Teresa M. Arroyo

Array ( [id] => 3866110 [patent_doc_number] => 05796169 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-18 [patent_title] => 'Structurally reinforced ball grid array semiconductor package and systems' [patent_app_type] => 1 [patent_app_number] => 8/752418 [patent_app_country] => US [patent_app_date] => 1996-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3042 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/796/05796169.pdf [firstpage_image] =>[orig_patent_app_number] => 752418 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3874729 [patent_doc_number] => 05838061 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-17 [patent_title] => 'Semiconductor package including a semiconductor chip adhesively bonded thereto' [patent_app_type] => 1 [patent_app_number] => 8/751615 [patent_app_country] => US [patent_app_date] => 1996-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 2972 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/838/05838061.pdf [firstpage_image] =>[orig_patent_app_number] => 751615 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3933504 [patent_doc_number] => 05877561 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Plate and column type semiconductor package having heat sink' [patent_app_type] => 1 [patent_app_number] => 8/749963 [patent_app_country] => US [patent_app_date] => 1996-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2042 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/877/05877561.pdf [firstpage_image] =>[orig_patent_app_number] => 749963 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3932232 [patent_doc_number] => 05952726 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-14 [patent_title] => 'Flip chip bump distribution on die' [patent_app_type] => 1 [patent_app_number] => 8/747325 [patent_app_country] => US [patent_app_date] => 1996-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 5651 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/952/05952726.pdf [firstpage_image] =>[orig_patent_app_number] => 747325 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3802332 [patent_doc_number] => 05828134 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-27 [patent_title] => 'Metallization to improve electromigration resistance' [patent_app_type] => 1 [patent_app_number] => 8/746436 [patent_app_country] => US [patent_app_date] => 1996-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 18 [patent_no_of_words] => 1952 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/828/05828134.pdf [firstpage_image] =>[orig_patent_app_number] => 746436 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3892409 [patent_doc_number] => 05894172 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-13 [patent_title] => 'Semiconductor device with identification function' [patent_app_type] => 1 [patent_app_number] => 8/745273 [patent_app_country] => US [patent_app_date] => 1996-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 33 [patent_no_of_words] => 6169 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/894/05894172.pdf [firstpage_image] =>[orig_patent_app_number] => 745273 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3882978 [patent_doc_number] => 05804880 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Solder isolating lead frame' [patent_app_type] => 1 [patent_app_number] => 8/740835 [patent_app_country] => US [patent_app_date] => 1996-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 3960 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804880.pdf [firstpage_image] =>[orig_patent_app_number] => 740835 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3980892 [patent_doc_number] => 05917241 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-29 [patent_title] => 'High frequency semiconductor device having source, drain, and gate leads' [patent_app_type] => 1 [patent_app_number] => 8/738845 [patent_app_country] => US [patent_app_date] => 1996-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3826 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/917/05917241.pdf [firstpage_image] =>[orig_patent_app_number] => 738845 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4027269 [patent_doc_number] => 05925929 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-20 [patent_title] => 'Cooling apparatus for electronic elements' [patent_app_type] => 1 [patent_app_number] => 8/738710 [patent_app_country] => US [patent_app_date] => 1996-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 3413 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/925/05925929.pdf [firstpage_image] =>[orig_patent_app_number] => 738710 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4009708 [patent_doc_number] => 06005289 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-12-21 [patent_title] => 'Package for semiconductor device laminated printed circuit boards' [patent_app_type] => 1 [patent_app_number] => 8/738935 [patent_app_country] => US [patent_app_date] => 1996-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 41 [patent_figures_cnt] => 59 [patent_no_of_words] => 9429 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/005/06005289.pdf [firstpage_image] =>[orig_patent_app_number] => 738935 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4080583 [patent_doc_number] => 05965941 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-12 [patent_title] => 'Use of dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing' [patent_app_type] => 1 [patent_app_number] => 8/734501 [patent_app_country] => US [patent_app_date] => 1996-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 4104 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/965/05965941.pdf [firstpage_image] =>[orig_patent_app_number] => 734501 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3816139 [patent_doc_number] => 05811883 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-22 [patent_title] => 'Design for flip chip joint pad/LGA pad' [patent_app_type] => 1 [patent_app_number] => 8/724175 [patent_app_country] => US [patent_app_date] => 1996-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2684 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/811/05811883.pdf [firstpage_image] =>[orig_patent_app_number] => 724175 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3845356 [patent_doc_number] => 05847451 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Multi-layered printed circuit board, and grid array package adopting the same' [patent_app_type] => 1 [patent_app_number] => 8/721793 [patent_app_country] => US [patent_app_date] => 1996-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 44 [patent_figures_cnt] => 79 [patent_no_of_words] => 9593 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847451.pdf [firstpage_image] =>[orig_patent_app_number] => 721793 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3653376 [patent_doc_number] => 05640048 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-17 [patent_title] => 'Ball grid array package for a integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/718220 [patent_app_country] => US [patent_app_date] => 1996-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5403 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/640/05640048.pdf [firstpage_image] =>[orig_patent_app_number] => 718220 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3972674 [patent_doc_number] => 05886399 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-23 [patent_title] => 'Lead frame and integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/714307 [patent_app_country] => US [patent_app_date] => 1996-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 5587 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/886/05886399.pdf [firstpage_image] =>[orig_patent_app_number] => 714307 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3866019 [patent_doc_number] => 05796162 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-18 [patent_title] => 'Frames locking method for packaging semiconductor chip' [patent_app_type] => 1 [patent_app_number] => 8/710455 [patent_app_country] => US [patent_app_date] => 1996-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3151 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 232 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/796/05796162.pdf [firstpage_image] =>[orig_patent_app_number] => 710455 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3904101 [patent_doc_number] => 05751063 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Multi-chip module' [patent_app_type] => 1 [patent_app_number] => 8/714675 [patent_app_country] => US [patent_app_date] => 1996-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 4629 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751063.pdf [firstpage_image] =>[orig_patent_app_number] => 714675 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3933254 [patent_doc_number] => 05877543 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Device assembly structure with reinforced outer leads' [patent_app_type] => 1 [patent_app_number] => 8/713155 [patent_app_country] => US [patent_app_date] => 1996-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3725 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/877/05877543.pdf [firstpage_image] =>[orig_patent_app_number] => 713155 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3932029 [patent_doc_number] => 05952711 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-14 [patent_title] => 'Lead finger immobilization apparatus' [patent_app_type] => 1 [patent_app_number] => 8/713169 [patent_app_country] => US [patent_app_date] => 1996-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2744 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/952/05952711.pdf [firstpage_image] =>[orig_patent_app_number] => 713169 [rel_patent_id] =>[rel_patent_doc_number] =>)