
Teresa M. Arroyo
Examiner (ID: 7429, Phone: (571)272-7260 , Office: P/2829 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2893, 2826, 2503, 2811, 2829, 2822, 2881, 2508 |
| Total Applications | 972 |
| Issued Applications | 700 |
| Pending Applications | 81 |
| Abandoned Applications | 212 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 3750856
[patent_doc_number] => 05717248
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-10
[patent_title] => 'Cooling and screening device having contact pins for an integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 8/704649
[patent_app_country] => US
[patent_app_date] => 1996-09-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 2169
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 192
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/717/05717248.pdf
[firstpage_image] =>[orig_patent_app_number] => 704649
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/704649 | Cooling and screening device having contact pins for an integrated circuit | Sep 11, 1996 | Issued |
Array
(
[id] => 3736470
[patent_doc_number] => 05666008
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-09
[patent_title] => 'Flip chip semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/708559
[patent_app_country] => US
[patent_app_date] => 1996-09-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/666/05666008.pdf
[firstpage_image] =>[orig_patent_app_number] => 708559
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/708559 | Flip chip semiconductor device | Sep 5, 1996 | Issued |
Array
(
[id] => 3847467
[patent_doc_number] => 05708304
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[patent_kind] => NA
[patent_issue_date] => 1998-01-13
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/708615
[patent_app_country] => US
[patent_app_date] => 1996-09-05
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[firstpage_image] =>[orig_patent_app_number] => 708615
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/708615 | Semiconductor device | Sep 4, 1996 | Issued |
Array
(
[id] => 3836013
[patent_doc_number] => 05739586
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-14
[patent_title] => 'Heat sink assembly including a printed wiring board and a metal case'
[patent_app_type] => 1
[patent_app_number] => 8/705609
[patent_app_country] => US
[patent_app_date] => 1996-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3129
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[pdf_file] => patents/05/739/05739586.pdf
[firstpage_image] =>[orig_patent_app_number] => 705609
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/705609 | Heat sink assembly including a printed wiring board and a metal case | Aug 29, 1996 | Issued |
Array
(
[id] => 3987769
[patent_doc_number] => 05861666
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-19
[patent_title] => 'Stacked chip assembly'
[patent_app_type] => 1
[patent_app_number] => 8/705309
[patent_app_country] => US
[patent_app_date] => 1996-08-29
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[pdf_file] => patents/05/861/05861666.pdf
[firstpage_image] =>[orig_patent_app_number] => 705309
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/705309 | Stacked chip assembly | Aug 28, 1996 | Issued |
Array
(
[id] => 3776308
[patent_doc_number] => 05773890
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-30
[patent_title] => 'Semiconductor device that prevents peeling of a titanium nitride film'
[patent_app_type] => 1
[patent_app_number] => 8/703533
[patent_app_country] => US
[patent_app_date] => 1996-08-27
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[pdf_file] => patents/05/773/05773890.pdf
[firstpage_image] =>[orig_patent_app_number] => 703533
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/703533 | Semiconductor device that prevents peeling of a titanium nitride film | Aug 26, 1996 | Issued |
Array
(
[id] => 3865121
[patent_doc_number] => 05793109
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-11
[patent_title] => 'Structure of ohmic electrode for semiconductor by atomic layer doping'
[patent_app_type] => 1
[patent_app_number] => 8/703105
[patent_app_country] => US
[patent_app_date] => 1996-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/05/793/05793109.pdf
[firstpage_image] =>[orig_patent_app_number] => 703105
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/703105 | Structure of ohmic electrode for semiconductor by atomic layer doping | Aug 25, 1996 | Issued |
Array
(
[id] => 3821451
[patent_doc_number] => 05770888
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-23
[patent_title] => 'Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package'
[patent_app_type] => 1
[patent_app_number] => 8/701949
[patent_app_country] => US
[patent_app_date] => 1996-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2050
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[pdf_file] => patents/05/770/05770888.pdf
[firstpage_image] =>[orig_patent_app_number] => 701949
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/701949 | Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package | Aug 22, 1996 | Issued |
Array
(
[id] => 3933268
[patent_doc_number] => 05877544
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-02
[patent_title] => 'Electronic micropackage for an electronic memory card'
[patent_app_type] => 1
[patent_app_number] => 8/698581
[patent_app_country] => US
[patent_app_date] => 1996-08-15
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[pdf_file] => patents/05/877/05877544.pdf
[firstpage_image] =>[orig_patent_app_number] => 698581
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/698581 | Electronic micropackage for an electronic memory card | Aug 14, 1996 | Issued |
Array
(
[id] => 3909415
[patent_doc_number] => 05898225
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-27
[patent_title] => 'Lead frame bonding power distribution systems'
[patent_app_type] => 1
[patent_app_number] => 8/696399
[patent_app_country] => US
[patent_app_date] => 1996-08-14
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/898/05898225.pdf
[firstpage_image] =>[orig_patent_app_number] => 696399
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/696399 | Lead frame bonding power distribution systems | Aug 13, 1996 | Issued |
Array
(
[id] => 3698726
[patent_doc_number] => 05679982
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-10-21
[patent_title] => 'Barrier against metal diffusion'
[patent_app_type] => 1
[patent_app_number] => 8/695970
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[pdf_file] => patents/05/679/05679982.pdf
[firstpage_image] =>[orig_patent_app_number] => 695970
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/695970 | Barrier against metal diffusion | Aug 12, 1996 | Issued |
Array
(
[id] => 4068113
[patent_doc_number] => 05895977
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'Bond pad functional layout on die to improve package manufacturability and assembly'
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[pdf_file] => patents/05/895/05895977.pdf
[firstpage_image] =>[orig_patent_app_number] => 694929
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Array
(
[id] => 3746123
[patent_doc_number] => 05786630
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-28
[patent_title] => 'Multi-layer C4 flip-chip substrate'
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[firstpage_image] =>[orig_patent_app_number] => 693397
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/693397 | Multi-layer C4 flip-chip substrate | Aug 6, 1996 | Issued |
Array
(
[id] => 4009745
[patent_doc_number] => 06005290
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-21
[patent_title] => 'Multi chip module having self limiting contact members'
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[pdf_file] => patents/06/005/06005290.pdf
[firstpage_image] =>[orig_patent_app_number] => 691759
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/691759 | Multi chip module having self limiting contact members | Aug 1, 1996 | Issued |
Array
(
[id] => 3750818
[patent_doc_number] => 05717246
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[patent_title] => 'Hybrid frame with lead-lock tape'
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[firstpage_image] =>[orig_patent_app_number] => 681885
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/681885 | Hybrid frame with lead-lock tape | Jul 28, 1996 | Issued |
Array
(
[id] => 3812773
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[patent_title] => 'Vertical-type transistor device, having a bump electrode that has a shape with no interior angle exceeding 270.degree.'
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[firstpage_image] =>[orig_patent_app_number] => 685671
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Array
(
[id] => 4227740
[patent_doc_number] => 06011299
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[patent_issue_date] => 2000-01-04
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Array
(
[id] => 4223215
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Array
(
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Array
(
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[pdf_file] => patents/05/670/05670823.pdf
[firstpage_image] =>[orig_patent_app_number] => 671105
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/671105 | Integrated circuit barrier structure | Jun 27, 1996 | Issued |