Teresa M. Arroyo

Array ( [id] => 9895583 [patent_doc_number] => 20150050781 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-02-19 [patent_title] => 'SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION' [patent_app_type] => utility [patent_app_number] => 14/529881 [patent_app_country] => US [patent_app_date] => 2014-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 5189 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14529881 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9809831 [patent_doc_number] => 20150021776 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-01-22 [patent_title] => 'POLYSILICON LAYER' [patent_app_type] => utility [patent_app_number] => 14/507317 [patent_app_country] => US [patent_app_date] => 2014-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3373 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14507317 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11847807 [patent_doc_number] => 09735366 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-08-15 [patent_title] => 'Heterostructure comprising a carbon nanomembrane' [patent_app_type] => utility [patent_app_number] => 14/501874 [patent_app_country] => US [patent_app_date] => 2014-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 6747 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14501874 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11898327 [patent_doc_number] => 09768269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-09-19 [patent_title] => 'Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same' [patent_app_type] => utility [patent_app_number] => 14/490581 [patent_app_country] => US [patent_app_date] => 2014-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 13 [patent_no_of_words] => 7253 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14490581 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11551597 [patent_doc_number] => 09620454 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-04-11 [patent_title] => 'Middle-of-line (MOL) manufactured integrated circuits (ICs) employing local interconnects of metal lines using an elongated via, and related methods' [patent_app_type] => utility [patent_app_number] => 14/484366 [patent_app_country] => US [patent_app_date] => 2014-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 4194 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14484366 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10733301 [patent_doc_number] => 20160079451 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-03-17 [patent_title] => 'PHOTODIODE STRUCTURES' [patent_app_type] => utility [patent_app_number] => 14/483584 [patent_app_country] => US [patent_app_date] => 2014-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3660 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14483584 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11221588 [patent_doc_number] => 09449931 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-09-20 [patent_title] => 'Pillar bumps and process for making same' [patent_app_type] => utility [patent_app_number] => 14/468236 [patent_app_country] => US [patent_app_date] => 2014-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 6072 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14468236 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9898820 [patent_doc_number] => 20150054019 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-02-26 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/463452 [patent_app_country] => US [patent_app_date] => 2014-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5156 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14463452 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10950808 [patent_doc_number] => 20140353829 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-12-04 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING INSULATING LAYERS CONTAINING OXYGEN AND A BARRIER LAYER CONTAINING MANGANESE' [patent_app_type] => utility [patent_app_number] => 14/459433 [patent_app_country] => US [patent_app_date] => 2014-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9490 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14459433 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10028782 [patent_doc_number] => 09070691 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-30 [patent_title] => 'Semiconductor package and stacked semiconductor package having the same' [patent_app_type] => utility [patent_app_number] => 14/341288 [patent_app_country] => US [patent_app_date] => 2014-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 21490 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 305 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14341288 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9768178 [patent_doc_number] => 20140291840 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-10-02 [patent_title] => 'STACKED SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/305527 [patent_app_country] => US [patent_app_date] => 2014-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4386 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14305527 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11246433 [patent_doc_number] => 09472480 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-10-18 [patent_title] => 'Over-mold packaging for wide band-gap semiconductor devices' [patent_app_type] => utility [patent_app_number] => 14/289216 [patent_app_country] => US [patent_app_date] => 2014-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 8171 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14289216 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9697103 [patent_doc_number] => 20140246789 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-04 [patent_title] => 'SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP CHIP MANNER' [patent_app_type] => utility [patent_app_number] => 14/276255 [patent_app_country] => US [patent_app_date] => 2014-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3383 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14276255 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10400452 [patent_doc_number] => 20150285461 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-10-08 [patent_title] => 'OPTICS FOR CHIP-ON-BOARD LIGHTING HAVING A PROTRUSION' [patent_app_type] => utility [patent_app_number] => 14/243695 [patent_app_country] => US [patent_app_date] => 2014-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5122 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14243695 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10697139 [patent_doc_number] => 20160043286 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-02-11 [patent_title] => 'ARRANGEMENT FOR CONVERTING LIGHT EMITTED BY AN LED LIGHT SOURCE' [patent_app_type] => utility [patent_app_number] => 14/781837 [patent_app_country] => US [patent_app_date] => 2014-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4103 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14781837 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10394826 [patent_doc_number] => 20150279833 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-10-01 [patent_title] => 'Protection Devices' [patent_app_type] => utility [patent_app_number] => 14/225138 [patent_app_country] => US [patent_app_date] => 2014-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5434 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14225138 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10570216 [patent_doc_number] => 09293395 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-22 [patent_title] => 'Lead frame with mold lock structure' [patent_app_type] => utility [patent_app_number] => 14/220118 [patent_app_country] => US [patent_app_date] => 2014-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3428 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14220118 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10383253 [patent_doc_number] => 20150268261 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-09-24 [patent_title] => 'CIRCUIT MOUNTING APPARATUS AND METHOD USING A SEGMENTED LEAD-FRAME' [patent_app_type] => utility [patent_app_number] => 14/217874 [patent_app_country] => US [patent_app_date] => 2014-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2302 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14217874 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11483584 [patent_doc_number] => 09590148 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-03-07 [patent_title] => 'Encapsulant modification in heavily phosphor loaded LED packages for improved stability' [patent_app_type] => utility [patent_app_number] => 14/217873 [patent_app_country] => US [patent_app_date] => 2014-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2771 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14217873 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11681532 [patent_doc_number] => 09680067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-06-13 [patent_title] => 'Heavily phosphor loaded LED packages having higher stability' [patent_app_type] => utility [patent_app_number] => 14/217831 [patent_app_country] => US [patent_app_date] => 2014-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2325 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14217831 [rel_patent_id] =>[rel_patent_doc_number] =>)