Search

Teresa M. Arroyo

Examiner (ID: 14033, Phone: (571)272-7260 , Office: P/2829 )

Most Active Art Unit
2826
Art Unit(s)
2822, 2893, 2811, 2829, 2826, 2508, 2503, 2881
Total Applications
998
Issued Applications
712
Pending Applications
86
Abandoned Applications
215

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6321335 [patent_doc_number] => 20100244227 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-30 [patent_title] => 'Semiconductor packages and electronic systems including the same' [patent_app_type] => utility [patent_app_number] => 12/656086 [patent_app_country] => US [patent_app_date] => 2010-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4323 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0244/20100244227.pdf [firstpage_image] =>[orig_patent_app_number] => 12656086 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/656086
Semiconductor packages and electronic systems including the same Jan 14, 2010 Abandoned
Array ( [id] => 8785191 [patent_doc_number] => 08432036 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-04-30 [patent_title] => 'Lead frames with improved adhesion to plastic encapsulant' [patent_app_type] => utility [patent_app_number] => 12/657214 [patent_app_country] => US [patent_app_date] => 2010-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 5632 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12657214 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/657214
Lead frames with improved adhesion to plastic encapsulant Jan 14, 2010 Issued
Array ( [id] => 8422279 [patent_doc_number] => 08278768 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-02 [patent_title] => 'Semiconductor device including wires connecting electrodes to an inner lead' [patent_app_type] => utility [patent_app_number] => 12/687531 [patent_app_country] => US [patent_app_date] => 2010-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 5966 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 286 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12687531 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/687531
Semiconductor device including wires connecting electrodes to an inner lead Jan 13, 2010 Issued
Array ( [id] => 9140952 [patent_doc_number] => 08581417 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-12 [patent_title] => 'Semiconductor device stack with bonding layer and wire retaining member' [patent_app_type] => utility [patent_app_number] => 12/687311 [patent_app_country] => US [patent_app_date] => 2010-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 4972 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12687311 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/687311
Semiconductor device stack with bonding layer and wire retaining member Jan 13, 2010 Issued
Array ( [id] => 6184173 [patent_doc_number] => 20110169158 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-07-14 [patent_title] => 'Solder Pillars in Flip Chip Assembly' [patent_app_type] => utility [patent_app_number] => 12/687268 [patent_app_country] => US [patent_app_date] => 2010-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2748 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0169/20110169158.pdf [firstpage_image] =>[orig_patent_app_number] => 12687268 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/687268
Solder Pillars in Flip Chip Assembly Jan 13, 2010 Abandoned
Array ( [id] => 6224886 [patent_doc_number] => 20100181661 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-22 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/685977 [patent_app_country] => US [patent_app_date] => 2010-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5359 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0181/20100181661.pdf [firstpage_image] =>[orig_patent_app_number] => 12685977 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/685977
SEMICONDUCTOR DEVICE Jan 11, 2010 Abandoned
Array ( [id] => 6615153 [patent_doc_number] => 20100225011 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-09 [patent_title] => 'System and Method for Integrated Circuit Fabrication' [patent_app_type] => utility [patent_app_number] => 12/683528 [patent_app_country] => US [patent_app_date] => 2010-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 4636 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0225/20100225011.pdf [firstpage_image] =>[orig_patent_app_number] => 12683528 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/683528
System and Method for Integrated Circuit Fabrication Jan 6, 2010 Abandoned
Array ( [id] => 6160621 [patent_doc_number] => 20110159310 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-30 [patent_title] => 'Methods of fabricating low melting point solder reinforced sealant and structures formed thereby' [patent_app_type] => utility [patent_app_number] => 12/655407 [patent_app_country] => US [patent_app_date] => 2009-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2174 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0159/20110159310.pdf [firstpage_image] =>[orig_patent_app_number] => 12655407 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/655407
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby Dec 29, 2009 Issued
Array ( [id] => 6083841 [patent_doc_number] => 20110215464 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-09-08 [patent_title] => 'Semiconductor package with embedded die and its methods of fabrication' [patent_app_type] => utility [patent_app_number] => 12/655335 [patent_app_country] => US [patent_app_date] => 2009-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 5138 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0215/20110215464.pdf [firstpage_image] =>[orig_patent_app_number] => 12655335 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/655335
Semiconductor package with embedded die and its methods of fabrication Dec 28, 2009 Issued
Array ( [id] => 6036508 [patent_doc_number] => 20110089557 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-21 [patent_title] => 'Area reduction for die-scale surface mount package chips' [patent_app_type] => utility [patent_app_number] => 12/636474 [patent_app_country] => US [patent_app_date] => 2009-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 13230 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20110089557.pdf [firstpage_image] =>[orig_patent_app_number] => 12636474 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/636474
