Search

Tan Nguyen

Examiner (ID: 246, Phone: (571)272-1789 , Office: P/2827 )

Most Active Art Unit
2827
Art Unit(s)
2818, 2511, 3103, 2309, 2827
Total Applications
3337
Issued Applications
3151
Pending Applications
42
Abandoned Applications
149

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1426048 [patent_doc_number] => 06503967 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-07 [patent_title] => 'Hardener for epoxy resin and epoxy resin composition' [patent_app_type] => B1 [patent_app_number] => 09/868325 [patent_app_country] => US [patent_app_date] => 2001-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5615 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/503/06503967.pdf [firstpage_image] =>[orig_patent_app_number] => 09868325 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/868325
Hardener for epoxy resin and epoxy resin composition Jun 17, 2001 Issued
Array ( [id] => 1421121 [patent_doc_number] => 06515048 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-04 [patent_title] => 'Adhesive powder' [patent_app_type] => B1 [patent_app_number] => 09/857562 [patent_app_country] => US [patent_app_date] => 2001-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1981 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/515/06515048.pdf [firstpage_image] =>[orig_patent_app_number] => 09857562 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/857562
Adhesive powder Jun 5, 2001 Issued
Array ( [id] => 1594420 [patent_doc_number] => 06492027 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-12-10 [patent_title] => 'Cationic resin composition' [patent_app_type] => B2 [patent_app_number] => 09/867623 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6412 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/492/06492027.pdf [firstpage_image] =>[orig_patent_app_number] => 09867623 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/867623
Cationic resin composition May 30, 2001 Issued
Array ( [id] => 5801186 [patent_doc_number] => 20020009597 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-24 [patent_title] => 'Connecting material and connection structure' [patent_app_type] => new [patent_app_number] => 09/863288 [patent_app_country] => US [patent_app_date] => 2001-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3211 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0009/20020009597.pdf [firstpage_image] =>[orig_patent_app_number] => 09863288 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/863288
Connecting material and connection structure May 23, 2001 Issued
Array ( [id] => 1490959 [patent_doc_number] => 06417252 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-09 [patent_title] => 'Aqueous resin composition for use as a sealer' [patent_app_type] => B1 [patent_app_number] => 09/847396 [patent_app_country] => US [patent_app_date] => 2001-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7791 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/417/06417252.pdf [firstpage_image] =>[orig_patent_app_number] => 09847396 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/847396
Aqueous resin composition for use as a sealer May 2, 2001 Issued
Array ( [id] => 6477822 [patent_doc_number] => 20020022679 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-21 [patent_title] => 'Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom' [patent_app_type] => new [patent_app_number] => 09/844505 [patent_app_country] => US [patent_app_date] => 2001-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3509 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 24 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0022/20020022679.pdf [firstpage_image] =>[orig_patent_app_number] => 09844505 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/844505
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom Apr 26, 2001 Issued
Array ( [id] => 1533482 [patent_doc_number] => 06410617 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-25 [patent_title] => 'Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same' [patent_app_type] => B1 [patent_app_number] => 09/743211 [patent_app_country] => US [patent_app_date] => 2001-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4612 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 294 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/410/06410617.pdf [firstpage_image] =>[orig_patent_app_number] => 09743211 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/743211
Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same Apr 25, 2001 Issued
Array ( [id] => 6538980 [patent_doc_number] => 20020193467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-19 [patent_title] => 'Conductive materials with electrical stability for use in electronics devices' [patent_app_type] => new [patent_app_number] => 09/841980 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2331 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20020193467.pdf [firstpage_image] =>[orig_patent_app_number] => 09841980 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/841980
Conductive materials with electrical stability for use in electronics devices Apr 24, 2001 Issued
Array ( [id] => 1418686 [patent_doc_number] => 06518332 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-11 [patent_title] => 'Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith' [patent_app_type] => B2 [patent_app_number] => 09/841046 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4105 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518332.pdf [firstpage_image] =>[orig_patent_app_number] => 09841046 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/841046
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith Apr 24, 2001 Issued
Array ( [id] => 1479054 [patent_doc_number] => 06451879 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-17 [patent_title] => 'Phenolic resin, epoxy resin, and processes for producing these' [patent_app_type] => B1 [patent_app_number] => 09/807572 [patent_app_country] => US [patent_app_date] => 2001-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7187 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/451/06451879.pdf [firstpage_image] =>[orig_patent_app_number] => 09807572 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/807572
Phenolic resin, epoxy resin, and processes for producing these Apr 12, 2001 Issued
