
Sonya N. Wright
Examiner (ID: 6088, Phone: (571)272-5857 , Office: P/1672 )
| Most Active Art Unit | 1629 |
| Art Unit(s) | 1629, 1796, 1613, 1621, 1672, 1614, 1762, 1626 |
| Total Applications | 765 |
| Issued Applications | 560 |
| Pending Applications | 32 |
| Abandoned Applications | 177 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6921576
[patent_doc_number] => 20010029061
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-10-11
[patent_title] => 'Insulator/metal bonding island for active-area silver epoxy bonding'
[patent_app_type] => new
[patent_app_number] => 09/818192
[patent_app_country] => US
[patent_app_date] => 2001-03-26
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[pdf_file] => publications/A1/0029/20010029061.pdf
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Array
(
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[patent_issue_date] => 2001-10-04
[patent_title] => 'Semiconductor device having reliable electrical connection'
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Array
(
[id] => 1574689
[patent_doc_number] => 06468871
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-22
[patent_title] => 'Method of forming bipolar transistor salicided emitter using selective laser annealing'
[patent_app_type] => B1
[patent_app_number] => 09/816824
[patent_app_country] => US
[patent_app_date] => 2001-03-23
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[patent_drawing_sheets_cnt] => 1
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Array
(
[id] => 1528016
[patent_doc_number] => 06479327
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-11-12
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => B2
[patent_app_number] => 09/812592
[patent_app_country] => US
[patent_app_date] => 2001-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 34
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/812592 | Semiconductor device and method for manufacturing the same | Mar 20, 2001 | Issued |
| 09/787661 | Method for producing an amorphous or polycrystalline layer on an insulaitng region | Mar 20, 2001 | Abandoned |
Array
(
[id] => 7093174
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Array
(
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Array
(
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[patent_title] => 'Method of producing a bonded wafer and the bonded wafer'
[patent_app_type] => B1
[patent_app_number] => 09/787038
[patent_app_country] => US
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Array
(
[id] => 1469741
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[patent_issue_date] => 2002-06-18
[patent_title] => 'Flip chip type semiconductor device and method for manufacturing the same'
[patent_app_type] => B2
[patent_app_number] => 09/801901
[patent_app_country] => US
[patent_app_date] => 2001-03-09
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Array
(
[id] => 6434931
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/786511 | Method of processing wafer | Mar 5, 2001 | Abandoned |
Array
(
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[patent_title] => 'Method for improving adhesion'
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Array
(
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[patent_title] => 'Method of forming tunnel oxide film for superconducting X-ray sensor element'
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Array
(
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Array
(
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Array
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Array
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Array
(
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Array
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Array
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