Search

Teresa M. Arroyo

Examiner (ID: 7429, Phone: (571)272-7260 , Office: P/2829 )

Most Active Art Unit
2826
Art Unit(s)
2893, 2826, 2503, 2811, 2829, 2822, 2881, 2508
Total Applications
972
Issued Applications
700
Pending Applications
81
Abandoned Applications
212

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4578801 [patent_doc_number] => 07825499 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-02 [patent_title] => 'Semiconductor package and trenched semiconductor power device using the same' [patent_app_type] => utility [patent_app_number] => 12/146924 [patent_app_country] => US [patent_app_date] => 2008-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 6033 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/825/07825499.pdf [firstpage_image] =>[orig_patent_app_number] => 12146924 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/146924
Semiconductor package and trenched semiconductor power device using the same Jun 25, 2008 Issued
Array ( [id] => 5364920 [patent_doc_number] => 20090302479 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-10 [patent_title] => 'SEMICONDUCTOR STRUCTURES HAVING VIAS' [patent_app_type] => utility [patent_app_number] => 12/135014 [patent_app_country] => US [patent_app_date] => 2008-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3341 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0302/20090302479.pdf [firstpage_image] =>[orig_patent_app_number] => 12135014 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/135014
SEMICONDUCTOR STRUCTURES HAVING VIAS Jun 5, 2008 Abandoned
Array ( [id] => 4836917 [patent_doc_number] => 20080277786 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-13 [patent_title] => 'Semiconductor package substrate' [patent_app_type] => utility [patent_app_number] => 12/156874 [patent_app_country] => US [patent_app_date] => 2008-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2371 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0277/20080277786.pdf [firstpage_image] =>[orig_patent_app_number] => 12156874 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/156874
Semiconductor package substrate Jun 4, 2008 Abandoned
Array ( [id] => 8690573 [patent_doc_number] => 08390102 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-05 [patent_title] => 'Optoisolator leadframe assembly' [patent_app_type] => utility [patent_app_number] => 12/153543 [patent_app_country] => US [patent_app_date] => 2008-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 2350 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 367 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12153543 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/153543
Optoisolator leadframe assembly May 20, 2008 Issued
Array ( [id] => 5488283 [patent_doc_number] => 20090289354 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-26 [patent_title] => 'ELECTRONIC MODULE' [patent_app_type] => utility [patent_app_number] => 12/123784 [patent_app_country] => US [patent_app_date] => 2008-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6866 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0289/20090289354.pdf [firstpage_image] =>[orig_patent_app_number] => 12123784 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/123784
Electronic module May 19, 2008 Issued
Array ( [id] => 5549918 [patent_doc_number] => 20090283904 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-19 [patent_title] => 'FLIPCHIP BUMP PATTERNS FOR EFFICIENT I-MESH POWER DISTRIBUTION SCHEMES' [patent_app_type] => utility [patent_app_number] => 12/121363 [patent_app_country] => US [patent_app_date] => 2008-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1989 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20090283904.pdf [firstpage_image] =>[orig_patent_app_number] => 12121363 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/121363
Flipchip bump patterns for efficient I-mesh power distribution schemes May 14, 2008 Issued
Array ( [id] => 8364176 [patent_doc_number] => 08253230 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-08-28 [patent_title] => 'Disabling electrical connections using pass-through 3D interconnects and associated systems and methods' [patent_app_type] => utility [patent_app_number] => 12/121654 [patent_app_country] => US [patent_app_date] => 2008-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4934 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12121654 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/121654
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods May 14, 2008 Issued
Array ( [id] => 5600 [patent_doc_number] => 07812464 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-12 [patent_title] => 'Semiconductor device and a method of manufacturing for high output MOSFET' [patent_app_type] => utility [patent_app_number] => 12/149183 [patent_app_country] => US [patent_app_date] => 2008-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 51 [patent_no_of_words] => 11911 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 349 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/812/07812464.pdf [firstpage_image] =>[orig_patent_app_number] => 12149183 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/149183
Semiconductor device and a method of manufacturing for high output MOSFET Apr 28, 2008 Issued
Array ( [id] => 4433552 [patent_doc_number] => 07969005 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-06-28 [patent_title] => 'Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 12/109811 [patent_app_country] => US [patent_app_date] => 2008-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 8870 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/969/07969005.pdf [firstpage_image] =>[orig_patent_app_number] => 12109811 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/109811
Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor Apr 24, 2008 Issued
Array ( [id] => 4856588 [patent_doc_number] => 20080265438 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-30 [patent_title] => 'LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/109163 [patent_app_country] => US [patent_app_date] => 2008-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 6135 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0265/20080265438.pdf [firstpage_image] =>[orig_patent_app_number] => 12109163 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/109163
LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE Apr 23, 2008 Abandoned
