
Sue Hagarman
Examiner (ID: 2208)
| Most Active Art Unit | 3406 |
| Art Unit(s) | 3406 |
| Total Applications | 337 |
| Issued Applications | 322 |
| Pending Applications | 0 |
| Abandoned Applications | 15 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4597200
[patent_doc_number] => 07982311
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-19
[patent_title] => 'Solder limiting layer for integrated circuit die copper bumps'
[patent_app_type] => utility
[patent_app_number] => 12/317227
[patent_app_country] => US
[patent_app_date] => 2008-12-19
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[pdf_file] => patents/07/982/07982311.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/317227 | Solder limiting layer for integrated circuit die copper bumps | Dec 18, 2008 | Issued |
Array
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[patent_doc_number] => 20090261387
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[patent_kind] => A1
[patent_issue_date] => 2009-10-22
[patent_title] => 'CMOS integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/314547 | CMOS integrated process for fabricating monocrystalline silicon micromechanical elements by porous silicon micromachining | Dec 11, 2008 | Issued |
Array
(
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[patent_doc_number] => 20100025827
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[patent_issue_date] => 2010-02-04
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/329987
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/329987 | Semiconductor device and method of fabricating the same | Dec 7, 2008 | Issued |
Array
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[patent_issue_date] => 2012-11-06
[patent_title] => 'Semiconductor package device, semiconductor package structure, and fabrication methods thereof'
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Array
(
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[patent_doc_number] => 20090152547
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[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME INTERPOSER AND METHOD OF MANUFACTURE THEREOF'
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Array
(
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[patent_title] => 'Method using multiple layer annealing cap for fabricating group III-nitride semiconductor device structures and devices formed thereby'
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Array
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[patent_title] => 'Semiconductor device and method of manufacturing semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/314067 | Semiconductor device and method of manufacturing semiconductor device | Dec 2, 2008 | Issued |
Array
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[id] => 7987747
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[patent_issue_date] => 2011-12-13
[patent_title] => 'Light-emitting device and method for producing light emitting device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/326538 | Light-emitting device and method for producing light emitting device | Dec 1, 2008 | Issued |
Array
(
[id] => 5575543
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[patent_title] => 'METHOD FOR MANUFACTURING SOI SUBSTRATE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/325488 | Method for manufacturing SOI substrate | Nov 30, 2008 | Issued |
Array
(
[id] => 5575571
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[patent_title] => 'MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/324578 | Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device | Nov 25, 2008 | Issued |
Array
(
[id] => 6582971
[patent_doc_number] => 20100129957
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[patent_issue_date] => 2010-05-27
[patent_title] => 'THIN-FILM PHOTOVOLTAIC DEVICES'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/323357 | Thin-film photovoltaic devices | Nov 24, 2008 | Issued |
Array
(
[id] => 4451179
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[patent_title] => 'Multilayered through via'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/277408 | Multilayered through via | Nov 24, 2008 | Issued |
Array
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Array
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Array
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Array
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Array
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Array
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