Search

Teresa M. Arroyo

Examiner (ID: 14033, Phone: (571)272-7260 , Office: P/2829 )

Most Active Art Unit
2826
Art Unit(s)
2822, 2893, 2811, 2829, 2826, 2508, 2503, 2881
Total Applications
998
Issued Applications
712
Pending Applications
86
Abandoned Applications
215

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5971122 [patent_doc_number] => 20110151622 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-23 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/929160 [patent_app_country] => US [patent_app_date] => 2011-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 9197 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20110151622.pdf [firstpage_image] =>[orig_patent_app_number] => 12929160 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/929160
Method of manufacturing semiconductor device Jan 4, 2011 Abandoned
Array ( [id] => 5979844 [patent_doc_number] => 20110095265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-28 [patent_title] => 'NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 12/983708 [patent_app_country] => US [patent_app_date] => 2011-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9456 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0095/20110095265.pdf [firstpage_image] =>[orig_patent_app_number] => 12983708 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/983708
Nitride semiconductor light emitting device Jan 2, 2011 Issued
Array ( [id] => 7660260 [patent_doc_number] => 20110309529 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-22 [patent_title] => 'MODULE SUBSTRATE THAT ALLOWS REPLACEMENT OF FAULTY CHIPS, SEMICONDUCTOR MODULE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 12/980533 [patent_app_country] => US [patent_app_date] => 2010-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6370 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0309/20110309529.pdf [firstpage_image] =>[orig_patent_app_number] => 12980533 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/980533
Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module Dec 28, 2010 Issued
Array ( [id] => 9621383 [patent_doc_number] => 08791558 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-29 [patent_title] => 'Stacked semiconductor package' [patent_app_type] => utility [patent_app_number] => 12/980772 [patent_app_country] => US [patent_app_date] => 2010-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4324 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12980772 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/980772
Stacked semiconductor package Dec 28, 2010 Issued
Array ( [id] => 7787805 [patent_doc_number] => 20120049361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-01 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT' [patent_app_type] => utility [patent_app_number] => 12/980828 [patent_app_country] => US [patent_app_date] => 2010-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2729 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0049/20120049361.pdf [firstpage_image] =>[orig_patent_app_number] => 12980828 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/980828
SEMICONDUCTOR INTEGRATED CIRCUIT Dec 28, 2010 Abandoned
Array ( [id] => 9530643 [patent_doc_number] => 08754519 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-17 [patent_title] => 'Package for housing semiconductor element and semiconductor device using the same' [patent_app_type] => utility [patent_app_number] => 12/978813 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 5017 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978813 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/978813
Package for housing semiconductor element and semiconductor device using the same Dec 26, 2010 Issued
Array ( [id] => 9140922 [patent_doc_number] => 08581385 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-12 [patent_title] => 'Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same' [patent_app_type] => utility [patent_app_number] => 12/979304 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 4803 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12979304 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/979304
Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same Dec 26, 2010 Issued
Array ( [id] => 6153795 [patent_doc_number] => 20110156258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-30 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/978943 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3427 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0156/20110156258.pdf [firstpage_image] =>[orig_patent_app_number] => 12978943 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/978943
SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD FOR FABRICATING THE SAME Dec 26, 2010 Abandoned
Array ( [id] => 8261879 [patent_doc_number] => 20120161312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-28 [patent_title] => 'NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT' [patent_app_type] => utility [patent_app_number] => 12/978389 [patent_app_country] => US [patent_app_date] => 2010-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2979 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978389 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/978389
NON-SOLDER METAL BUMPS TO REDUCE PACKAGE HEIGHT Dec 22, 2010 Abandoned
Array ( [id] => 8261891 [patent_doc_number] => 20120161319 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-28 [patent_title] => 'BALL GRID ARRAY METHOD AND STRUCTURE' [patent_app_type] => utility [patent_app_number] => 12/978144 [patent_app_country] => US [patent_app_date] => 2010-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4627 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978144 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/978144
