
Telly D. Green
Examiner (ID: 11748)
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2809, 2898, 2822 |
| Total Applications | 1668 |
| Issued Applications | 1348 |
| Pending Applications | 113 |
| Abandoned Applications | 249 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11770343
[patent_doc_number] => 09379036
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[patent_title] => '3DIC packages with heat dissipation structures'
[patent_app_type] => utility
[patent_app_number] => 14/579388
[patent_app_country] => US
[patent_app_date] => 2014-12-22
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Array
(
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[patent_doc_number] => 20150099331
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[patent_kind] => A1
[patent_issue_date] => 2015-04-09
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
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Array
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[patent_title] => 'PHOTODETECTOR AND UPCONVERSION DEVICE WITH GAIN'
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Array
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[patent_title] => 'METHOD OF MANUFACTURING A DEVICE WITH A CAVITY'
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Array
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Array
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Array
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[patent_title] => 'LIGHT EMITTING DIODE MODULE WITH THREE PART COLOR MATCHING'
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Array
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[patent_title] => Metal joining structure using metal nanoparticles and metal joining method and metal joining material
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Array
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[patent_title] => 'Forming source/drain zones with a dielectric plug over an isolation region between active regions'
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Array
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Array
(
[id] => 10222675
[patent_doc_number] => 20150107667
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[patent_issue_date] => 2015-04-23
[patent_title] => 'WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/523433 | Wafer-level flip chip device packages and related methods | Oct 23, 2014 | Issued |
Array
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Array
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