
Teresa M. Arroyo
Examiner (ID: 16908, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2829, 2503, 2508, 2811, 2881, 2826, 2893, 2822 |
| Total Applications | 975 |
| Issued Applications | 702 |
| Pending Applications | 80 |
| Abandoned Applications | 214 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4876976
[patent_doc_number] => 20080150359
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'Semiconductor device and power supply for the same'
[patent_app_type] => utility
[patent_app_number] => 12/000884
[patent_app_country] => US
[patent_app_date] => 2007-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4730
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0150/20080150359.pdf
[firstpage_image] =>[orig_patent_app_number] => 12000884
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/000884 | Semiconductor device and power supply for the same | Dec 17, 2007 | Abandoned |
Array
(
[id] => 5542836
[patent_doc_number] => 20090152713
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL COMPRISED OF OIL OR WAX'
[patent_app_type] => utility
[patent_app_number] => 11/959053
[patent_app_country] => US
[patent_app_date] => 2007-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3440
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20090152713.pdf
[firstpage_image] =>[orig_patent_app_number] => 11959053
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/959053 | INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL COMPRISED OF OIL OR WAX | Dec 17, 2007 | Abandoned |
Array
(
[id] => 4749288
[patent_doc_number] => 20080157359
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component'
[patent_app_type] => utility
[patent_app_number] => 12/000834
[patent_app_country] => US
[patent_app_date] => 2007-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 13355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157359.pdf
[firstpage_image] =>[orig_patent_app_number] => 12000834
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/000834 | Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component | Dec 17, 2007 | Abandoned |
Array
(
[id] => 5542841
[patent_doc_number] => 20090152718
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'STRUCTURE WITH DIE PAD PATTERN'
[patent_app_type] => utility
[patent_app_number] => 11/957838
[patent_app_country] => US
[patent_app_date] => 2007-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4400
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20090152718.pdf
[firstpage_image] =>[orig_patent_app_number] => 11957838
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/957838 | Semiconductor die with die pad pattern | Dec 16, 2007 | Issued |
Array
(
[id] => 4863894
[patent_doc_number] => 20080142953
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-19
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/955668
[patent_app_country] => US
[patent_app_date] => 2007-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2835
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0142/20080142953.pdf
[firstpage_image] =>[orig_patent_app_number] => 11955668
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/955668 | SEMICONDUCTOR DEVICE | Dec 12, 2007 | Abandoned |
Array
(
[id] => 5542750
[patent_doc_number] => 20090152627
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/956097
[patent_app_country] => US
[patent_app_date] => 2007-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4591
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20090152627.pdf
[firstpage_image] =>[orig_patent_app_number] => 11956097
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/956097 | DMOS with high source-drain breakdown voltage, small on- resistance, and high current driving capacity | Dec 12, 2007 | Issued |
Array
(
[id] => 103114
[patent_doc_number] => 07728415
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-01
[patent_title] => 'Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/955710
[patent_app_country] => US
[patent_app_date] => 2007-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 5127
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 235
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/728/07728415.pdf
[firstpage_image] =>[orig_patent_app_number] => 11955710
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/955710 | Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same | Dec 12, 2007 | Issued |
Array
(
[id] => 5542815
[patent_doc_number] => 20090152692
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-18
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKING'
[patent_app_type] => utility
[patent_app_number] => 11/954603
[patent_app_country] => US
[patent_app_date] => 2007-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 6311
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20090152692.pdf
[firstpage_image] =>[orig_patent_app_number] => 11954603
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/954603 | Integrated circuit package system with offset stacking | Dec 11, 2007 | Issued |
Array
(
[id] => 4843192
[patent_doc_number] => 20080179600
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-31
[patent_title] => 'THIN FILM TRANSISTOR, METHOD OF PRODUCING THE SAME, AND DISPLAY DEVICE USING THE THIN FILM TRANSISTOR'
[patent_app_type] => utility
[patent_app_number] => 11/954338
[patent_app_country] => US
[patent_app_date] => 2007-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 7640
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0179/20080179600.pdf
[firstpage_image] =>[orig_patent_app_number] => 11954338
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/954338 | THIN FILM TRANSISTOR, METHOD OF PRODUCING THE SAME, AND DISPLAY DEVICE USING THE THIN FILM TRANSISTOR | Dec 11, 2007 | Abandoned |
Array
(
[id] => 4749261
[patent_doc_number] => 20080157332
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages'
[patent_app_type] => utility
[patent_app_number] => 12/000384
[patent_app_country] => US
[patent_app_date] => 2007-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 4504
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157332.pdf
[firstpage_image] =>[orig_patent_app_number] => 12000384
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/000384 | Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages | Dec 11, 2007 | Abandoned |