Array ( [id] => 4857962 [patent_doc_number] => 20080266812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-30 [patent_title] => 'Pressure-contact power semiconductor module and method for producing the same' [patent_app_type] => utility [patent_app_number] => 12/080624 [patent_app_country] => US [patent_app_date] => 2008-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2200 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20080266812.pdf [firstpage_image] =>[orig_patent_app_number] => 12080624 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/080624
Pressure-contact power semiconductor module and method for producing the same Apr 3, 2008 Issued
Array ( [id] => 4679936 [patent_doc_number] => 20080246162 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-09 [patent_title] => 'Stack package, a method of manufacturing the stack package, and a digital device having the stack package' [patent_app_type] => utility [patent_app_number] => 12/078694 [patent_app_country] => US [patent_app_date] => 2008-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8379 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20080246162.pdf [firstpage_image] =>[orig_patent_app_number] => 12078694 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/078694
Stack package, a method of manufacturing the stack package, and a digital device having the stack package Apr 3, 2008 Issued
Array ( [id] => 5432247 [patent_doc_number] => 20090166833 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-07-02 [patent_title] => 'SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED TOGETHER' [patent_app_type] => utility [patent_app_number] => 12/061914 [patent_app_country] => US [patent_app_date] => 2008-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1000 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0166/20090166833.pdf [firstpage_image] =>[orig_patent_app_number] => 12061914 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/061914
SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED TOGETHER Apr 2, 2008 Abandoned
Array ( [id] => 4679903 [patent_doc_number] => 20080246129 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-09 [patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/060484 [patent_app_country] => US [patent_app_date] => 2008-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 10159 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20080246129.pdf [firstpage_image] =>[orig_patent_app_number] => 12060484 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/060484
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE Mar 31, 2008 Abandoned
Array ( [id] => 8233272 [patent_doc_number] => 08198714 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-12 [patent_title] => 'Method and system for configuring a transformer embedded in a multi-layer integrated circuit (IC) package' [patent_app_type] => utility [patent_app_number] => 12/057714 [patent_app_country] => US [patent_app_date] => 2008-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5414 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/198/08198714.pdf [firstpage_image] =>[orig_patent_app_number] => 12057714 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/057714
Method and system for configuring a transformer embedded in a multi-layer integrated circuit (IC) package Mar 27, 2008 Issued
Array ( [id] => 5358178 [patent_doc_number] => 20090032972 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-05 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/057914 [patent_app_country] => US [patent_app_date] => 2008-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 13906 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0032/20090032972.pdf [firstpage_image] =>[orig_patent_app_number] => 12057914 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/057914
SEMICONDUCTOR DEVICE Mar 27, 2008 Abandoned
Array ( [id] => 4715374 [patent_doc_number] => 20080237896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'Wafer level packages capable of reducing chipping defect and manufacturing methods thereof' [patent_app_type] => utility [patent_app_number] => 12/076903 [patent_app_country] => US [patent_app_date] => 2008-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8384 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0237/20080237896.pdf [firstpage_image] =>[orig_patent_app_number] => 12076903 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/076903
Encapsulated wafer level package with protection against damage and manufacturing method Mar 24, 2008 Issued
Array ( [id] => 8214956 [patent_doc_number] => 08193614 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-05 [patent_title] => 'Semiconductor device, moisture-resistant frame, groove and method of producing semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/053903 [patent_app_country] => US [patent_app_date] => 2008-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 29 [patent_no_of_words] => 20964 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/193/08193614.pdf [firstpage_image] =>[orig_patent_app_number] => 12053903 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/053903
Semiconductor device, moisture-resistant frame, groove and method of producing semiconductor device Mar 23, 2008 Issued
Array ( [id] => 9255580 [patent_doc_number] => 08619003 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-12-31 [patent_title] => 'Semiconductor device with wireless communication' [patent_app_type] => utility [patent_app_number] => 12/053932 [patent_app_country] => US [patent_app_date] => 2008-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 54 [patent_no_of_words] => 18105 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12053932 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/053932
Semiconductor device with wireless communication Mar 23, 2008 Issued
Array ( [id] => 4433630 [patent_doc_number] => 07969022 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-06-28 [patent_title] => 'Die-to-die wire-bonding' [patent_app_type] => utility [patent_app_number] => 12/053253 [patent_app_country] => US [patent_app_date] => 2008-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4023 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/969/07969022.pdf [firstpage_image] =>[orig_patent_app_number] => 12053253 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/053253
Die-to-die wire-bonding Mar 20, 2008 Issued
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