Teresa M. Arroyo

Array ( [id] => 3788955 [patent_doc_number] => 05821625 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-13 [patent_title] => 'Structure of chip on chip mounting preventing from crosstalk noise' [patent_app_type] => 1 [patent_app_number] => 8/636651 [patent_app_country] => US [patent_app_date] => 1996-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 42 [patent_no_of_words] => 6705 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/821/05821625.pdf [firstpage_image] =>[orig_patent_app_number] => 636651 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3821009 [patent_doc_number] => 05789815 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-04 [patent_title] => 'Three dimensional semiconductor package having flexible appendages' [patent_app_type] => 1 [patent_app_number] => 8/636483 [patent_app_country] => US [patent_app_date] => 1996-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2940 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/789/05789815.pdf [firstpage_image] =>[orig_patent_app_number] => 636483 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3816046 [patent_doc_number] => 05811876 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-22 [patent_title] => 'Semiconductor device with film carrier package structure' [patent_app_type] => 1 [patent_app_number] => 8/636864 [patent_app_country] => US [patent_app_date] => 1996-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 31 [patent_no_of_words] => 5588 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/811/05811876.pdf [firstpage_image] =>[orig_patent_app_number] => 636864 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3799848 [patent_doc_number] => 05780928 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-14 [patent_title] => 'Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/631704 [patent_app_country] => US [patent_app_date] => 1996-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 18 [patent_no_of_words] => 11925 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 293 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/780/05780928.pdf [firstpage_image] =>[orig_patent_app_number] => 631704 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4020278 [patent_doc_number] => 05880530 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-09 [patent_title] => 'Multiregion solder interconnection structure' [patent_app_type] => 1 [patent_app_number] => 8/625797 [patent_app_country] => US [patent_app_date] => 1996-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2597 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/880/05880530.pdf [firstpage_image] =>[orig_patent_app_number] => 625797 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3874743 [patent_doc_number] => 05838062 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-17 [patent_title] => 'Corrosion-resistant lead frame' [patent_app_type] => 1 [patent_app_number] => 8/625517 [patent_app_country] => US [patent_app_date] => 1996-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 2461 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/838/05838062.pdf [firstpage_image] =>[orig_patent_app_number] => 625517 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3746061 [patent_doc_number] => 05786626 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-28 [patent_title] => 'Thin radio frequency transponder with leadframe antenna structure' [patent_app_type] => 1 [patent_app_number] => 8/621784 [patent_app_country] => US [patent_app_date] => 1996-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 28 [patent_no_of_words] => 6879 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/786/05786626.pdf [firstpage_image] =>[orig_patent_app_number] => 621784 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3812171 [patent_doc_number] => 05854508 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-29 [patent_title] => 'Semiconductor memory device having zigzag bonding pad arrangement' [patent_app_type] => 1 [patent_app_number] => 8/618381 [patent_app_country] => US [patent_app_date] => 1996-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 117 [patent_figures_cnt] => 162 [patent_no_of_words] => 50426 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/854/05854508.pdf [firstpage_image] =>[orig_patent_app_number] => 618381 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3892682 [patent_doc_number] => 05777380 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-07 [patent_title] => 'Resin sealing type semiconductor device having thin portions formed on the leads' [patent_app_type] => 1 [patent_app_number] => 8/615869 [patent_app_country] => US [patent_app_date] => 1996-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 14 [patent_no_of_words] => 7865 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/777/05777380.pdf [firstpage_image] =>[orig_patent_app_number] => 615869 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3879535 [patent_doc_number] => 05763952 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-09 [patent_title] => 'Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same' [patent_app_type] => 1 [patent_app_number] => 8/606243 [patent_app_country] => US [patent_app_date] => 1996-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 21 [patent_no_of_words] => 13565 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 24 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/763/05763952.pdf [firstpage_image] =>[orig_patent_app_number] => 606243 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3633385 [patent_doc_number] => 05686761 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-11 [patent_title] => 'Production worthy interconnect process for deep sub-half micrometer back-end-of-line technology' [patent_app_type] => 1 [patent_app_number] => 8/608913 [patent_app_country] => US [patent_app_date] => 1996-02-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2826 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/686/05686761.pdf [firstpage_image] =>[orig_patent_app_number] => 608913 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4151011 [patent_doc_number] => RE036613 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-14 [patent_title] => 'Multi-chip stacked devices' [patent_app_type] => 2 [patent_app_number] => 8/610127 [patent_app_country] => US [patent_app_date] => 1996-02-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1785 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 25 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/036/RE036613.pdf [firstpage_image] =>[orig_patent_app_number] => 610127 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3947776 [patent_doc_number] => 05982028 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-09 [patent_title] => 'Semiconductor device with good thermal behavior' [patent_app_type] => 1 [patent_app_number] => 8/608491 [patent_app_country] => US [patent_app_date] => 1996-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2692 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/982/05982028.pdf [firstpage_image] =>[orig_patent_app_number] => 608491 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3847326 [patent_doc_number] => 05708294 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-13 [patent_title] => 'Lead frame having oblique slits on a die pad' [patent_app_type] => 1 [patent_app_number] => 8/605497 [patent_app_country] => US [patent_app_date] => 1996-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2699 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/708/05708294.pdf [firstpage_image] =>[orig_patent_app_number] => 605497 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3831165 [patent_doc_number] => 05783865 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-21 [patent_title] => 'Wiring substrate and semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/602423 [patent_app_country] => US [patent_app_date] => 1996-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 7140 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/783/05783865.pdf [firstpage_image] =>[orig_patent_app_number] => 602423 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3702388 [patent_doc_number] => 05677570 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-10-14 [patent_title] => 'Semiconductor integrated circuit devices for high-speed or high frequency' [patent_app_type] => 1 [patent_app_number] => 8/602291 [patent_app_country] => US [patent_app_date] => 1996-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 4039 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/677/05677570.pdf [firstpage_image] =>[orig_patent_app_number] => 602291 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3896561 [patent_doc_number] => 05834849 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'High density integrated circuit pad structures' [patent_app_type] => 1 [patent_app_number] => 8/600339 [patent_app_country] => US [patent_app_date] => 1996-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 1731 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834849.pdf [firstpage_image] =>[orig_patent_app_number] => 600339 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3653335 [patent_doc_number] => 05640045 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-06-17 [patent_title] => 'Thermal stress minimization in power semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/597679 [patent_app_country] => US [patent_app_date] => 1996-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3754 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/640/05640045.pdf [firstpage_image] =>[orig_patent_app_number] => 597679 [rel_patent_id] =>[rel_patent_doc_number] =>)