
Tai V. Nguyen
Examiner (ID: 16347)
| Most Active Art Unit | 3729 |
| Art Unit(s) | 3729 |
| Total Applications | 847 |
| Issued Applications | 744 |
| Pending Applications | 5 |
| Abandoned Applications | 98 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6336691
[patent_doc_number] => 20100083497
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-08
[patent_title] => 'SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 12/246200
[patent_app_country] => US
[patent_app_date] => 2008-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4745
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0083/20100083497.pdf
[firstpage_image] =>[orig_patent_app_number] => 12246200
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/246200 | Method for coupling a battery within an embedded system | Oct 5, 2008 | Issued |
Array
(
[id] => 8110861
[patent_doc_number] => 08156640
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-17
[patent_title] => 'Substantially continuous layer of embedded transient protection for printed circuit boards'
[patent_app_type] => utility
[patent_app_number] => 12/245729
[patent_app_country] => US
[patent_app_date] => 2008-10-04
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/08/156/08156640.pdf
[firstpage_image] =>[orig_patent_app_number] => 12245729
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/245729 | Substantially continuous layer of embedded transient protection for printed circuit boards | Oct 3, 2008 | Issued |
Array
(
[id] => 4472816
[patent_doc_number] => 07944131
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-17
[patent_title] => 'Quartz crystal unit, quartz crystal oscillator and manufacturing method of the same'
[patent_app_type] => utility
[patent_app_number] => 12/286863
[patent_app_country] => US
[patent_app_date] => 2008-10-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 13548
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[pdf_file] => patents/07/944/07944131.pdf
[firstpage_image] =>[orig_patent_app_number] => 12286863
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/286863 | Quartz crystal unit, quartz crystal oscillator and manufacturing method of the same | Oct 1, 2008 | Issued |
Array
(
[id] => 5412265
[patent_doc_number] => 20090038152
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-12
[patent_title] => 'Method for producing ink-jet head and ink-jet head'
[patent_app_type] => utility
[patent_app_number] => 12/232880
[patent_app_country] => US
[patent_app_date] => 2008-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 9729
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[pdf_file] => publications/A1/0038/20090038152.pdf
[firstpage_image] =>[orig_patent_app_number] => 12232880
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/232880 | Method for producing ink-jet head and ink-jet head | Sep 24, 2008 | Issued |
Array
(
[id] => 5400812
[patent_doc_number] => 20090236125
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-24
[patent_title] => 'Multi-layer board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/232820
[patent_app_country] => US
[patent_app_date] => 2008-09-24
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0236/20090236125.pdf
[firstpage_image] =>[orig_patent_app_number] => 12232820
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/232820 | Method of manufacturing a multi-layer board | Sep 23, 2008 | Issued |
Array
(
[id] => 8350075
[patent_doc_number] => 08245393
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-08-21
[patent_title] => 'Method for fabricating a circuit board including aligned nanostructures'
[patent_app_type] => utility
[patent_app_number] => 12/234529
[patent_app_country] => US
[patent_app_date] => 2008-09-19
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/234529 | Method for fabricating a circuit board including aligned nanostructures | Sep 18, 2008 | Issued |
Array
(
[id] => 5296620
[patent_doc_number] => 20090011546
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'COOLING OF SUBSTRATE USING INTERPOSER CHANNELS'
[patent_app_type] => utility
[patent_app_number] => 12/212998
[patent_app_country] => US
[patent_app_date] => 2008-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0011/20090011546.pdf
[firstpage_image] =>[orig_patent_app_number] => 12212998
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/212998 | Method of forming a substrate with interposer channels for cooling the substrate | Sep 17, 2008 | Issued |
Array
(
[id] => 5344755
[patent_doc_number] => 20090000116
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'Methods of Providing Semiconductor Components within Sockets'
[patent_app_type] => utility
[patent_app_number] => 12/208589
[patent_app_country] => US
[patent_app_date] => 2008-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
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[patent_no_of_words] => 5666
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20090000116.pdf
[firstpage_image] =>[orig_patent_app_number] => 12208589
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/208589 | Methods of providing semiconductor components within sockets | Sep 10, 2008 | Issued |
Array
(
[id] => 5292494
[patent_doc_number] => 20090007420
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'COMPONENT MOUNTING APPARATUS'
[patent_app_type] => utility
[patent_app_number] => 12/202594
[patent_app_country] => US