Area reduction for die-scale surface mount package chips Dec 10, 2009 Abandoned
Array ( [id] => 6098973 [patent_doc_number] => 20110163432 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-07-07 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/935120 [patent_app_country] => US [patent_app_date] => 2009-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4950 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0163/20110163432.pdf [firstpage_image] =>[orig_patent_app_number] => 12935120 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/935120
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Nov 25, 2009 Abandoned
Array ( [id] => 6036493 [patent_doc_number] => 20110089542 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-21 [patent_title] => 'Area reduction for electrical diode chips' [patent_app_type] => utility [patent_app_number] => 12/592489 [patent_app_country] => US [patent_app_date] => 2009-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9199 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20110089542.pdf [firstpage_image] =>[orig_patent_app_number] => 12592489 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/592489
Area reduction for electrical diode chips Nov 24, 2009 Abandoned
Array ( [id] => 6550049 [patent_doc_number] => 20100127401 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-05-27 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/625159 [patent_app_country] => US [patent_app_date] => 2009-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3510 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20100127401.pdf [firstpage_image] =>[orig_patent_app_number] => 12625159 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/625159
SEMICONDUCTOR DEVICE Nov 23, 2009 Abandoned
Array ( [id] => 9497252 [patent_doc_number] => 08736074 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-27 [patent_title] => 'Multi chip semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/624490 [patent_app_country] => US [patent_app_date] => 2009-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 4589 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12624490 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/624490
Multi chip semiconductor device Nov 23, 2009 Issued
Array ( [id] => 8572294 [patent_doc_number] => 08338944 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-12-25 [patent_title] => 'Semiconductor device, semiconductor module, radiating fin and fitting portions' [patent_app_type] => utility [patent_app_number] => 12/623731 [patent_app_country] => US [patent_app_date] => 2009-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4596 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12623731 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/623731
Semiconductor device, semiconductor module, radiating fin and fitting portions Nov 22, 2009 Issued
Array ( [id] => 5996946 [patent_doc_number] => 20110115083 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-19 [patent_title] => 'Semiconductor Package Assembly Systems and Methods using DAM and Trench Structures' [patent_app_type] => utility [patent_app_number] => 12/621839 [patent_app_country] => US [patent_app_date] => 2009-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3358 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20110115083.pdf [firstpage_image] =>[orig_patent_app_number] => 12621839 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/621839
Semiconductor package assembly systems and methods using DAM and trench structures Nov 18, 2009 Issued
Array ( [id] => 9711555 [patent_doc_number] => 08836131 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-16 [patent_title] => 'Semiconductor module with edge termination and process for its fabrication' [patent_app_type] => utility [patent_app_number] => 12/622329 [patent_app_country] => US [patent_app_date] => 2009-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3792 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12622329 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/622329
Semiconductor module with edge termination and process for its fabrication Nov 18, 2009 Issued
Array ( [id] => 10035450 [patent_doc_number] => 09076776 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-07-07 [patent_title] => 'Integrated circuit package with stand-off legs' [patent_app_type] => utility [patent_app_number] => 12/621749 [patent_app_country] => US [patent_app_date] => 2009-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3700 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12621749 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/621749
Integrated circuit package with stand-off legs Nov 18, 2009 Issued
Array ( [id] => 10832031 [patent_doc_number] => 08860204 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-14 [patent_title] => 'Semiconductor device and package with bit cells and power supply electrodes' [patent_app_type] => utility [patent_app_number] => 12/621111 [patent_app_country] => US [patent_app_date] => 2009-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6619 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12621111 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/621111
Semiconductor device and package with bit cells and power supply electrodes Nov 17, 2009 Issued
Array ( [id] => 10870164 [patent_doc_number] => 08895359 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-25 [patent_title] => 'Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus' [patent_app_type] => utility [patent_app_number] => 13/056462 [patent_app_country] => US [patent_app_date] => 2009-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 46 [patent_no_of_words] => 8219 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13056462 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/056462
Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus Nov 5, 2009 Issued
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