
Stanley Tso
Examiner (ID: 8874, Phone: (571)270-0723 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | RD00, 2847 |
| Total Applications | 802 |
| Issued Applications | 592 |
| Pending Applications | 99 |
| Abandoned Applications | 132 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18334899
[patent_doc_number] => 20230126847
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-27
[patent_title] => LENS MODULE AND ELECTRONIC DEVICE HAVING THE LENS MODULE
[patent_app_type] => utility
[patent_app_number] => 17/562303
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Array
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[patent_issue_date] => 2025-06-10
[patent_title] => Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof
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Array
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[patent_title] => Multilayer capacitor and board having the same mounted thereon
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Array
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[patent_title] => MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
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Array
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Array
(
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[patent_title] => Light source support assembly
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Array
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Array
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[patent_title] => BOARDS HAVING SOLDERLESS INTERCONNECTS
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/543032 | Boards having solderless interconnects | Dec 5, 2021 | Issued |
Array
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[id] => 20343214
[patent_doc_number] => 12466936
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[patent_issue_date] => 2025-11-11
[patent_title] => Resin composition for semiconductor package, resin coated copper, and circuit board comprising same
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Array
(
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Array
(
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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