
Teresa M. Arroyo
Examiner (ID: 7429, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2893, 2826, 2503, 2811, 2829, 2822, 2881, 2508 |
| Total Applications | 972 |
| Issued Applications | 700 |
| Pending Applications | 81 |
| Abandoned Applications | 212 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3947611
[patent_doc_number] => 05982018
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-09
[patent_title] => 'Thin film capacitor coupons for memory modules and multi-chip modules'
[patent_app_type] => 1
[patent_app_number] => 8/862726
[patent_app_country] => US
[patent_app_date] => 1997-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 4754
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 14
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/982/05982018.pdf
[firstpage_image] =>[orig_patent_app_number] => 862726
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/862726 | Thin film capacitor coupons for memory modules and multi-chip modules | May 22, 1997 | Issued |
Array
(
[id] => 4003041
[patent_doc_number] => 05923086
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Apparatus for cooling a semiconductor die'
[patent_app_type] => 1
[patent_app_number] => 8/856267
[patent_app_country] => US
[patent_app_date] => 1997-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4070
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/923/05923086.pdf
[firstpage_image] =>[orig_patent_app_number] => 856267
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/856267 | Apparatus for cooling a semiconductor die | May 13, 1997 | Issued |
Array
(
[id] => 3903644
[patent_doc_number] => 05751031
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-12
[patent_title] => 'Memory and other integrated circuitry having a conductive interconnect line pitch of less than 0.6 micron'
[patent_app_type] => 1
[patent_app_number] => 8/848529
[patent_app_country] => US
[patent_app_date] => 1997-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2351
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/751/05751031.pdf
[firstpage_image] =>[orig_patent_app_number] => 848529
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/848529 | Memory and other integrated circuitry having a conductive interconnect line pitch of less than 0.6 micron | Apr 27, 1997 | Issued |
Array
(
[id] => 4113541
[patent_doc_number] => 06057594
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-02
[patent_title] => 'High power dissipating tape ball grid array package'
[patent_app_type] => 1
[patent_app_number] => 8/842379
[patent_app_country] => US
[patent_app_date] => 1997-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1250
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 142
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/057/06057594.pdf
[firstpage_image] =>[orig_patent_app_number] => 842379
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/842379 | High power dissipating tape ball grid array package | Apr 22, 1997 | Issued |
Array
(
[id] => 3801754
[patent_doc_number] => 05828093
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-27
[patent_title] => 'Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted'
[patent_app_type] => 1
[patent_app_number] => 8/843787
[patent_app_country] => US
[patent_app_date] => 1997-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2844
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/828/05828093.pdf
[firstpage_image] =>[orig_patent_app_number] => 843787
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/843787 | Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted | Apr 20, 1997 | Issued |
Array
(
[id] => 3794932
[patent_doc_number] => 05841198
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-24
[patent_title] => 'Ball grid array package employing solid core solder balls'
[patent_app_type] => 1
[patent_app_number] => 8/837685
[patent_app_country] => US
[patent_app_date] => 1997-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 1160
[patent_no_of_claims] => 6
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/841/05841198.pdf
[firstpage_image] =>[orig_patent_app_number] => 837685
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/837685 | Ball grid array package employing solid core solder balls | Apr 20, 1997 | Issued |
Array
(
[id] => 4214168
[patent_doc_number] => RE036747
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-27
[patent_title] => 'Light-emitting device of gallium nitride compound semiconductor'
[patent_app_type] => 2
[patent_app_number] => 8/844386
[patent_app_country] => US
[patent_app_date] => 1997-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 17
[patent_no_of_words] => 3534
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 16
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/RE/036/RE036747.pdf
[firstpage_image] =>[orig_patent_app_number] => 844386
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/844386 | Light-emitting device of gallium nitride compound semiconductor | Apr 17, 1997 | Issued |
Array
(
[id] => 3780582
[patent_doc_number] => 05808364
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-15
[patent_title] => 'Interconnects using metal spacers'
[patent_app_type] => 1
[patent_app_number] => 8/838371
[patent_app_country] => US
[patent_app_date] => 1997-04-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3397
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/808/05808364.pdf
[firstpage_image] =>[orig_patent_app_number] => 838371
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/838371 | Interconnects using metal spacers | Apr 7, 1997 | Issued |
Array
(
[id] => 3815117
[patent_doc_number] => 05770478
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-23
[patent_title] => 'Integral mesh flat plate cooling method'
[patent_app_type] => 1
[patent_app_number] => 8/837497
[patent_app_country] => US
[patent_app_date] => 1997-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3379
[patent_no_of_claims] => 6
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/770/05770478.pdf