[patent_app_date] => 2008-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[pdf_file] => publications/A1/0007/20090007420.pdf
[firstpage_image] =>[orig_patent_app_number] => 12202594
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/202594 | Component mounting apparatus | Sep 1, 2008 | Issued |
Array
(
[id] => 6220297
[patent_doc_number] => 20100055392
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-03-04
[patent_title] => 'METHOD OF FABRICATING MULTI-LAYERED SUBSTRATE AND THE SUBSTRATE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/199149
[patent_app_country] => US
[patent_app_date] => 2008-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 3459
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0055/20100055392.pdf
[firstpage_image] =>[orig_patent_app_number] => 12199149
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/199149 | Method of fabricating multi-layered substrate | Aug 26, 2008 | Issued |
Array
(
[id] => 5292500
[patent_doc_number] => 20090007426
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'Image forming apparatus and method of manufacturing electronic circuit using the same'
[patent_app_type] => utility
[patent_app_number] => 12/230280
[patent_app_country] => US
[patent_app_date] => 2008-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[pdf_file] => publications/A1/0007/20090007426.pdf
[firstpage_image] =>[orig_patent_app_number] => 12230280
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/230280 | Method of manufacturing an electronic circuit formed on a substrate | Aug 26, 2008 | Issued |
Array
(
[id] => 5319275
[patent_doc_number] => 20090057265
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-05
[patent_title] => 'Method of manufacturing multilayer printed circuit board'
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[patent_app_number] => 12/230219
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[pdf_file] => publications/A1/0057/20090057265.pdf
[firstpage_image] =>[orig_patent_app_number] => 12230219
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/230219 | Method of manufacturing multilayer printed circuit board | Aug 25, 2008 | Abandoned |
Array
(
[id] => 5333891
[patent_doc_number] => 20090050355
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-26
[patent_title] => 'Thermoplastic Films For Insulated Metal Substrates And Methods Of Manufacture Thereof'
[patent_app_type] => utility
[patent_app_number] => 12/195939
[patent_app_country] => US
[patent_app_date] => 2008-08-21
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12195939
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/195939 | Method of assembling an insulated metal substrate | Aug 20, 2008 | Issued |
Array
(
[id] => 8150175
[patent_doc_number] => 08166649
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-05-01
[patent_title] => 'Method of forming an electroded sheet'
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[patent_app_date] => 2008-08-20
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[pdf_file] => patents/08/166/08166649.pdf
[firstpage_image] =>[orig_patent_app_number] => 12194839
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/194839 | Method of forming an electroded sheet | Aug 19, 2008 | Issued |
Array
(
[id] => 6536750
[patent_doc_number] => 20100044096
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-25
[patent_title] => 'Horizontally Split Vias'
[patent_app_type] => utility
[patent_app_number] => 12/193842
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 12193842
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/193842 | Method of forming a substrate having a plurality of insulator layers | Aug 18, 2008 | Issued |
Array
(
[id] => 4792331
[patent_doc_number] => 20080293305
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-27
[patent_title] => 'WIRE LEAD GUIDE AND METHOD FOR TERMINATING A COMMUNICATIONS CABLE'
[patent_app_type] => utility
[patent_app_number] => 12/188380
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[pdf_file] => publications/A1/0293/20080293305.pdf
[firstpage_image] =>[orig_patent_app_number] => 12188380
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/188380 | Method for terminating a telecommunications cable | Aug 7, 2008 | Issued |
Array
(
[id] => 997
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[patent_issue_date] => 2010-10-19
[patent_title] => 'Method of making through-hole vias in a substrate'
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[pdf_file] => patents/07/814/07814652.pdf
[firstpage_image] =>[orig_patent_app_number] => 12180169
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/180169 | Method of making through-hole vias in a substrate | Jul 24, 2008 | Issued |
Array
(
[id] => 8384043
[patent_doc_number] => 08261432
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[patent_kind] => B2
[patent_issue_date] => 2012-09-11
[patent_title] => 'Disk spacer drop-proofing tool for disk removal process'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/179488 | Disk spacer drop-proofing tool for disk removal process | Jul 23, 2008 | Issued |
Array
(
[id] => 4428652
[patent_doc_number] => 07895741
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[patent_kind] => B2
[patent_issue_date] => 2011-03-01
[patent_title] => 'Method of producing a wired circuit board'
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 12173300
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/173300 | Electrical connector assembly tool | Jul 14, 2008 | Issued |