BALL GRID ARRAY METHOD AND STRUCTURE Dec 22, 2010 Abandoned
Array ( [id] => 8261897 [patent_doc_number] => 20120161321 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-28 [patent_title] => 'SEMICONDUCTOR DEVICE CONTACTS' [patent_app_type] => utility [patent_app_number] => 12/978359 [patent_app_country] => US [patent_app_date] => 2010-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5264 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12978359 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/978359
Semiconductor device contacts Dec 22, 2010 Issued
Array ( [id] => 8364179 [patent_doc_number] => 08253248 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-08-28 [patent_title] => 'Fabrication method of semiconductor device having conductive bumps' [patent_app_type] => utility [patent_app_number] => 12/956393 [patent_app_country] => US [patent_app_date] => 2010-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 3763 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 257 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12956393 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/956393
Fabrication method of semiconductor device having conductive bumps Nov 29, 2010 Issued
Array ( [id] => 8398968 [patent_doc_number] => 08269355 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-09-18 [patent_title] => 'Flexible contactless wire bonding structure and methodology for semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/941383 [patent_app_country] => US [patent_app_date] => 2010-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2289 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12941383 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/941383
Flexible contactless wire bonding structure and methodology for semiconductor device Nov 7, 2010 Issued
Array ( [id] => 6036495 [patent_doc_number] => 20110089544 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-21 [patent_title] => 'PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/893103 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3264 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20110089544.pdf [firstpage_image] =>[orig_patent_app_number] => 12893103 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/893103
PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE Sep 28, 2010 Abandoned
Array ( [id] => 9876064 [patent_doc_number] => 08963337 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-24 [patent_title] => 'Thin wafer support assembly' [patent_app_type] => utility [patent_app_number] => 12/893355 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 3043 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12893355 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/893355
Thin wafer support assembly Sep 28, 2010 Issued
Array ( [id] => 7717188 [patent_doc_number] => 20120007233 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-01-12 [patent_title] => 'SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/893052 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2508 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20120007233.pdf [firstpage_image] =>[orig_patent_app_number] => 12893052 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/893052
SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF Sep 28, 2010 Abandoned
Array ( [id] => 8049683 [patent_doc_number] => 20120074573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-29 [patent_title] => 'SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME' [patent_app_type] => utility [patent_app_number] => 12/892947 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 9245 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0074/20120074573.pdf [firstpage_image] =>[orig_patent_app_number] => 12892947 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/892947
Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same Sep 28, 2010 Issued
Array ( [id] => 9844957 [patent_doc_number] => 08946877 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-03 [patent_title] => 'Semiconductor package including cap' [patent_app_type] => utility [patent_app_number] => 12/893044 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6855 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12893044 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/893044
Semiconductor package including cap Sep 28, 2010 Issued
Array ( [id] => 8049689 [patent_doc_number] => 20120074583 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-29 [patent_title] => 'SEMICONDUCTOR STRUCTURE HAVING A THROUGH SUBSTRATE VIA (TSV) AND METHOD FOR FORMING' [patent_app_type] => utility [patent_app_number] => 12/892622 [patent_app_country] => US [patent_app_date] => 2010-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4565 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0074/20120074583.pdf [firstpage_image] =>[orig_patent_app_number] => 12892622 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/892622
Semiconductor structure having a through substrate via (TSV) and method for forming Sep 27, 2010 Issued
Array ( [id] => 6027122 [patent_doc_number] => 20110079908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-07 [patent_title] => 'Stress buffer to protect device features' [patent_app_type] => utility [patent_app_number] => 12/924445 [patent_app_country] => US [patent_app_date] => 2010-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2434 [patent_no_of_claims] => 54 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20110079908.pdf [firstpage_image] =>[orig_patent_app_number] => 12924445 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/924445
Stress buffer to protect device features Sep 27, 2010 Abandoned
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