
Teresa M. Arroyo
Examiner (ID: 14033, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2822, 2893, 2811, 2829, 2826, 2508, 2503, 2881 |
| Total Applications | 998 |
| Issued Applications | 712 |
| Pending Applications | 86 |
| Abandoned Applications | 215 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11631089
[patent_doc_number] => 20170141278
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-05-18
[patent_title] => 'LED ASSEMBLY FOR LED PACKAGE WITH SIDEWALL ELECTRODES'
[patent_app_type] => utility
[patent_app_number] => 14/944038
[patent_app_country] => US
[patent_app_date] => 2015-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 29
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14944038
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/944038 | LED ASSEMBLY FOR LED PACKAGE WITH SIDEWALL ELECTRODES | Nov 16, 2015 | Abandoned |
Array
(
[id] => 11883728
[patent_doc_number] => 09754909
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-09-05
[patent_title] => 'Copper structures with intermetallic coating for integrated circuit chips'
[patent_app_type] => utility
[patent_app_number] => 14/944054
[patent_app_country] => US
[patent_app_date] => 2015-11-17
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/944054 | Copper structures with intermetallic coating for integrated circuit chips | Nov 16, 2015 | Issued |
Array
(
[id] => 10780258
[patent_doc_number] => 20160126414
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-05-05
[patent_title] => 'Chip Substrate and Chip Package Module'
[patent_app_type] => utility
[patent_app_number] => 14/931432
[patent_app_country] => US
[patent_app_date] => 2015-11-03
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[patent_drawing_sheets_cnt] => 4
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/931432 | Chip substrate and chip package module | Nov 2, 2015 | Issued |
Array
(
[id] => 10709903
[patent_doc_number] => 20160056051
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-25
[patent_title] => 'EXTERNAL GETTERING METHOD AND DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/931806
[patent_app_country] => US
[patent_app_date] => 2015-11-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/931806 | External gettering method and device | Nov 2, 2015 | Issued |
Array
(
[id] => 11592817
[patent_doc_number] => 20170117229
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[patent_kind] => A1
[patent_issue_date] => 2017-04-27
[patent_title] => 'CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING BETWEEN ELECTRONIC COMPONENTS'
[patent_app_type] => utility
[patent_app_number] => 14/920798
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/920798 | CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING BETWEEN ELECTRONIC COMPONENTS | Oct 21, 2015 | Abandoned |
Array
(
[id] => 10610994
[patent_doc_number] => 09331037
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-05-03
[patent_title] => 'Preventing misshaped solder balls'
[patent_app_type] => utility
[patent_app_number] => 14/886177
[patent_app_country] => US
[patent_app_date] => 2015-10-19
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/886177 | Preventing misshaped solder balls | Oct 18, 2015 | Issued |
Array
(
[id] => 11453404
[patent_doc_number] => 09577057
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-02-21
[patent_title] => 'Semiconductor device contacts'
[patent_app_type] => utility
[patent_app_number] => 14/886778
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/886778 | Semiconductor device contacts | Oct 18, 2015 | Issued |
Array
(
[id] => 12953650
[patent_doc_number] => 09837361
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-12-05
[patent_title] => Semiconductor package with electromagnetic shielding member
[patent_app_type] => utility
[patent_app_number] => 14/874609
[patent_app_country] => US
[patent_app_date] => 2015-10-05
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/874609 | Semiconductor package with electromagnetic shielding member | Oct 4, 2015 | Issued |
Array
(
[id] => 11883730
[patent_doc_number] => 09754911
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-09-05
[patent_title] => 'IC structure with angled interconnect elements'
[patent_app_type] => utility
[patent_app_number] => 14/875032
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/875032 | IC structure with angled interconnect elements | Oct 4, 2015 | Issued |
Array
(
[id] => 11132294
[patent_doc_number] => 20160329269
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-11-10
[patent_title] => 'CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 14/874486
[patent_app_country] => US
[patent_app_date] => 2015-10-05
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14874486
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/874486 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Oct 4, 2015 | Abandoned |
Array
(
[id] => 10604345
[patent_doc_number] => 09324916
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-04-26
[patent_title] => 'Semiconductor light emitting device'
[patent_app_type] => utility
[patent_app_number] => 14/869519
[patent_app_country] => US
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14869519
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/869519 | Semiconductor light emitting device | Sep 28, 2015 | Issued |
Array
(
[id] => 10747622
[patent_doc_number] => 20160093774
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-03-31
[patent_title] => 'LIGHT EMITTING ELEMENT'
[patent_app_type] => utility
[patent_app_number] => 14/869667
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/869667 | Light emitting element | Sep 28, 2015 | Issued |
Array
(
[id] => 11687346
[patent_doc_number] => 09685396
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[patent_kind] => B2
[patent_issue_date] => 2017-06-20
[patent_title] => 'Semiconductor die arrangement'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/865985 | Semiconductor die arrangement | Sep 24, 2015 | Issued |
Array
(
[id] => 12115011
[patent_doc_number] => 09871007
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[patent_issue_date] => 2018-01-16
[patent_title] => 'Packaged integrated circuit device with cantilever structure'
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Array
(
[id] => 11637857
[patent_doc_number] => 09659842
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-05-23
[patent_title] => 'Methods of fabricating QFN semiconductor package and metal plate'
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Array
(
[id] => 10733334
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[patent_title] => 'LIGHT EMITTING DEVICE INCLUDING LIGHT EMITTING ELEMENT WITH PHOSPHOR'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/853311 | Light emitting device including light emitting element with phosphor | Sep 13, 2015 | Issued |
Array
(
[id] => 11660163
[patent_doc_number] => 09673175
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[patent_title] => 'Heat spreader for package-on-package (PoP) type packages'
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Array
(
[id] => 11475537
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[patent_title] => 'UNIVERSAL BGA SUBSTRATE'
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/827683 | Hermetically-sealed MEMS device and its fabrication | Aug 16, 2015 | Issued |