
Teresa M. Arroyo
Examiner (ID: 7429, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2893, 2826, 2503, 2811, 2829, 2822, 2881, 2508 |
| Total Applications | 972 |
| Issued Applications | 700 |
| Pending Applications | 81 |
| Abandoned Applications | 212 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9140922
[patent_doc_number] => 08581385
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-11-12
[patent_title] => 'Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same'
[patent_app_type] => utility
[patent_app_number] => 12/979304
[patent_app_country] => US
[patent_app_date] => 2010-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 4803
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12979304
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/979304 | Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same | Dec 26, 2010 | Issued |
Array
(
[id] => 9530643
[patent_doc_number] => 08754519
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-06-17
[patent_title] => 'Package for housing semiconductor element and semiconductor device using the same'
[patent_app_type] => utility
[patent_app_number] => 12/978813
[patent_app_country] => US
[patent_app_date] => 2010-12-27
[patent_effective_date] => 0000-00-00
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Array
(
[id] => 8261897
[patent_doc_number] => 20120161321
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'SEMICONDUCTOR DEVICE CONTACTS'
[patent_app_type] => utility
[patent_app_number] => 12/978359
[patent_app_country] => US
[patent_app_date] => 2010-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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Array
(
[id] => 8261879
[patent_doc_number] => 20120161312
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT'
[patent_app_type] => utility
[patent_app_number] => 12/978389
[patent_app_country] => US
[patent_app_date] => 2010-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978389 | NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT | Dec 22, 2010 | Abandoned |
Array
(
[id] => 8261891
[patent_doc_number] => 20120161319
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'BALL GRID ARRAY METHOD AND STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 12/978144
[patent_app_country] => US
[patent_app_date] => 2010-12-23
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978144 | BALL GRID ARRAY METHOD AND STRUCTURE | Dec 22, 2010 | Abandoned |
Array
(
[id] => 8364179
[patent_doc_number] => 08253248
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-08-28
[patent_title] => 'Fabrication method of semiconductor device having conductive bumps'
[patent_app_type] => utility
[patent_app_number] => 12/956393
[patent_app_country] => US
[patent_app_date] => 2010-11-30
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Array
(
[id] => 8398968
[patent_doc_number] => 08269355
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[patent_issue_date] => 2012-09-18
[patent_title] => 'Flexible contactless wire bonding structure and methodology for semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/941383 | Flexible contactless wire bonding structure and methodology for semiconductor device | Nov 7, 2010 | Issued |
Array
(
[id] => 6036495
[patent_doc_number] => 20110089544
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-21
[patent_title] => 'PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/893103
[patent_app_country] => US
[patent_app_date] => 2010-09-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0089/20110089544.pdf
[firstpage_image] =>[orig_patent_app_number] => 12893103
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/893103 | PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE | Sep 28, 2010 | Abandoned |
Array
(
[id] => 9844957
[patent_doc_number] => 08946877
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-02-03
[patent_title] => 'Semiconductor package including cap'
[patent_app_type] => utility
[patent_app_number] => 12/893044
[patent_app_country] => US
[patent_app_date] => 2010-09-29
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Array
(
[id] => 7717188
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[patent_issue_date] => 2012-01-12
[patent_title] => 'SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF'
[patent_app_type] => utility
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[pdf_file] => publications/A1/0007/20120007233.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/893052 | SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF | Sep 28, 2010 | Abandoned |
Array
(
[id] => 8049683
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[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME'
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[patent_app_number] => 12/892947
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[firstpage_image] =>[orig_patent_app_number] => 12892947
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/892947 | Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same | Sep 28, 2010 | Issued |
Array
(
[id] => 9876064
[patent_doc_number] => 08963337
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[patent_issue_date] => 2015-02-24
[patent_title] => 'Thin wafer support assembly'
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Array
(
[id] => 6114583
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[patent_title] => 'Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element'
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Array
(
[id] => 6027122
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[patent_title] => 'Stress buffer to protect device features'
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Array
(
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Array
(
[id] => 8859161
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Array
(
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Array
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Array
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