Search

Steven T. Sawyer

Examiner (ID: 16766, Phone: (571)270-5469 , Office: P/2847 )

Most Active Art Unit
2847
Art Unit(s)
2835, 2841, 2847
Total Applications
1157
Issued Applications
775
Pending Applications
93
Abandoned Applications
316

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19024819 [patent_doc_number] => 20240080990 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING BOARD [patent_app_type] => utility [patent_app_number] => 18/269104 [patent_app_country] => US [patent_app_date] => 2021-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6869 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18269104 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/269104
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING BOARD Dec 9, 2021 Pending
Array ( [id] => 18373255 [patent_doc_number] => 11653447 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-16 [patent_title] => Ceramic copper circuit board and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/546583 [patent_app_country] => US [patent_app_date] => 2021-12-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 10887 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17546583 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/546583
Ceramic copper circuit board and method for manufacturing the same Dec 8, 2021 Issued
Array ( [id] => 18961056 [patent_doc_number] => 20240049383 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => CONNECTION CARRIER, OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING A CONNECTION CARRIER [patent_app_type] => utility [patent_app_number] => 18/267051 [patent_app_country] => US [patent_app_date] => 2021-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8314 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18267051 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/267051
CONNECTION CARRIER, OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING A CONNECTION CARRIER Dec 7, 2021 Pending
Array ( [id] => 20540129 [patent_doc_number] => 12557216 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-02-17 [patent_title] => Type-3 printed circuit boards (PCBS) with hybrid layer counts [patent_app_type] => utility [patent_app_number] => 17/543311 [patent_app_country] => US [patent_app_date] => 2021-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 0 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17543311 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/543311
Type-3 printed circuit boards (PCBS) with hybrid layer counts Dec 5, 2021 Issued
Array ( [id] => 17782184 [patent_doc_number] => 20220248534 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => FLEXIBLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/539549 [patent_app_country] => US [patent_app_date] => 2021-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8856 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17539549 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/539549
Flexible display module and manufacturing method thereof Nov 30, 2021 Issued
Array ( [id] => 19000874 [patent_doc_number] => 11917751 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-27 [patent_title] => Multilayer wiring board and method of producing the same [patent_app_type] => utility [patent_app_number] => 17/534936 [patent_app_country] => US [patent_app_date] => 2021-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 21 [patent_no_of_words] => 7680 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 228 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17534936 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/534936
Multilayer wiring board and method of producing the same Nov 23, 2021 Issued
Array ( [id] => 18972099 [patent_doc_number] => 20240052191 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => Electronic Telecommunications Articles Comprising Crosslinked Fluoropolymer and Fluoropolymer Particles, Compositions and Methods [patent_app_type] => utility [patent_app_number] => 18/266619 [patent_app_country] => US [patent_app_date] => 2021-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20322 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18266619 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/266619
Electronic Telecommunications Articles Comprising Crosslinked Fluoropolymer and Fluoropolymer Particles, Compositions and Methods Nov 23, 2021 Pending
Array ( [id] => 18403656 [patent_doc_number] => 11665815 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-30 [patent_title] => Lens module of reduced size and electronic device [patent_app_type] => utility [patent_app_number] => 17/530695 [patent_app_country] => US [patent_app_date] => 2021-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2082 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17530695 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/530695
Lens module of reduced size and electronic device Nov 18, 2021 Issued
Array ( [id] => 17433438 [patent_doc_number] => 20220061148 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-24 [patent_title] => Heat removal from silicon photonics chip using a recessed side-by-side thermal dissipation layout [patent_app_type] => utility [patent_app_number] => 17/517693 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4346 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517693 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/517693
Heat removal from silicon photonics chip using a recessed side-by-side thermal dissipation layout Nov 2, 2021 Issued
Array ( [id] => 18867955 [patent_doc_number] => 20230422392 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => FILTER CIRCUIT [patent_app_type] => utility [patent_app_number] => 18/251388 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2016 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18251388 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/251388
Filter circuit Nov 2, 2021 Issued
Array ( [id] => 17583659 [patent_doc_number] => 20220140514 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => Flex Circuit And Electrical Communication Assemblies Related To Same [patent_app_type] => utility [patent_app_number] => 17/517395 [patent_app_country] => US [patent_app_date] => 2021-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 27187 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 13 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517395 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/517395
Flex circuit and electrical communication assemblies related to same Nov 1, 2021 Issued
Array ( [id] => 20004514 [patent_doc_number] => 20250142736 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-01 [patent_title] => Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure [patent_app_type] => utility [patent_app_number] => 18/692032 [patent_app_country] => US [patent_app_date] => 2021-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12036 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18692032 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/692032
Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure Oct 28, 2021 Pending
Array ( [id] => 18338129 [patent_doc_number] => 20230130078 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => SEMICONDUCTOR DEVICE WITH INTERFACE STRUCTURE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/508966 [patent_app_country] => US [patent_app_date] => 2021-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8196 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17508966 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/508966
Semiconductor device with interface structure and method for fabricating the same Oct 21, 2021 Issued
Array ( [id] => 17404702 [patent_doc_number] => 20220046793 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-10 [patent_title] => MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT [patent_app_type] => utility [patent_app_number] => 17/506923 [patent_app_country] => US [patent_app_date] => 2021-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6754 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17506923 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/506923
Multilayer resin substrate and electronic component Oct 20, 2021 Issued
Array ( [id] => 18595097 [patent_doc_number] => 11744019 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-29 [patent_title] => Component mounted on circuit board [patent_app_type] => utility [patent_app_number] => 17/505674 [patent_app_country] => US [patent_app_date] => 2021-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 28 [patent_no_of_words] => 7536 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 273 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17505674 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/505674
Component mounted on circuit board Oct 19, 2021 Issued
Array ( [id] => 19444342 [patent_doc_number] => 12094630 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-17 [patent_title] => Millimeter thick magnetic PCB with high relative permeability and devices thereof [patent_app_type] => utility [patent_app_number] => 17/503873 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 30 [patent_no_of_words] => 7761 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17503873 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/503873
Millimeter thick magnetic PCB with high relative permeability and devices thereof Oct 17, 2021 Issued
Array ( [id] => 18456958 [patent_doc_number] => 20230198240 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => WIRE HARNESS WALL-PASSING STRUCTURE AND INSTALLATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/774898 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3838 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17774898 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/774898
Wire harness wall-passing structure and installation method thereof Oct 17, 2021 Issued
Array ( [id] => 18883379 [patent_doc_number] => 20240006748 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/036372 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3757 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18036372 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/036372
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Oct 17, 2021 Pending
Array ( [id] => 18323708 [patent_doc_number] => 20230121836 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => SYSTEMS AND METHODS FOR BREAK OUT OF INTERCONNECTIONS FOR HIGH-DENSITY INTEGRATED CIRCUIT PACKAGES ON A MULTI-LAYER PRINTED CIRCUIT BOARD [patent_app_type] => utility [patent_app_number] => 17/503988 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3379 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17503988 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/503988
Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board Oct 17, 2021 Issued
Array ( [id] => 17645123 [patent_doc_number] => 20220172862 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => CONNECTING CABLE, CABLE CONNECTOR, CHARGER AND CHARGER ASSEMBLY WITH IMPROVED HEAT DISSIPATION STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/500393 [patent_app_country] => US [patent_app_date] => 2021-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3085 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17500393 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/500393
Connecting cable, cable connector, charger and charger assembly with improved heat dissipation structure Oct 12, 2021 Issued
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