Search

Sun Jae Yoo

Examiner (ID: 5581, Phone: (571)272-9074 , Office: P/1626 )

Most Active Art Unit
1626
Art Unit(s)
1626, 1621, 1609, 1622
Total Applications
1919
Issued Applications
1171
Pending Applications
215
Abandoned Applications
564

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20410008 [patent_doc_number] => 20250379117 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-12-11 [patent_title] => SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE [patent_app_type] => utility [patent_app_number] => 19/308894 [patent_app_country] => US [patent_app_date] => 2025-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4483 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19308894 [rel_patent_id] =>[rel_patent_doc_number] =>)
19/308894
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE Aug 24, 2025 Pending
Array ( [id] => 20441545 [patent_doc_number] => 12512387 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-30 [patent_title] => Semiconductor circuit structure with direct die heat removal structure [patent_app_type] => utility [patent_app_number] => 19/210377 [patent_app_country] => US [patent_app_date] => 2025-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 39 [patent_no_of_words] => 4483 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19210377 [rel_patent_id] =>[rel_patent_doc_number] =>)
19/210377
Semiconductor circuit structure with direct die heat removal structure May 15, 2025 Issued
Array ( [id] => 20146776 [patent_doc_number] => 12381123 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-05 [patent_title] => Semiconductor circuit structure with direct die heat removal structure [patent_app_type] => utility [patent_app_number] => 19/004132 [patent_app_country] => US [patent_app_date] => 2024-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 43 [patent_no_of_words] => 5616 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19004132 [rel_patent_id] =>[rel_patent_doc_number] =>)
19/004132
Semiconductor circuit structure with direct die heat removal structure Dec 26, 2024 Issued
Array ( [id] => 19548654 [patent_doc_number] => 20240365690 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => NOVEL PHASE CHANGE RANDOM ACCESS MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 18/770547 [patent_app_country] => US [patent_app_date] => 2024-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7206 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18770547 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/770547
Phase change random access memory device Jul 10, 2024 Issued
Array ( [id] => 20259023 [patent_doc_number] => 12431386 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-30 [patent_title] => Semiconductor device having metallization layer with low capacitance and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/764971 [patent_app_country] => US [patent_app_date] => 2024-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 2537 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18764971 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/764971
Semiconductor device having metallization layer with low capacitance and method for manufacturing the same Jul 4, 2024 Issued
Array ( [id] => 19515724 [patent_doc_number] => 20240347410 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-17 [patent_title] => CHIP PACKAGE STRUCTURE WITH LID [patent_app_type] => utility [patent_app_number] => 18/751724 [patent_app_country] => US [patent_app_date] => 2024-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8828 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18751724 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/751724
Chip package structure with lid Jun 23, 2024 Issued
Array ( [id] => 19452722 [patent_doc_number] => 20240312852 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-19 [patent_title] => MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/674930 [patent_app_country] => US [patent_app_date] => 2024-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7685 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18674930 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/674930
Manufacturing method of semiconductor package May 26, 2024 Issued
Array ( [id] => 19765924 [patent_doc_number] => 12224225 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-11 [patent_title] => Semiconductor circuit structure with direct die heat removal structure [patent_app_type] => utility [patent_app_number] => 18/674649 [patent_app_country] => US [patent_app_date] => 2024-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 39 [patent_no_of_words] => 9559 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18674649 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/674649
Semiconductor circuit structure with direct die heat removal structure May 23, 2024 Issued
Array ( [id] => 19561918 [patent_doc_number] => 20240373710 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-07 [patent_title] => ORGANIC ELECTROLUMINESCENT DEVICES [patent_app_type] => utility [patent_app_number] => 18/653329 [patent_app_country] => US [patent_app_date] => 2024-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10333 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18653329 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/653329
ORGANIC ELECTROLUMINESCENT DEVICES May 1, 2024 Pending
Array ( [id] => 19392787 [patent_doc_number] => 20240282657 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/652836 [patent_app_country] => US [patent_app_date] => 2024-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 39977 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18652836 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/652836
SEMICONDUCTOR DEVICE May 1, 2024 Pending
Array ( [id] => 20299541 [patent_doc_number] => 20250324784 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-10-16 [patent_title] => IMAGE SENSOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/636288 [patent_app_country] => US [patent_app_date] => 2024-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18636288 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/636288
IMAGE SENSOR STRUCTURE Apr 15, 2024 Pending
Array ( [id] => 20111520 [patent_doc_number] => 12362256 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-15 [patent_title] => Method for forming semiconductor package structure [patent_app_type] => utility [patent_app_number] => 18/631181 [patent_app_country] => US [patent_app_date] => 2024-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 1177 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18631181 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/631181
Method for forming semiconductor package structure Apr 9, 2024 Issued
Array ( [id] => 20297865 [patent_doc_number] => 20250323108 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-10-16 [patent_title] => SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN SUBSTRATE AND METHOD OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/631078 [patent_app_country] => US [patent_app_date] => 2024-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18631078 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/631078
SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN SUBSTRATE AND METHOD OF MAKING THE SAME Apr 9, 2024 Pending
Array ( [id] => 19852845 [patent_doc_number] => 20250098196 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-03-20 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/626549 [patent_app_country] => US [patent_app_date] => 2024-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3567 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18626549 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/626549
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Apr 3, 2024 Pending
Array ( [id] => 19900116 [patent_doc_number] => 12278050 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Chip ceramic electronic component and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/625324 [patent_app_country] => US [patent_app_date] => 2024-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1848 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 252 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18625324 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/625324
Chip ceramic electronic component and method for manufacturing the same Apr 2, 2024 Issued
Array ( [id] => 20118380 [patent_doc_number] => 12368098 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-22 [patent_title] => Methods of forming semiconductor device [patent_app_type] => utility [patent_app_number] => 18/616191 [patent_app_country] => US [patent_app_date] => 2024-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 34 [patent_no_of_words] => 7873 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18616191 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/616191
Methods of forming semiconductor device Mar 25, 2024 Issued
Array ( [id] => 19349421 [patent_doc_number] => 20240258385 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-01 [patent_title] => GALLIUM NITRIDE BIDIRECTIONAL SWITCH DEVICE [patent_app_type] => utility [patent_app_number] => 18/613276 [patent_app_country] => US [patent_app_date] => 2024-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11188 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18613276 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/613276
GALLIUM NITRIDE BIDIRECTIONAL SWITCH DEVICE Mar 21, 2024 Pending
Array ( [id] => 19468096 [patent_doc_number] => 20240321766 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME [patent_app_type] => utility [patent_app_number] => 18/611841 [patent_app_country] => US [patent_app_date] => 2024-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8962 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18611841 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/611841
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Mar 20, 2024 Pending
Array ( [id] => 19305665 [patent_doc_number] => 20240234245 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-11 [patent_title] => SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS [patent_app_type] => utility [patent_app_number] => 18/612949 [patent_app_country] => US [patent_app_date] => 2024-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6376 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18612949 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/612949
Semiconductor device stack-up with bulk substrate material to mitigate hot spots Mar 20, 2024 Issued
Array ( [id] => 20224756 [patent_doc_number] => 20250287687 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-09-11 [patent_title] => SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/597567 [patent_app_country] => US [patent_app_date] => 2024-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5744 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18597567 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/597567
SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME Mar 5, 2024 Pending
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