Search

Thanh Y. Tran

Examiner (ID: 12125, Phone: (571)272-2110 , Office: P/2817 )

Most Active Art Unit
2817
Art Unit(s)
2841, 2892, 2829, 2827, 2817, 2822
Total Applications
1667
Issued Applications
1365
Pending Applications
115
Abandoned Applications
213

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18679997 [patent_doc_number] => 20230317655 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND METHOD OF MANUFACTURING THE MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 18/328359 [patent_app_country] => US [patent_app_date] => 2023-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16585 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18328359 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/328359
Memory device including memory chip and peripheral memory chip and method of manufacturing the memory device Jun 1, 2023 Issued
Array ( [id] => 18868088 [patent_doc_number] => 20230422525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE [patent_app_type] => utility [patent_app_number] => 18/203666 [patent_app_country] => US [patent_app_date] => 2023-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5860 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18203666 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/203666
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE May 30, 2023 Pending
Array ( [id] => 20523393 [patent_doc_number] => 20260047507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2026-02-12 [patent_title] => SYSTEMS AND METHODS FOR MASSIVELY PARALLEL CHIP INTEGRATION [patent_app_type] => utility [patent_app_number] => 18/324884 [patent_app_country] => US [patent_app_date] => 2023-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324884 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/324884
SYSTEMS AND METHODS FOR MASSIVELY PARALLEL CHIP INTEGRATION May 25, 2023 Pending
Array ( [id] => 20418325 [patent_doc_number] => 12501629 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Three-dimensional semiconductor memory device and electronic system including the same [patent_app_type] => utility [patent_app_number] => 18/323440 [patent_app_country] => US [patent_app_date] => 2023-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 26 [patent_no_of_words] => 9324 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18323440 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/323440
Three-dimensional semiconductor memory device and electronic system including the same May 24, 2023 Issued
Array ( [id] => 19604849 [patent_doc_number] => 20240395729 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-28 [patent_title] => CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/202057 [patent_app_country] => US [patent_app_date] => 2023-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7364 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18202057 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/202057
Chip package structure and method for preventing warpage of chip package structure May 24, 2023 Issued
Array ( [id] => 20418325 [patent_doc_number] => 12501629 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Three-dimensional semiconductor memory device and electronic system including the same [patent_app_type] => utility [patent_app_number] => 18/323440 [patent_app_country] => US [patent_app_date] => 2023-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 26 [patent_no_of_words] => 9324 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18323440 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/323440
Three-dimensional semiconductor memory device and electronic system including the same May 24, 2023 Issued
Array ( [id] => 20869758 [patent_doc_number] => 12696676 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-07-28 [patent_title] => Electrical planarization of carbon nanotube thin films for electronic device applications [patent_app_type] => utility [patent_app_number] => 18/199513 [patent_app_country] => US [patent_app_date] => 2023-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 0 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18199513 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/199513
ELECTRICAL PLANARIZATION OF CARBON NANOTUBE THIN FILMS FOR ELECTRONIC DEVICE APPLICATIONS May 18, 2023 Issued
Array ( [id] => 18959091 [patent_doc_number] => 20240047418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/199553 [patent_app_country] => US [patent_app_date] => 2023-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6698 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18199553 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/199553
SEMICONDUCTOR PACKAGE May 18, 2023 Pending
Array ( [id] => 19589890 [patent_doc_number] => 20240387447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/318240 [patent_app_country] => US [patent_app_date] => 2023-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8062 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318240 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/318240
Semiconductor device and method for forming the same May 15, 2023 Issued
Array ( [id] => 20375277 [patent_doc_number] => 12482721 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-25 [patent_title] => Semiconductor package including heat dissipation structure [patent_app_type] => utility [patent_app_number] => 18/197998 [patent_app_country] => US [patent_app_date] => 2023-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 7936 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18197998 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/197998
Semiconductor package including heat dissipation structure May 15, 2023 Issued
Array ( [id] => 18868087 [patent_doc_number] => 20230422524 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF [patent_app_type] => utility [patent_app_number] => 18/196247 [patent_app_country] => US [patent_app_date] => 2023-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16791 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18196247 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/196247
Three-dimensional memory devices and fabricating methods thereof May 10, 2023 Issued
Array ( [id] => 19023171 [patent_doc_number] => 20240079342 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/195429 [patent_app_country] => US [patent_app_date] => 2023-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7552 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195429 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/195429
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME May 9, 2023 Pending
Array ( [id] => 19765909 [patent_doc_number] => 12224210 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-11 [patent_title] => Method for FinFet fabrication and structure thereof [patent_app_type] => utility [patent_app_number] => 18/313783 [patent_app_country] => US [patent_app_date] => 2023-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7815 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313783 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/313783
Method for FinFet fabrication and structure thereof May 7, 2023 Issued
Array ( [id] => 20668772 [patent_doc_number] => 12610562 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-21 [patent_title] => Methods of forming bonding structures [patent_app_type] => utility [patent_app_number] => 18/313786 [patent_app_country] => US [patent_app_date] => 2023-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 5856 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313786 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/313786
Methods of forming bonding structures May 7, 2023 Issued
Array ( [id] => 19539452 [patent_doc_number] => 12132009 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-29 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/143932 [patent_app_country] => US [patent_app_date] => 2023-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 7750 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 265 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18143932 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/143932
Semiconductor package May 4, 2023 Issued
Array ( [id] => 18757639 [patent_doc_number] => 20230361102 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => ON CHIP INDUCTORS [patent_app_type] => utility [patent_app_number] => 18/142801 [patent_app_country] => US [patent_app_date] => 2023-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2858 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 19 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18142801 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/142801
On chip inductors May 2, 2023 Issued
Array ( [id] => 19087904 [patent_doc_number] => 20240114705 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-04 [patent_title] => PHASE CHANGE MATERIAL SWITCH FOR LOW POWER CONSUMPTION AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/310556 [patent_app_country] => US [patent_app_date] => 2023-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10519 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18310556 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/310556
PHASE CHANGE MATERIAL SWITCH FOR LOW POWER CONSUMPTION AND METHODS FOR FORMING THE SAME May 1, 2023 Pending
Array ( [id] => 18868083 [patent_doc_number] => 20230422520 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-28 [patent_title] => THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF [patent_app_type] => utility [patent_app_number] => 18/141274 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 21865 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141274 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/141274
Three-dimensional memory devices and fabricating methods thereof Apr 27, 2023 Issued
Array ( [id] => 19138060 [patent_doc_number] => 11973035 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Semiconductor memory device and electronic system including the same [patent_app_type] => utility [patent_app_number] => 18/135766 [patent_app_country] => US [patent_app_date] => 2023-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9357 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18135766 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/135766
Semiconductor memory device and electronic system including the same Apr 17, 2023 Issued
Array ( [id] => 18555284 [patent_doc_number] => 20230253301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => Heterogeneous Fan-Out Structure and Method of Manufacture [patent_app_type] => utility [patent_app_number] => 18/302112 [patent_app_country] => US [patent_app_date] => 2023-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11168 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18302112 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/302112
Heterogeneous fan-out structure and method of manufacture Apr 17, 2023 Issued
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