
Teresa M. Arroyo
Examiner (ID: 14033, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2822, 2893, 2811, 2829, 2826, 2508, 2503, 2881 |
| Total Applications | 998 |
| Issued Applications | 712 |
| Pending Applications | 86 |
| Abandoned Applications | 215 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5971122
[patent_doc_number] => 20110151622
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-23
[patent_title] => 'Method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/929160
[patent_app_country] => US
[patent_app_date] => 2011-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 9197
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0151/20110151622.pdf
[firstpage_image] =>[orig_patent_app_number] => 12929160
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/929160 | Method of manufacturing semiconductor device | Jan 4, 2011 | Abandoned |
Array
(
[id] => 5979844
[patent_doc_number] => 20110095265
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-28
[patent_title] => 'NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/983708
[patent_app_country] => US
[patent_app_date] => 2011-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 9456
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0095/20110095265.pdf
[firstpage_image] =>[orig_patent_app_number] => 12983708
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/983708 | Nitride semiconductor light emitting device | Jan 2, 2011 | Issued |
Array
(
[id] => 7660260
[patent_doc_number] => 20110309529
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-22
[patent_title] => 'MODULE SUBSTRATE THAT ALLOWS REPLACEMENT OF FAULTY CHIPS, SEMICONDUCTOR MODULE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE'
[patent_app_type] => utility
[patent_app_number] => 12/980533
[patent_app_country] => US
[patent_app_date] => 2010-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6370
[patent_no_of_claims] => 20
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[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0309/20110309529.pdf
[firstpage_image] =>[orig_patent_app_number] => 12980533
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/980533 | Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module | Dec 28, 2010 | Issued |
Array
(
[id] => 9621383
[patent_doc_number] => 08791558
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-07-29
[patent_title] => 'Stacked semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 12/980772
[patent_app_country] => US
[patent_app_date] => 2010-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 4324
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 150
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12980772
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/980772 | Stacked semiconductor package | Dec 28, 2010 | Issued |
Array
(
[id] => 7787805
[patent_doc_number] => 20120049361
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-01
[patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT'
[patent_app_type] => utility
[patent_app_number] => 12/980828
[patent_app_country] => US
[patent_app_date] => 2010-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2729
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0049/20120049361.pdf
[firstpage_image] =>[orig_patent_app_number] => 12980828
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/980828 | SEMICONDUCTOR INTEGRATED CIRCUIT | Dec 28, 2010 | Abandoned |
Array
(
[id] => 9530643
[patent_doc_number] => 08754519
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-06-17
[patent_title] => 'Package for housing semiconductor element and semiconductor device using the same'
[patent_app_type] => utility
[patent_app_number] => 12/978813
[patent_app_country] => US
[patent_app_date] => 2010-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 5017
[patent_no_of_claims] => 8
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[patent_words_short_claim] => 198
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978813
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978813 | Package for housing semiconductor element and semiconductor device using the same | Dec 26, 2010 | Issued |
Array
(
[id] => 9140922
[patent_doc_number] => 08581385
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-11-12
[patent_title] => 'Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same'
[patent_app_type] => utility
[patent_app_number] => 12/979304
[patent_app_country] => US
[patent_app_date] => 2010-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 4803
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 96
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12979304
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/979304 | Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same | Dec 26, 2010 | Issued |
Array
(
[id] => 6153795
[patent_doc_number] => 20110156258
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-30
[patent_title] => 'SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD FOR FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/978943
[patent_app_country] => US
[patent_app_date] => 2010-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3427
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0156/20110156258.pdf
[firstpage_image] =>[orig_patent_app_number] => 12978943
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978943 | SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD FOR FABRICATING THE SAME | Dec 26, 2010 | Abandoned |
Array
(
[id] => 8261879
[patent_doc_number] => 20120161312
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT'
[patent_app_type] => utility
[patent_app_number] => 12/978389
[patent_app_country] => US
[patent_app_date] => 2010-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2979
[patent_no_of_claims] => 17
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978389
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978389 | NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT | Dec 22, 2010 | Abandoned |
Array
(
[id] => 8261891
[patent_doc_number] => 20120161319
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'BALL GRID ARRAY METHOD AND STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 12/978144
[patent_app_country] => US
[patent_app_date] => 2010-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 4627
[patent_no_of_claims] => 26
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978144
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978144 | BALL GRID ARRAY METHOD AND STRUCTURE | Dec 22, 2010 | Abandoned |
Array
(
[id] => 8261897
[patent_doc_number] => 20120161321
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-28
[patent_title] => 'SEMICONDUCTOR DEVICE CONTACTS'
[patent_app_type] => utility
[patent_app_number] => 12/978359
[patent_app_country] => US
[patent_app_date] => 2010-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_claims] => 22
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978359
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978359 | Semiconductor device contacts | Dec 22, 2010 | Issued |
Array
(
[id] => 8364179
[patent_doc_number] => 08253248
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-08-28
[patent_title] => 'Fabrication method of semiconductor device having conductive bumps'
[patent_app_type] => utility
[patent_app_number] => 12/956393
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[patent_app_date] => 2010-11-30
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/956393 | Fabrication method of semiconductor device having conductive bumps | Nov 29, 2010 | Issued |
Array
(
[id] => 8398968
[patent_doc_number] => 08269355
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-09-18
[patent_title] => 'Flexible contactless wire bonding structure and methodology for semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/941383
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/941383 | Flexible contactless wire bonding structure and methodology for semiconductor device | Nov 7, 2010 | Issued |
Array
(
[id] => 6036495
[patent_doc_number] => 20110089544
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-21
[patent_title] => 'PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 12893103
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Array
(
[id] => 9876064
[patent_doc_number] => 08963337
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[patent_kind] => B2
[patent_issue_date] => 2015-02-24
[patent_title] => 'Thin wafer support assembly'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/893355 | Thin wafer support assembly | Sep 28, 2010 | Issued |
Array
(
[id] => 7717188
[patent_doc_number] => 20120007233
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[patent_issue_date] => 2012-01-12
[patent_title] => 'SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF'
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[firstpage_image] =>[orig_patent_app_number] => 12893052
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/893052 | SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF | Sep 28, 2010 | Abandoned |
Array
(
[id] => 8049683
[patent_doc_number] => 20120074573
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/892947 | Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same | Sep 28, 2010 | Issued |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/892622 | Semiconductor structure having a through substrate via (TSV) and method for forming | Sep 27, 2010 | Issued |
Array
(
[id] => 6027122
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[patent_title] => 'Stress buffer to protect device features'
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[firstpage_image] =>[orig_patent_app_number] => 12924445
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/924445 | Stress buffer to protect device features | Sep 27, 2010 | Abandoned |