Array
(
[id] => 4876576
[patent_doc_number] => 20080149959
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'TRANSPARENT LIGHT EMITTING DIODES'
[patent_app_type] => utility
[patent_app_number] => 11/954154
[patent_app_country] => US
[patent_app_date] => 2007-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 12150
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0149/20080149959.pdf
[firstpage_image] =>[orig_patent_app_number] => 11954154
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/954154 | Transparent light emitting diodes | Dec 10, 2007 | Issued |
Array
(
[id] => 4876566
[patent_doc_number] => 20080149949
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'LEAD FRAME FOR TRANSPARENT AND MIRRORLESS LIGHT EMITTING DIODES'
[patent_app_type] => utility
[patent_app_number] => 11/954163
[patent_app_country] => US
[patent_app_date] => 2007-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 9855
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0149/20080149949.pdf
[firstpage_image] =>[orig_patent_app_number] => 11954163
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/954163 | LEAD FRAME FOR TRANSPARENT AND MIRRORLESS LIGHT EMITTING DIODES | Dec 10, 2007 | Abandoned |
Array
(
[id] => 4743291
[patent_doc_number] => 20080087892
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-17
[patent_title] => 'High Performance Transistor with a Highly Stressed Channel'
[patent_app_type] => utility
[patent_app_number] => 11/950467
[patent_app_country] => US
[patent_app_date] => 2007-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3506
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0087/20080087892.pdf
[firstpage_image] =>[orig_patent_app_number] => 11950467
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/950467 | High performance transistor with a highly stressed channel | Dec 4, 2007 | Issued |
Array
(
[id] => 5346096
[patent_doc_number] => 20090001457
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'Semiconductor structure'
[patent_app_type] => utility
[patent_app_number] => 11/949048
[patent_app_country] => US
[patent_app_date] => 2007-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 1466
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20090001457.pdf
[firstpage_image] =>[orig_patent_app_number] => 11949048
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/949048 | Semiconductor structure | Dec 2, 2007 | Abandoned |
Array
(
[id] => 4536701
[patent_doc_number] => 07872346
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-01-18
[patent_title] => 'Power plane and land pad feature to prevent human metal electrostatic discharge damage'
[patent_app_type] => utility
[patent_app_number] => 11/999193
[patent_app_country] => US
[patent_app_date] => 2007-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 12
[patent_no_of_words] => 4445
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/872/07872346.pdf
[firstpage_image] =>[orig_patent_app_number] => 11999193
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/999193 | Power plane and land pad feature to prevent human metal electrostatic discharge damage | Dec 2, 2007 | Issued |
Array
(
[id] => 5444252
[patent_doc_number] => 20090045478
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-19
[patent_title] => 'CMOS image sensor package structure'
[patent_app_type] => utility
[patent_app_number] => 11/987223
[patent_app_country] => US
[patent_app_date] => 2007-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2535
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20090045478.pdf
[firstpage_image] =>[orig_patent_app_number] => 11987223
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/987223 | CMOS image sensor package structure | Nov 27, 2007 | Abandoned |
Array
(
[id] => 5364905
[patent_doc_number] => 20090302464
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-10
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/312960
[patent_app_country] => US
[patent_app_date] => 2007-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4535
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0302/20090302464.pdf
[firstpage_image] =>[orig_patent_app_number] => 12312960
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/312960 | SEMICONDUCTOR DEVICE | Nov 26, 2007 | Abandoned |
Array
(
[id] => 5275569
[patent_doc_number] => 20090127701
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-21
[patent_title] => 'Thermal attach for electronic device cooling'
[patent_app_type] => utility
[patent_app_number] => 11/985583
[patent_app_country] => US
[patent_app_date] => 2007-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2035
[patent_no_of_claims] => 15
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[patent_words_short_claim] => 0
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0127/20090127701.pdf
[firstpage_image] =>[orig_patent_app_number] => 11985583
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/985583 | Thermal attach for electronic device cooling | Nov 14, 2007 | Abandoned |
Array
(
[id] => 4896863
[patent_doc_number] => 20080116476
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-22
[patent_title] => 'NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/940954
[patent_app_country] => US
[patent_app_date] => 2007-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2892
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20080116476.pdf
[firstpage_image] =>[orig_patent_app_number] => 11940954
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/940954 | Nitride semiconductor light-emitting device | Nov 14, 2007 | Issued |
Array
(
[id] => 4829477
[patent_doc_number] => 20080128908
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-05
[patent_title] => 'Microcircuit package having ductile layer'
[patent_app_type] => utility
[patent_app_number] => 11/983813
[patent_app_country] => US
[patent_app_date] => 2007-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2232
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0128/20080128908.pdf
[firstpage_image] =>[orig_patent_app_number] => 11983813
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/983813 | Microcircuit package having ductile layer | Nov 8, 2007 | Issued |