
Teresa M. Arroyo
Examiner (ID: 7429, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2893, 2826, 2503, 2811, 2829, 2822, 2881, 2508 |
| Total Applications | 972 |
| Issued Applications | 700 |
| Pending Applications | 81 |
| Abandoned Applications | 212 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6021382
[patent_doc_number] => 20110049708
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-03-03
[patent_title] => 'Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same'
[patent_app_type] => utility
[patent_app_number] => 12/870216
[patent_app_country] => US
[patent_app_date] => 2010-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0049/20110049708.pdf
[firstpage_image] =>[orig_patent_app_number] => 12870216
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/870216 | Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same | Aug 26, 2010 | Abandoned |
Array
(
[id] => 7787789
[patent_doc_number] => 20120049345
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-01
[patent_title] => 'SUBSTRATE VIAS FOR HEAT REMOVAL FROM SEMICONDUCTOR DIE'
[patent_app_type] => utility
[patent_app_number] => 12/869844
[patent_app_country] => US
[patent_app_date] => 2010-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[firstpage_image] =>[orig_patent_app_number] => 12869844
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/869844 | Substrate vias for heat removal from semiconductor die | Aug 26, 2010 | Issued |
Array
(
[id] => 7787816
[patent_doc_number] => 20120049372
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-01
[patent_title] => 'TOP TRI-METAL SYSTEM FOR SILICON POWER SEMICONDUCTOR DEVICES'
[patent_app_type] => utility
[patent_app_number] => 12/869940
[patent_app_country] => US
[patent_app_date] => 2010-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[firstpage_image] =>[orig_patent_app_number] => 12869940
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/869940 | Top tri-metal system for silicon power semiconductor devices | Aug 26, 2010 | Issued |
Array
(
[id] => 5955918
[patent_doc_number] => 20110180932
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-07-28
[patent_title] => 'METHOD OF MANUFACTURING LAYERED CHIP PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/869471
[patent_app_country] => US
[patent_app_date] => 2010-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 32
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[firstpage_image] =>[orig_patent_app_number] => 12869471
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/869471 | Method of manufacturing layered chip package | Aug 25, 2010 | Issued |
Array
(
[id] => 6571257
[patent_doc_number] => 20100320581
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-23
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/805914
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0320/20100320581.pdf
[firstpage_image] =>[orig_patent_app_number] => 12805914
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/805914 | Semiconductor device and plurality of dams | Aug 23, 2010 | Issued |
Array
(
[id] => 7716140
[patent_doc_number] => 20120006580
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-01-12
[patent_title] => 'Electrically Conductive Laminate Structures, Electrical Interconnects, And Methods Of Forming Electrical Interconnects'
[patent_app_type] => utility
[patent_app_number] => 12/833074
[patent_app_country] => US
[patent_app_date] => 2010-07-09
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12833074
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/833074 | Electrically conductive laminate structure containing graphene region | Jul 8, 2010 | Issued |
Array
(
[id] => 6052361
[patent_doc_number] => 20110108966
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-05-12
[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/729631
[patent_app_country] => US
[patent_app_date] => 2010-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3193
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0108/20110108966.pdf
[firstpage_image] =>[orig_patent_app_number] => 12729631
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/729631 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF | Mar 22, 2010 | Abandoned |
| 12/712825 | MULTI-CHIP STACKED DEVICES | Feb 24, 2010 | Abandoned |
Array
(
[id] => 8578246
[patent_doc_number] => 08344457
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-01-01
[patent_title] => 'Insulated-gate semiconductor device with protection diode'
[patent_app_type] => utility
[patent_app_number] => 12/711647
[patent_app_country] => US
[patent_app_date] => 2010-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12711647
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/711647 | Insulated-gate semiconductor device with protection diode | Feb 23, 2010 | Issued |
Array
(
[id] => 8528330
[patent_doc_number] => 08304904
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-06
[patent_title] => 'Semiconductor device with solder bump formed on high topography plated Cu pads'
[patent_app_type] => utility
[patent_app_number] => 12/700114
[patent_app_country] => US
[patent_app_date] => 2010-02-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/700114 | Semiconductor device with solder bump formed on high topography plated Cu pads | Feb 3, 2010 | Issued |
Array
(
[id] => 6519542
[patent_doc_number] => 20100123255
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-20
[patent_title] => 'ELECTRONIC PACKAGE STRUCTURE AND METHOD'
[patent_app_type] => utility
[patent_app_number] => 12/693704
[patent_app_country] => US
[patent_app_date] => 2010-01-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0123/20100123255.pdf
[firstpage_image] =>[orig_patent_app_number] => 12693704
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/693704 | Electronic package structure having conductive strip and method | Jan 25, 2010 | Issued |
| 12/692270 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE | Jan 21, 2010 | Abandoned |
Array
(
[id] => 8713825
[patent_doc_number] => 08399967
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[patent_issue_date] => 2013-03-19
[patent_title] => 'Package structure'
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[patent_app_number] => 12/689487
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/689487 | Package structure | Jan 18, 2010 | Issued |
Array
(
[id] => 10577015
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[patent_issue_date] => 2016-03-29
[patent_title] => 'Method of forming an EM protected semiconductor die'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/689137 | Method of forming an EM protected semiconductor die | Jan 17, 2010 | Issued |
Array
(
[id] => 6321335
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[patent_title] => 'Semiconductor packages and electronic systems including the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/656086 | Semiconductor packages and electronic systems including the same | Jan 14, 2010 | Abandoned |
Array
(
[id] => 8785191
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[patent_title] => 'Lead frames with improved adhesion to plastic encapsulant'
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Array
(
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Array
(
[id] => 8422279
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[patent_title] => 'Semiconductor device including wires connecting electrodes to an inner lead'
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Array
(
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[patent_title] => 'Solder Pillars in Flip Chip Assembly'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/687268 | Solder Pillars in Flip Chip Assembly | Jan 13, 2010 | Abandoned |
Array
(
[id] => 6224886
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[firstpage_image] =>[orig_patent_app_number] => 12685977
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/685977 | SEMICONDUCTOR DEVICE | Jan 11, 2010 | Abandoned |