[firstpage_image] =>[orig_patent_app_number] => 837497
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/837497 | Integral mesh flat plate cooling method | Apr 6, 1997 | Issued |
Array
(
[id] => 4068126
[patent_doc_number] => 05895978
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'High density signal multiplexing interposer'
[patent_app_type] => 1
[patent_app_number] => 8/832405
[patent_app_country] => US
[patent_app_date] => 1997-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 2261
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/895/05895978.pdf
[firstpage_image] =>[orig_patent_app_number] => 832405
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/832405 | High density signal multiplexing interposer | Apr 1, 1997 | Issued |
Array
(
[id] => 3779916
[patent_doc_number] => 05808320
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-15
[patent_title] => 'Contact openings and an electronic component formed from the same'
[patent_app_type] => 1
[patent_app_number] => 8/832387
[patent_app_country] => US
[patent_app_date] => 1997-04-02
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/808/05808320.pdf
[firstpage_image] =>[orig_patent_app_number] => 832387
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/832387 | Contact openings and an electronic component formed from the same | Apr 1, 1997 | Issued |
Array
(
[id] => 3837301
[patent_doc_number] => 05814888
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-29
[patent_title] => 'Semiconductor device having a multilayer wiring and the method for fabricating the device'
[patent_app_type] => 1
[patent_app_number] => 8/821489
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[patent_app_date] => 1997-03-21
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/814/05814888.pdf
[firstpage_image] =>[orig_patent_app_number] => 821489
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/821489 | Semiconductor device having a multilayer wiring and the method for fabricating the device | Mar 20, 1997 | Issued |
Array
(
[id] => 3845382
[patent_doc_number] => 05847453
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Microwave circuit package'
[patent_app_type] => 1
[patent_app_number] => 8/820817
[patent_app_country] => US
[patent_app_date] => 1997-03-19
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/847/05847453.pdf
[firstpage_image] =>[orig_patent_app_number] => 820817
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/820817 | Microwave circuit package | Mar 18, 1997 | Issued |
Array
(
[id] => 3820894
[patent_doc_number] => 05789806
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-04
[patent_title] => 'Leadframe including bendable support arms for downsetting a die attach pad'
[patent_app_type] => 1
[patent_app_number] => 8/820699
[patent_app_country] => US
[patent_app_date] => 1997-03-18
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/789/05789806.pdf
[firstpage_image] =>[orig_patent_app_number] => 820699
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/820699 | Leadframe including bendable support arms for downsetting a die attach pad | Mar 17, 1997 | Issued |
Array
(
[id] => 3776216
[patent_doc_number] => 05773884
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-30
[patent_title] => 'Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto'
[patent_app_type] => 1
[patent_app_number] => 8/811070
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[patent_app_date] => 1997-03-03
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[pdf_file] => patents/05/773/05773884.pdf
[firstpage_image] =>[orig_patent_app_number] => 811070
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/811070 | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | Mar 2, 1997 | Issued |
Array
(
[id] => 3972797
[patent_doc_number] => 05886408
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-23
[patent_title] => 'Multi-chip semiconductor device'
[patent_app_type] => 1
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[pdf_file] => patents/05/886/05886408.pdf
[firstpage_image] =>[orig_patent_app_number] => 808811
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808811 | Multi-chip semiconductor device | Feb 27, 1997 | Issued |
Array
(
[id] => 4013707
[patent_doc_number] => 05889326
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-30
[patent_title] => 'Structure for bonding semiconductor device to substrate'
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[pdf_file] => patents/05/889/05889326.pdf
[firstpage_image] =>[orig_patent_app_number] => 804977
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/804977 | Structure for bonding semiconductor device to substrate | Feb 26, 1997 | Issued |
Array
(
[id] => 4187346
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[patent_kind] => NA
[patent_issue_date] => 2000-02-01
[patent_title] => 'Electronic component including an adjustable cap'
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[pdf_file] => patents/06/020/06020632.pdf
[firstpage_image] =>[orig_patent_app_number] => 806815
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/806815 | Electronic component including an adjustable cap | Feb 25, 1997 | Issued |
Array
(
[id] => 4263071
[patent_doc_number] => 06137812
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-10-24
[patent_title] => 'Multiple cavity fiber fabry-perot lasers'
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[pdf_file] => patents/06/137/06137812.pdf
[firstpage_image] =>[orig_patent_app_number] => 805461
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/805461 | Multiple cavity fiber fabry-perot lasers | Feb 24, 1997 | Issued |
Array
(
[id] => 4013816
[patent_doc_number] => 05889332
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-30
[patent_title] => 'Area matched package'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/889/05889332.pdf
[firstpage_image] =>[orig_patent_app_number] => 802965
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/802965 | Area matched package | Feb 20, 1997 | Issued |