
Tai V. Nguyen
Examiner (ID: 16347)
| Most Active Art Unit | 3729 |
| Art Unit(s) | 3729 |
| Total Applications | 847 |
| Issued Applications | 744 |
| Pending Applications | 5 |
| Abandoned Applications | 98 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6532976
[patent_doc_number] => 20100126008
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-27
[patent_title] => 'Circuit module and process for producing the same'
[patent_app_type] => utility
[patent_app_number] => 12/591240
[patent_app_country] => US
[patent_app_date] => 2009-11-13
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[pdf_file] => publications/A1/0126/20100126008.pdf
[firstpage_image] =>[orig_patent_app_number] => 12591240
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/591240 | Process for producing a circuit module | Nov 12, 2009 | Issued |
Array
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[patent_doc_number] => 20100119350
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-13
[patent_title] => 'CLAMPING APPARATUS INCLUDING MOVABLE GRIPPER AND A SEMICONDUCTOR DEVICE FABRICATION PROCESS USING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/615000
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[patent_app_date] => 2009-11-09
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[firstpage_image] =>[orig_patent_app_number] => 12615000
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/615000 | Semiconductor device fabrication process | Nov 8, 2009 | Issued |
Array
(
[id] => 5969829
[patent_doc_number] => 20110067238
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-03-24
[patent_title] => 'METHOD OF MAKING AN IMPROVED ELECTRICAL CONNECTION WITH SEALED CABLE CORE AND A TERMINAL'
[patent_app_type] => utility
[patent_app_number] => 12/575675
[patent_app_country] => US
[patent_app_date] => 2009-10-08
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[firstpage_image] =>[orig_patent_app_number] => 12575675
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/575675 | Method of making an improved electrical connection with sealed cable core and a terminal | Oct 7, 2009 | Issued |
Array
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[id] => 6443455
[patent_doc_number] => 20100088886
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-15
[patent_title] => 'PACKAGING METHOD FOR ASSEMBLING CAPTIVE SCREW TO PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/574719
[patent_app_country] => US
[patent_app_date] => 2009-10-07
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/574719 | Packaging method for assembling captive screw to printed circuit board | Oct 6, 2009 | Issued |
Array
(
[id] => 6111471
[patent_doc_number] => 20110072638
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[patent_kind] => A1
[patent_issue_date] => 2011-03-31
[patent_title] => 'Method and System for Manufacturing Electrosurgical Seal Plates'
[patent_app_type] => utility
[patent_app_number] => 12/568199
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[patent_app_date] => 2009-09-28
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/568199 | Method and system for manufacturing electrosurgical seal plates | Sep 27, 2009 | Issued |
Array
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[id] => 5370346
[patent_doc_number] => 20090307905
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-17
[patent_title] => 'DROPLET DISCHARGING HEAD AND MANUFACTURING METHOD FOR THE SAME, AND DROPLET DISCHARGING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/545925
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/545925 | Method of manufacturing a droplet discharging head | Aug 23, 2009 | Issued |
Array
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[patent_doc_number] => 20090307904
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[patent_kind] => A1
[patent_issue_date] => 2009-12-17
[patent_title] => 'Contact Element, Contact Unit, Method for Producing a Contact Unit, and Method for Placing into Operation for Fine-Pitch Parts'
[patent_app_type] => utility
[patent_app_number] => 12/533540
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/533540 | Contact element, contact unit, method for producing a contact unit, and method for placing into operation for fine-pitch parts | Jul 30, 2009 | Issued |
Array
(
[id] => 7701418
[patent_doc_number] => 08087168
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-01-03
[patent_title] => 'Method of supplying ink to ink ejection nozzles'
[patent_app_type] => utility
[patent_app_number] => 12/505510
[patent_app_country] => US
[patent_app_date] => 2009-07-19
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[firstpage_image] =>[orig_patent_app_number] => 12505510
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/505510 | Method of supplying ink to ink ejection nozzles | Jul 18, 2009 | Issued |
Array
(
[id] => 5554351
[patent_doc_number] => 20090265928
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[patent_kind] => A1
[patent_issue_date] => 2009-10-29
[patent_title] => 'Circuit board and manufacturing method thereof'
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[patent_app_number] => 12/458088
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/458088 | Circuit board and manufacturing method thereof | Jun 29, 2009 | Abandoned |
Array
(
[id] => 5551994
[patent_doc_number] => 20090285980
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-19
[patent_title] => 'PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/494948
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/494948 | Method for manufacturing printed wiring board | Jun 29, 2009 | Issued |
Array
(
[id] => 8185098
[patent_doc_number] => 08181341
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[patent_kind] => B2
[patent_issue_date] => 2012-05-22
[patent_title] => 'Method of forming a multilayer printed wiring board having a bulged via'
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[patent_app_number] => 12/488638
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[patent_app_date] => 2009-06-22
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/488638 | Method of forming a multilayer printed wiring board having a bulged via | Jun 21, 2009 | Issued |
Array
(
[id] => 6254595
[patent_doc_number] => 20100294538
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[patent_issue_date] => 2010-11-25
[patent_title] => 'Plastic Lead Frame with Reflection and Conduction Metal Layer and Fabrication Method of the Same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/470759 | Method for a plastic lead frame with reflective and conductive layer | May 21, 2009 | Issued |
Array
(
[id] => 8024341
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[patent_title] => 'Method of a package on package packaging'
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Array
(
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[patent_issue_date] => 2009-08-27
[patent_title] => 'LIQUID EJECTION ELEMENT AND MANUFACTURING METHOD THEREFOR'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/434278 | Method for manufacturing a substrate for a liquid ejection element | Apr 30, 2009 | Issued |
Array
(
[id] => 5482799
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[patent_title] => 'METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/431950 | Method of producing circuit board | Apr 28, 2009 | Issued |
Array
(
[id] => 4467720
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[patent_issue_date] => 2011-01-11
[patent_title] => 'Method for manufacturing resonant element'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/431129 | Method for manufacturing resonant element | Apr 27, 2009 | Issued |
Array
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[patent_title] => 'METHOD FOR INTEGRATING HEAT TRANSFER MEMBERS,AND AN LED DEVICE'
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/320646 | Method for manufacturing an inkjet head | Jan 29, 2009 | Issued |