Teresa M. Arroyo

Array ( [id] => 6161410 [patent_doc_number] => 20110193224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-11 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/020126 [patent_app_country] => US [patent_app_date] => 2011-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3289 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20110193224.pdf [firstpage_image] =>[orig_patent_app_number] => 13020126 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7571030 [patent_doc_number] => 20110266686 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-03 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/020235 [patent_app_country] => US [patent_app_date] => 2011-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4560 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20110266686.pdf [firstpage_image] =>[orig_patent_app_number] => 13020235 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9876042 [patent_doc_number] => 08963315 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-24 [patent_title] => 'Semiconductor device with surface electrodes' [patent_app_type] => utility [patent_app_number] => 13/019390 [patent_app_country] => US [patent_app_date] => 2011-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 32 [patent_figures_cnt] => 68 [patent_no_of_words] => 17903 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13019390 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6185375 [patent_doc_number] => 20110124158 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-26 [patent_title] => 'THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS PACKAGE' [patent_app_type] => utility [patent_app_number] => 13/019488 [patent_app_country] => US [patent_app_date] => 2011-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3615 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0124/20110124158.pdf [firstpage_image] =>[orig_patent_app_number] => 13019488 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6161409 [patent_doc_number] => 20110193223 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-11 [patent_title] => 'SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/018723 [patent_app_country] => US [patent_app_date] => 2011-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4593 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20110193223.pdf [firstpage_image] =>[orig_patent_app_number] => 13018723 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7666876 [patent_doc_number] => 20110316145 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-29 [patent_title] => 'NANO/MICRO-STRUCTURE AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/018444 [patent_app_country] => US [patent_app_date] => 2011-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2506 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13018444 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8321402 [patent_doc_number] => 20120193808 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-02 [patent_title] => 'BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS' [patent_app_type] => utility [patent_app_number] => 13/018534 [patent_app_country] => US [patent_app_date] => 2011-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4730 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13018534 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8321400 [patent_doc_number] => 20120193809 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-02 [patent_title] => 'INTEGRATED CIRCUIT DEVICE AND METHOD FOR PREPARING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/018790 [patent_app_country] => US [patent_app_date] => 2011-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4425 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13018790 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10870239 [patent_doc_number] => 08895435 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-25 [patent_title] => 'Polysilicon layer and method of forming the same' [patent_app_type] => utility [patent_app_number] => 13/018009 [patent_app_country] => US [patent_app_date] => 2011-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3853 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13018009 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8321381 [patent_doc_number] => 20120193795 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-02 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING AN AIRBRIDGE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/017414 [patent_app_country] => US [patent_app_date] => 2011-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4340 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13017414 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6161367 [patent_doc_number] => 20110193204 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-11 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/016611 [patent_app_country] => US [patent_app_date] => 2011-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6718 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20110193204.pdf [firstpage_image] =>[orig_patent_app_number] => 13016611 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6057671 [patent_doc_number] => 20110113391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-12 [patent_title] => 'LAYOUT DESIGN TOOL' [patent_app_type] => utility [patent_app_number] => 13/006659 [patent_app_country] => US [patent_app_date] => 2011-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4441 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0113/20110113391.pdf [firstpage_image] =>[orig_patent_app_number] => 13006659 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5971122 [patent_doc_number] => 20110151622 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-23 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/929160 [patent_app_country] => US [patent_app_date] => 2011-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 9197 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20110151622.pdf [firstpage_image] =>[orig_patent_app_number] => 12929160 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5979844 [patent_doc_number] => 20110095265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-28 [patent_title] => 'NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 12/983708 [patent_app_country] => US [patent_app_date] => 2011-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9456 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0095/20110095265.pdf [firstpage_image] =>[orig_patent_app_number] => 12983708 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7660260 [patent_doc_number] => 20110309529 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-22 [patent_title] => 'MODULE SUBSTRATE THAT ALLOWS REPLACEMENT OF FAULTY CHIPS, SEMICONDUCTOR MODULE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 12/980533 [patent_app_country] => US [patent_app_date] => 2010-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6370 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0309/20110309529.pdf [firstpage_image] =>[orig_patent_app_number] => 12980533 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7787805 [patent_doc_number] => 20120049361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-01 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT' [patent_app_type] => utility [patent_app_number] => 12/980828 [patent_app_country] => US [patent_app_date] => 2010-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2729 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0049/20120049361.pdf [firstpage_image] =>[orig_patent_app_number] => 12980828 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9621383 [patent_doc_number] => 08791558 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-29 [patent_title] => 'Stacked semiconductor package' [patent_app_type] => utility [patent_app_number] => 12/980772 [patent_app_country] => US [patent_app_date] => 2010-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4324 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12980772 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9140922 [patent_doc_number] => 08581385 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-12 [patent_title] => 'Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same' [patent_app_type] => utility [patent_app_number] => 12/979304 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 4803 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12979304 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9530643 [patent_doc_number] => 08754519 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-17 [patent_title] => 'Package for housing semiconductor element and semiconductor device using the same' [patent_app_type] => utility [patent_app_number] => 12/978813 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 5017 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978813 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6153795 [patent_doc_number] => 20110156258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-30 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/978943 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3427 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0156/20110156258.pdf [firstpage_image] =>[orig_patent_app_number] => 12978943 [rel_patent_id] =>[rel_patent_doc_number] =>)