
Teresa M. Arroyo
Examiner (ID: 14033, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2822, 2893, 2811, 2829, 2826, 2508, 2503, 2881 |
| Total Applications | 998 |
| Issued Applications | 712 |
| Pending Applications | 86 |
| Abandoned Applications | 215 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11432338
[patent_doc_number] => 09570665
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-02-14
[patent_title] => 'Polyamide composition having high thermal conductivity'
[patent_app_type] => utility
[patent_app_number] => 14/009882
[patent_app_country] => US
[patent_app_date] => 2012-03-30
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/009882 | Polyamide composition having high thermal conductivity | Mar 29, 2012 | Issued |
Array
(
[id] => 9334921
[patent_doc_number] => 20140061703
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-03-06
[patent_title] => 'OPTOELECTRONIC SEMICONDUCTOR CHIP'
[patent_app_type] => utility
[patent_app_number] => 14/009265
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[patent_app_date] => 2012-03-28
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Array
(
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[patent_issue_date] => 2013-04-16
[patent_title] => 'Semiconductor device with deviation compensation and method for fabricating the same'
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[patent_app_date] => 2012-03-08
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Array
(
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[patent_title] => 'HOUSING FOR HIGH-POWER LIGHT EMITTING DIODES'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/003925 | HOUSING FOR HIGH-POWER LIGHT EMITTING DIODES | Mar 4, 2012 | Abandoned |
Array
(
[id] => 8536826
[patent_doc_number] => RE043807
[patent_country] => US
[patent_kind] => E1
[patent_issue_date] => 2012-11-20
[patent_title] => 'Microcircuit package having ductile layer'
[patent_app_type] => reissue
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Array
(
[id] => 8680918
[patent_doc_number] => 20130049202
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[patent_kind] => A1
[patent_issue_date] => 2013-02-28
[patent_title] => 'LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 13/331253
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[patent_app_date] => 2011-12-20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/331253 | Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board | Dec 19, 2011 | Issued |
Array
(
[id] => 9227906
[patent_doc_number] => 08633576
[patent_country] => US
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[patent_title] => 'Stacked chip-on-board module with edge connector'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/306203 | Stacked chip-on-board module with edge connector | Nov 28, 2011 | Issued |
Array
(
[id] => 8224913
[patent_doc_number] => 20120139115
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[patent_title] => 'Integrated Circuit Device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/305329 | Integrated Circuit Device | Nov 27, 2011 | Abandoned |
Array
(
[id] => 8838972
[patent_doc_number] => 20130134600
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[patent_kind] => A1
[patent_issue_date] => 2013-05-30
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME'
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Array
(
[id] => 8838962
[patent_doc_number] => 20130134589
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[patent_kind] => A1
[patent_issue_date] => 2013-05-30
[patent_title] => 'CHIP-PACKAGE AND A METHOD FOR FORMING A CHIP-PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 13/304795
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/304795 | Chip-package and a method for forming a chip-package | Nov 27, 2011 | Issued |
Array
(
[id] => 9938103
[patent_doc_number] => 08987916
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[patent_issue_date] => 2015-03-24
[patent_title] => 'Methods and apparatus to improve reliability of isolated vias'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/305410 | Methods and apparatus to improve reliability of isolated vias | Nov 27, 2011 | Issued |
Array
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[id] => 8299122
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[patent_title] => 'METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE'
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Array
(
[id] => 8713156
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[patent_title] => 'Airgap micro-spring interconnect with bonded underfill seal'
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Array
(
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Array
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Array
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Array
(
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/095843 | Quad flat non-leaded semiconductor package and fabrication method thereof | Apr 26, 2011 | Issued |