Search

Taqi R. Nasir

Examiner (ID: 2628, Phone: (571)270-1425 , Office: P/2858 )

Most Active Art Unit
2858
Art Unit(s)
2858
Total Applications
700
Issued Applications
579
Pending Applications
93
Abandoned Applications
67

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20223055 [patent_doc_number] => 20250285986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-09-11 [patent_title] => SCALABLE ELECTRONICS MANUFACTURING WITH RIGID TILE PANEL EMBEDDING [patent_app_type] => utility [patent_app_number] => 19/072087 [patent_app_country] => US [patent_app_date] => 2025-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19072087 [rel_patent_id] =>[rel_patent_doc_number] =>)
19/072087
SCALABLE ELECTRONICS MANUFACTURING WITH RIGID TILE PANEL EMBEDDING Mar 5, 2025 Pending
Array ( [id] => 20347609 [patent_doc_number] => 12471347 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Vertical power semiconductor device and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/969220 [patent_app_country] => US [patent_app_date] => 2024-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 27 [patent_no_of_words] => 7888 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18969220 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/969220
Vertical power semiconductor device and manufacturing method thereof Dec 3, 2024 Issued
Array ( [id] => 19407191 [patent_doc_number] => 20240290702 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/655879 [patent_app_country] => US [patent_app_date] => 2024-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9551 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18655879 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/655879
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME May 5, 2024 Pending
Array ( [id] => 19364248 [patent_doc_number] => 20240266282 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-08 [patent_title] => SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN VIA [patent_app_type] => utility [patent_app_number] => 18/640636 [patent_app_country] => US [patent_app_date] => 2024-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19900 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18640636 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/640636
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN VIA Apr 18, 2024 Pending
Array ( [id] => 19269533 [patent_doc_number] => 20240213237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS [patent_app_type] => utility [patent_app_number] => 18/602533 [patent_app_country] => US [patent_app_date] => 2024-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9599 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18602533 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/602533
Info packages including thermal dissipation blocks Mar 11, 2024 Issued
Array ( [id] => 19269533 [patent_doc_number] => 20240213237 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS [patent_app_type] => utility [patent_app_number] => 18/602533 [patent_app_country] => US [patent_app_date] => 2024-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9599 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18602533 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/602533
Info packages including thermal dissipation blocks Mar 11, 2024 Issued
Array ( [id] => 19269401 [patent_doc_number] => 20240213105 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT BONDING OF A SUBSTRATE [patent_app_type] => utility [patent_app_number] => 18/600278 [patent_app_country] => US [patent_app_date] => 2024-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4924 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -29 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18600278 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/600278
Mitigating surface damage of probe pads in preparation for direct bonding of a substrate Mar 7, 2024 Issued
Array ( [id] => 19943717 [patent_doc_number] => 12315854 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-27 [patent_title] => Integrated circuit package and method [patent_app_type] => utility [patent_app_number] => 18/593536 [patent_app_country] => US [patent_app_date] => 2024-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 11195 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18593536 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/593536
Integrated circuit package and method Feb 29, 2024 Issued
Array ( [id] => 19901544 [patent_doc_number] => 12279498 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Organic light emitting diode display device including a power supply wire [patent_app_type] => utility [patent_app_number] => 18/544416 [patent_app_country] => US [patent_app_date] => 2023-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 10613 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18544416 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/544416
Organic light emitting diode display device including a power supply wire Dec 17, 2023 Issued
Array ( [id] => 19901544 [patent_doc_number] => 12279498 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Organic light emitting diode display device including a power supply wire [patent_app_type] => utility [patent_app_number] => 18/544416 [patent_app_country] => US [patent_app_date] => 2023-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 10613 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18544416 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/544416
Organic light emitting diode display device including a power supply wire Dec 17, 2023 Issued
Array ( [id] => 19087939 [patent_doc_number] => 20240114740 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-04 [patent_title] => Foldable Display Apparatus [patent_app_type] => utility [patent_app_number] => 18/521947 [patent_app_country] => US [patent_app_date] => 2023-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8352 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18521947 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/521947
Foldable Display Apparatus Nov 27, 2023 Pending
Array ( [id] => 18991307 [patent_doc_number] => 20240063276 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/380754 [patent_app_country] => US [patent_app_date] => 2023-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10766 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18380754 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/380754
Semiconductor device and method for fabricating the same Oct 16, 2023 Issued
Array ( [id] => 18943590 [patent_doc_number] => 20240038729 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCONNECT [patent_app_type] => utility [patent_app_number] => 18/377639 [patent_app_country] => US [patent_app_date] => 2023-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10670 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18377639 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/377639
Double-sided substrate with cavities for direct die-to-die interconnect Oct 5, 2023 Issued
Array ( [id] => 18927112 [patent_doc_number] => 20240030116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES [patent_app_type] => utility [patent_app_number] => 18/375133 [patent_app_country] => US [patent_app_date] => 2023-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10273 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18375133 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/375133
Ultra-thin, hyper-density semiconductor packages Sep 28, 2023 Issued
Array ( [id] => 18927112 [patent_doc_number] => 20240030116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES [patent_app_type] => utility [patent_app_number] => 18/375133 [patent_app_country] => US [patent_app_date] => 2023-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10273 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18375133 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/375133
Ultra-thin, hyper-density semiconductor packages Sep 28, 2023 Issued
Array ( [id] => 19781586 [patent_doc_number] => 12230624 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-18 [patent_title] => Integrated circuit with mixed row heights [patent_app_type] => utility [patent_app_number] => 18/232759 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 17978 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 269 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18232759 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/232759
Integrated circuit with mixed row heights Aug 9, 2023 Issued
Array ( [id] => 19696491 [patent_doc_number] => 20250015036 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-09 [patent_title] => PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/447466 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2060 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18447466 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/447466
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF Aug 9, 2023 Pending
Array ( [id] => 19696491 [patent_doc_number] => 20250015036 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-09 [patent_title] => PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/447466 [patent_app_country] => US [patent_app_date] => 2023-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2060 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18447466 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/447466
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF Aug 9, 2023 Pending
Array ( [id] => 18776389 [patent_doc_number] => 20230371227 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 18/361384 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11930 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361384 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/361384
Memory device Jul 27, 2023 Issued
Array ( [id] => 19007825 [patent_doc_number] => 20240071896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/361482 [patent_app_country] => US [patent_app_date] => 2023-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7344 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18361482 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/361482
SEMICONDUCTOR PACKAGE Jul 27, 2023 Pending
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