Teresa M. Arroyo

Array ( [id] => 4570908 [patent_doc_number] => 07847404 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-12-07 [patent_title] => 'Circuit board assembly and packaged integrated circuit device with power and ground channels' [patent_app_type] => utility [patent_app_number] => 12/052234 [patent_app_country] => US [patent_app_date] => 2008-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6011 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 447 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/847/07847404.pdf [firstpage_image] =>[orig_patent_app_number] => 12052234 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4817010 [patent_doc_number] => 20080224269 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-18 [patent_title] => 'Gettering structures and methods and their application' [patent_app_type] => utility [patent_app_number] => 12/073894 [patent_app_country] => US [patent_app_date] => 2008-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 8597 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20080224269.pdf [firstpage_image] =>[orig_patent_app_number] => 12073894 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4715373 [patent_doc_number] => 20080237895 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/073494 [patent_app_country] => US [patent_app_date] => 2008-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3923 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0237/20080237895.pdf [firstpage_image] =>[orig_patent_app_number] => 12073494 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 63666 [patent_doc_number] => 07763966 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-27 [patent_title] => 'Resin molded semiconductor device and differential amplifier circuit' [patent_app_type] => utility [patent_app_number] => 12/073384 [patent_app_country] => US [patent_app_date] => 2008-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 4173 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 349 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/763/07763966.pdf [firstpage_image] =>[orig_patent_app_number] => 12073384 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 82881 [patent_doc_number] => 07745938 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-29 [patent_title] => 'Circuit device, a method for manufacturing a circuit device, and a semiconductor module' [patent_app_type] => utility [patent_app_number] => 12/039054 [patent_app_country] => US [patent_app_date] => 2008-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 7683 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/745/07745938.pdf [firstpage_image] =>[orig_patent_app_number] => 12039054 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4724028 [patent_doc_number] => 20080203569 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-28 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 12/072833 [patent_app_country] => US [patent_app_date] => 2008-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 8344 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0203/20080203569.pdf [firstpage_image] =>[orig_patent_app_number] => 12072833 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4863924 [patent_doc_number] => 20080142983 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-19 [patent_title] => 'DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER' [patent_app_type] => utility [patent_app_number] => 12/036887 [patent_app_country] => US [patent_app_date] => 2008-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3598 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0142/20080142983.pdf [firstpage_image] =>[orig_patent_app_number] => 12036887 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4640030 [patent_doc_number] => 08018057 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-13 [patent_title] => 'Semiconductor device with resin layers and wirings and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/034204 [patent_app_country] => US [patent_app_date] => 2008-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 3763 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/018/08018057.pdf [firstpage_image] =>[orig_patent_app_number] => 12034204 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10118653 [patent_doc_number] => 09153541 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-10-06 [patent_title] => 'Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/032444 [patent_app_country] => US [patent_app_date] => 2008-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 17 [patent_no_of_words] => 4213 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12032444 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 63664 [patent_doc_number] => 07763964 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-27 [patent_title] => 'Semiconductor device and semiconductor module using the same' [patent_app_type] => utility [patent_app_number] => 12/032104 [patent_app_country] => US [patent_app_date] => 2008-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 6001 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 208 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/763/07763964.pdf [firstpage_image] =>[orig_patent_app_number] => 12032104 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4870773 [patent_doc_number] => 20080197507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-21 [patent_title] => 'Electronic package structure and method' [patent_app_type] => utility [patent_app_number] => 12/068773 [patent_app_country] => US [patent_app_date] => 2008-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1757 [patent_no_of_claims] => 46 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20080197507.pdf [firstpage_image] =>[orig_patent_app_number] => 12068773 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4810734 [patent_doc_number] => 20080191365 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-14 [patent_title] => 'Optical semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/068693 [patent_app_country] => US [patent_app_date] => 2008-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 5565 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0191/20080191365.pdf [firstpage_image] =>[orig_patent_app_number] => 12068693 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5282396 [patent_doc_number] => 20090096070 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-16 [patent_title] => 'Semiconductor package and substrate for the same' [patent_app_type] => utility [patent_app_number] => 12/068623 [patent_app_country] => US [patent_app_date] => 2008-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2971 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20090096070.pdf [firstpage_image] =>[orig_patent_app_number] => 12068623 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4829180 [patent_doc_number] => 20080128741 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-05 [patent_title] => 'Leadframe and Semiconductor Package' [patent_app_type] => utility [patent_app_number] => 12/026323 [patent_app_country] => US [patent_app_date] => 2008-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3987 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20080128741.pdf [firstpage_image] =>[orig_patent_app_number] => 12026323 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4789481 [patent_doc_number] => 20080290454 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-27 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/025311 [patent_app_country] => US [patent_app_date] => 2008-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4368 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20080290454.pdf [firstpage_image] =>[orig_patent_app_number] => 12025311 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4597213 [patent_doc_number] => 07982316 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-07-19 [patent_title] => 'Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof' [patent_app_type] => utility [patent_app_number] => 12/025336 [patent_app_country] => US [patent_app_date] => 2008-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 10660 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/982/07982316.pdf [firstpage_image] =>[orig_patent_app_number] => 12025336 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4810696 [patent_doc_number] => 20080191327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-14 [patent_title] => 'LIGHT EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 12/024344 [patent_app_country] => US [patent_app_date] => 2008-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4430 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0191/20080191327.pdf [firstpage_image] =>[orig_patent_app_number] => 12024344 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5524334 [patent_doc_number] => 20090194410 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-06 [patent_title] => 'Electrode of an Integrated Circuit' [patent_app_type] => utility [patent_app_number] => 12/023321 [patent_app_country] => US [patent_app_date] => 2008-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1760 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0194/20090194410.pdf [firstpage_image] =>[orig_patent_app_number] => 12023321 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4952647 [patent_doc_number] => 20080185671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-07 [patent_title] => 'Sensor semiconductor package and fabrication' [patent_app_type] => utility [patent_app_number] => 12/011933 [patent_app_country] => US [patent_app_date] => 2008-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4444 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0185/20080185671.pdf [firstpage_image] =>[orig_patent_app_number] => 12011933 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8375824 [patent_doc_number] => 08258622 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-09-04 [patent_title] => 'Power device package and semiconductor package mold for fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/011844 [patent_app_country] => US [patent_app_date] => 2008-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3596 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12011844 [rel_patent_id] =>[rel_patent_doc_number] =>)