Array ( [id] => 6934793 [patent_doc_number] => 20010056137 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-27 [patent_title] => 'Aqueous two-component cross-linkable composition' [patent_app_type] => new [patent_app_number] => 09/833992 [patent_app_country] => US [patent_app_date] => 2001-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6813 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20010056137.pdf [firstpage_image] =>[orig_patent_app_number] => 09833992 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/833992
Aqueous two-component cross-linkable composition Apr 11, 2001 Issued
Array ( [id] => 6000751 [patent_doc_number] => 20020028866 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-07 [patent_title] => 'Method of manufacturing powder coating' [patent_app_type] => new [patent_app_number] => 09/828472 [patent_app_country] => US [patent_app_date] => 2001-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7496 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0028/20020028866.pdf [firstpage_image] =>[orig_patent_app_number] => 09828472 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/828472
Method of manufacturing powder coating Apr 8, 2001 Issued
Array ( [id] => 5952111 [patent_doc_number] => 20020006986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-17 [patent_title] => 'Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same' [patent_app_type] => new [patent_app_number] => 09/826865 [patent_app_country] => US [patent_app_date] => 2001-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6624 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20020006986.pdf [firstpage_image] =>[orig_patent_app_number] => 09826865 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/826865
Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same Apr 5, 2001 Issued
Array ( [id] => 1412074 [patent_doc_number] => 06521354 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-02-18 [patent_title] => 'Epoxy resin composition and semiconductor device' [patent_app_type] => B1 [patent_app_number] => 09/806733 [patent_app_country] => US [patent_app_date] => 2001-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3853 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/521/06521354.pdf [firstpage_image] =>[orig_patent_app_number] => 09806733 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/806733
Epoxy resin composition and semiconductor device Apr 3, 2001 Issued
Array ( [id] => 1417459 [patent_doc_number] => 06512026 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-28 [patent_title] => 'Powder clear varnish and aqueous powder clear varnish slurry' [patent_app_type] => B1 [patent_app_number] => 09/786593 [patent_app_country] => US [patent_app_date] => 2001-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6621 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/512/06512026.pdf [firstpage_image] =>[orig_patent_app_number] => 09786593 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/786593
Powder clear varnish and aqueous powder clear varnish slurry Apr 1, 2001 Issued
Array ( [id] => 1495936 [patent_doc_number] => 06403714 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-11 [patent_title] => 'Preparation of epoxy-functional resins' [patent_app_type] => B1 [patent_app_number] => 09/819466 [patent_app_country] => US [patent_app_date] => 2001-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2994 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/403/06403714.pdf [firstpage_image] =>[orig_patent_app_number] => 09819466 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/819466
Preparation of epoxy-functional resins Mar 27, 2001 Issued
Array ( [id] => 1296232 [patent_doc_number] => 06627316 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-30 [patent_title] => 'Resin composition for water borne coatings and water borne coating composition' [patent_app_type] => B1 [patent_app_number] => 09/817955 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7176 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/627/06627316.pdf [firstpage_image] =>[orig_patent_app_number] => 09817955 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/817955
Resin composition for water borne coatings and water borne coating composition Mar 26, 2001 Issued
Array ( [id] => 6908344 [patent_doc_number] => 20010011111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-08-02 [patent_title] => 'Molded resin composition exhibiting good adhesion to conductive material on a surface' [patent_app_type] => new [patent_app_number] => 09/815059 [patent_app_country] => US [patent_app_date] => 2001-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4629 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0011/20010011111.pdf [firstpage_image] =>[orig_patent_app_number] => 09815059 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/815059
Molded resin composition exhibiting good adhesion to conductive material on a surface Mar 22, 2001 Abandoned
Array ( [id] => 672875 [patent_doc_number] => RE039232 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2006-08-08 [patent_title] => 'Thermoplastic elastomer composition for powder slush molding and process for preparation of said composition' [patent_app_type] => reissue [patent_app_number] => 09/815414 [patent_app_country] => US [patent_app_date] => 2001-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5370 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/039/RE039232.pdf [firstpage_image] =>[orig_patent_app_number] => 09815414 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/815414
Thermoplastic elastomer composition for powder slush molding and process for preparation of said composition Mar 21, 2001 Issued
Array ( [id] => 7001123 [patent_doc_number] => 20010053817 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-20 [patent_title] => 'Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition' [patent_app_type] => new [patent_app_number] => 09/811511 [patent_app_country] => US [patent_app_date] => 2001-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 5548 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0053/20010053817.pdf [firstpage_image] =>[orig_patent_app_number] => 09811511 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/811511
Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition Mar 19, 2001 Issued
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