Search

Sun Jae Yoo

Examiner (ID: 5581, Phone: (571)272-9074 , Office: P/1626 )

Most Active Art Unit
1626
Art Unit(s)
1626, 1621, 1609, 1622
Total Applications
1919
Issued Applications
1171
Pending Applications
215
Abandoned Applications
564

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19342692 [patent_doc_number] => 12052899 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-30 [patent_title] => Organic light emitting diode display [patent_app_type] => utility [patent_app_number] => 18/318644 [patent_app_country] => US [patent_app_date] => 2023-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7902 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 325 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318644 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/318644
Organic light emitting diode display May 15, 2023 Issued
Array ( [id] => 20404251 [patent_doc_number] => 12494231 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Semiconductor device and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 18/195942 [patent_app_country] => US [patent_app_date] => 2023-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 0 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195942 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/195942
Semiconductor device and method of fabricating the same May 10, 2023 Issued
Array ( [id] => 18865926 [patent_doc_number] => 20230420363 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS AND ANGLED ROUTING TRACKS [patent_app_type] => utility [patent_app_number] => 18/314875 [patent_app_country] => US [patent_app_date] => 2023-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 28773 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18314875 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/314875
Integrated circuit devices with angled transistors and angled routing tracks May 9, 2023 Issued
Array ( [id] => 20793018 [patent_doc_number] => 12666952 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-23 [patent_title] => Method for manufacturing semiconductor device and semiconductor device [patent_app_type] => utility [patent_app_number] => 18/314844 [patent_app_country] => US [patent_app_date] => 2023-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 0 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18314844 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/314844
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE May 9, 2023 Issued
Array ( [id] => 20638091 [patent_doc_number] => 12598990 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-07 [patent_title] => Electrically isolated discrete package with high performance ceramic substrate [patent_app_type] => utility [patent_app_number] => 18/141118 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 0 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141118 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/141118
Electrically isolated discrete package with high performance ceramic substrate Apr 27, 2023 Issued
Array ( [id] => 19546311 [patent_doc_number] => 20240363347 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => METHOD FOR METAL PATTERNING [patent_app_type] => utility [patent_app_number] => 18/308117 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9094 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308117 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308117
METHOD FOR METAL PATTERNING Apr 26, 2023 Pending
Array ( [id] => 18585912 [patent_doc_number] => 20230268176 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH RESISTIVE ELEMENTS [patent_app_type] => utility [patent_app_number] => 18/307197 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6902 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18307197 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/307197
Method for manufacturing semiconductor structure with resistive elements Apr 25, 2023 Issued
Array ( [id] => 18570829 [patent_doc_number] => 20230261166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => METHOD OF MANUFACTURING LIGHT SOURCE DEVICE HAVING A BONDING LAYER WITH BUMPS AND A BONDING MEMBER [patent_app_type] => utility [patent_app_number] => 18/138397 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7945 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138397 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/138397
Method of manufacturing light source device having a bonding layer with bumps and a bonding member Apr 23, 2023 Issued
Array ( [id] => 20649723 [patent_doc_number] => 12604686 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-14 [patent_title] => Semiconductor chip and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 18/135927 [patent_app_country] => US [patent_app_date] => 2023-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 8758 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18135927 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/135927
Semiconductor chip and semiconductor package including the same Apr 17, 2023 Issued
Array ( [id] => 20267082 [patent_doc_number] => 12438081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-07 [patent_title] => Semiconductor structure having dielectric liner and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/131462 [patent_app_country] => US [patent_app_date] => 2023-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 29 [patent_no_of_words] => 5361 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18131462 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/131462
Semiconductor structure having dielectric liner and method of manufacturing the same Apr 5, 2023 Issued
Array ( [id] => 20776918 [patent_doc_number] => 12660616 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-16 [patent_title] => Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly [patent_app_type] => utility [patent_app_number] => 18/193932 [patent_app_country] => US [patent_app_date] => 2023-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 23 [patent_no_of_words] => 3232 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18193932 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/193932
Lid structure with openings to alleviate leakage of thermal interface material of a chip assembly Mar 30, 2023 Issued
Array ( [id] => 19228178 [patent_doc_number] => 12007813 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Semiconductor device for attaching to a flexible display [patent_app_type] => utility [patent_app_number] => 18/193624 [patent_app_country] => US [patent_app_date] => 2023-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 5640 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18193624 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/193624
Semiconductor device for attaching to a flexible display Mar 29, 2023 Issued
Array ( [id] => 19101029 [patent_doc_number] => 20240120257 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-11 [patent_title] => Layer-By-Layer Formation Of Through-Substrate Via [patent_app_type] => utility [patent_app_number] => 18/192799 [patent_app_country] => US [patent_app_date] => 2023-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12703 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18192799 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/192799
Layer-By-Layer Formation Of Through-Substrate Via Mar 29, 2023 Pending
Array ( [id] => 18500546 [patent_doc_number] => 20230223340 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-13 [patent_title] => METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH INTERCONNECT PART [patent_app_type] => utility [patent_app_number] => 18/124757 [patent_app_country] => US [patent_app_date] => 2023-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9419 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18124757 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/124757
Method for preparing a semiconductor device with interconnect part Mar 21, 2023 Issued
Array ( [id] => 19046871 [patent_doc_number] => 11935991 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Light emitting device including electronic components and pin holes [patent_app_type] => utility [patent_app_number] => 18/184752 [patent_app_country] => US [patent_app_date] => 2023-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 4913 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 254 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18184752 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/184752
Light emitting device including electronic components and pin holes Mar 15, 2023 Issued
Array ( [id] => 20496707 [patent_doc_number] => 12538598 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-27 [patent_title] => Chip package structure and method for fabricating the same [patent_app_type] => utility [patent_app_number] => 18/181557 [patent_app_country] => US [patent_app_date] => 2023-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 1108 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18181557 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/181557
Chip package structure and method for fabricating the same Mar 9, 2023 Issued
Array ( [id] => 20496707 [patent_doc_number] => 12538598 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-27 [patent_title] => Chip package structure and method for fabricating the same [patent_app_type] => utility [patent_app_number] => 18/181557 [patent_app_country] => US [patent_app_date] => 2023-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 1108 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18181557 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/181557
Chip package structure and method for fabricating the same Mar 9, 2023 Issued
Array ( [id] => 18456385 [patent_doc_number] => 20230197667 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/172409 [patent_app_country] => US [patent_app_date] => 2023-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6791 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18172409 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/172409
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Feb 21, 2023 Pending
Array ( [id] => 20047106 [patent_doc_number] => 20250185328 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-06-05 [patent_title] => COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 18/695632 [patent_app_country] => US [patent_app_date] => 2023-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1133 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18695632 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/695632
COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR Feb 8, 2023 Pending
Array ( [id] => 19879861 [patent_doc_number] => 20250112118 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-04-03 [patent_title] => SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND A FIRST CONNECTION ELEMENT [patent_app_type] => utility [patent_app_number] => 18/839996 [patent_app_country] => US [patent_app_date] => 2023-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4856 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18839996 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/839996
Semiconductor assembly comprising a first semiconductor element and a first connection element Jan 29, 2023 Issued
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