiconductor device [patent_app_type] => utility [patent_app_number] => 17/887838 [patent_app_country] => US [patent_app_date] => 2022-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 17 [patent_no_of_words] => 3164 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17887838 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/887838
Method of manufacturing semiconductor devices and corresponding semiconductor device Aug 14, 2022 Issued
Array ( [id] => 19277301 [patent_doc_number] => 12027433 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Semiconductor package and method for making the same [patent_app_type] => utility [patent_app_number] => 17/885401 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 24 [patent_no_of_words] => 7405 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17885401 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/885401
Semiconductor package and method for making the same Aug 9, 2022 Issued
Array ( [id] => 18663260 [patent_doc_number] => 20230309286 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 17/882725 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8452 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17882725 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/882725
Memory device and manufacturing method therefor Aug 7, 2022 Issued
Array ( [id] => 18593368 [patent_doc_number] => 11742280 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-29 [patent_title] => Integrated circuits with backside power rails [patent_app_type] => utility [patent_app_number] => 17/860253 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 68 [patent_no_of_words] => 12512 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860253 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860253
Integrated circuits with backside power rails Jul 7, 2022 Issued
Array ( [id] => 18882967 [patent_doc_number] => 20240006336 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE [patent_app_type] => utility [patent_app_number] => 17/852816 [patent_app_country] => US [patent_app_date] => 2022-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7739 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17852816 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/852816
SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE Jun 28, 2022 Pending
Array ( [id] => 18112950 [patent_doc_number] => 20230005830 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR APPARATUS [patent_app_type] => utility [patent_app_number] => 17/809086 [patent_app_country] => US [patent_app_date] => 2022-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4795 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 377 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17809086 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/809086
Semiconductor apparatus Jun 26, 2022 Issued
Array ( [id] => 17917552 [patent_doc_number] => 20220319948 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => DOUBLE-SIDED COOLABLE SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/844455 [patent_app_country] => US [patent_app_date] => 2022-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7993 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 233 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17844455 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/844455
Double-sided coolable semiconductor package Jun 19, 2022 Issued
Array ( [id] => 20276553 [patent_doc_number] => 12446342 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Imaging element and imaging apparatus [patent_app_type] => utility [patent_app_number] => 17/842570 [patent_app_country] => US [patent_app_date] => 2022-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2343 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17842570 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/842570
Imaging element and imaging apparatus Jun 15, 2022 Issued
Array ( [id] => 18669955 [patent_doc_number] => 11776867 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-03 [patent_title] => Chip package [patent_app_type] => utility [patent_app_number] => 17/839500 [patent_app_country] => US [patent_app_date] => 2022-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 7686 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17839500 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/839500
Chip package Jun 13, 2022 Issued
Array ( [id] => 20360215 [patent_doc_number] => 12476221 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Fabrication method of stacked device and stacked device [patent_app_type] => utility [patent_app_number] => 17/838295 [patent_app_country] => US [patent_app_date] => 2022-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 2105 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17838295 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/838295
Fabrication method of stacked device and stacked device Jun 12, 2022 Issued
Array ( [id] => 17886494 [patent_doc_number] => 20220301972 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => PACKAGE WITH THERMAL INTERFACE MATERIAL RETAINING STRUCTURES ON DIE AND HEAT SPREADER [patent_app_type] => utility [patent_app_number] => 17/834753 [patent_app_country] => US [patent_app_date] => 2022-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 21160 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17834753 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/834753
Package with thermal interface material retaining structures on die and heat spreader Jun 6, 2022 Issued
Array ( [id] => 17886569 [patent_doc_number] => 20220302047 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => ADVANCED SEAL RING STRUCTURE AND METHOD OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 17/833120 [patent_app_country] => US [patent_app_date] => 2022-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8240 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17833120 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/833120
Advanced seal ring structure and method of making the same Jun 5, 2022 Issued
Array ( [id] => 19830024 [patent_doc_number] => 12250831 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-11 [patent_title] => Semiconductor device and method of manufacturing the same, and electronic apparatus including semiconductor device [patent_app_type] => utility [patent_app_number] => 17/805575 [patent_app_country] => US [patent_app_date] => 2022-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 26 [patent_no_of_words] => 9267 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17805575 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/805575
Semiconductor device and method of manufacturing the same, and electronic apparatus including semiconductor device Jun 5, 2022 Issued
Array ( [id] => 17855128 [patent_doc_number] => 20220285171 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-08 [patent_title] => Integrated Circuit Package Pad and Methods of Forming [patent_app_type] => utility [patent_app_number] => 17/664458 [patent_app_country] => US [patent_app_date] => 2022-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8398 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17664458 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/664458
Integrated circuit package pad and methods of forming May 22, 2022 Issued
Array ( [id] => 18144491 [patent_doc_number] => 20230018343 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => Package Assembly Including Lid With Additional Stress Mitigating Feet And Methods Of Making The Same [patent_app_type] => utility [patent_app_number] => 17/748335 [patent_app_country] => US [patent_app_date] => 2022-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17748335 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/748335
Package assembly including lid with additional stress mitigating feet and methods of making the same May 18, 2022 Issued
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