
Thanh Y. Tran
Examiner (ID: 12125, Phone: (571)272-2110 , Office: P/2817 )
| Most Active Art Unit | 2817 |
| Art Unit(s) | 2841, 2892, 2829, 2827, 2817, 2822 |
| Total Applications | 1667 |
| Issued Applications | 1365 |
| Pending Applications | 115 |
| Abandoned Applications | 213 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18679997
[patent_doc_number] => 20230317655
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-05
[patent_title] => MEMORY DEVICE INCLUDING MEMORY CHIP AND PERIPHERAL MEMORY CHIP AND METHOD OF MANUFACTURING THE MEMORY DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/328359
[patent_app_country] => US
[patent_app_date] => 2023-06-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 16585
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18328359
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/328359 | Memory device including memory chip and peripheral memory chip and method of manufacturing the memory device | Jun 1, 2023 | Issued |
Array
(
[id] => 18868088
[patent_doc_number] => 20230422525
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-28
[patent_title] => SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
[patent_app_type] => utility
[patent_app_number] => 18/203666
[patent_app_country] => US
[patent_app_date] => 2023-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5860
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18203666
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/203666 | SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE | May 30, 2023 | Pending |
Array
(
[id] => 20523393
[patent_doc_number] => 20260047507
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2026-02-12
[patent_title] => SYSTEMS AND METHODS FOR MASSIVELY PARALLEL CHIP INTEGRATION
[patent_app_type] => utility
[patent_app_number] => 18/324884
[patent_app_country] => US
[patent_app_date] => 2023-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 0
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 31
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324884
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/324884 | SYSTEMS AND METHODS FOR MASSIVELY PARALLEL CHIP INTEGRATION | May 25, 2023 | Pending |
Array
(
[id] => 20418325
[patent_doc_number] => 12501629
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-16
[patent_title] => Three-dimensional semiconductor memory device and electronic system including the same
[patent_app_type] => utility
[patent_app_number] => 18/323440
[patent_app_country] => US
[patent_app_date] => 2023-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 26
[patent_no_of_words] => 9324
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18323440
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/323440 | Three-dimensional semiconductor memory device and electronic system including the same | May 24, 2023 | Issued |
Array
(
[id] => 19604849
[patent_doc_number] => 20240395729
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-28
[patent_title] => CHIP PACKAGE STRUCTURE AND METHOD FOR PREVENTING WARPAGE OF CHIP PACKAGE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 18/202057
[patent_app_country] => US
[patent_app_date] => 2023-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7364
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18202057
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/202057 | Chip package structure and method for preventing warpage of chip package structure | May 24, 2023 | Issued |
Array
(
[id] => 20418325
[patent_doc_number] => 12501629
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-16
[patent_title] => Three-dimensional semiconductor memory device and electronic system including the same
[patent_app_type] => utility
[patent_app_number] => 18/323440
[patent_app_country] => US
[patent_app_date] => 2023-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 26
[patent_no_of_words] => 9324
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18323440
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/323440 | Three-dimensional semiconductor memory device and electronic system including the same | May 24, 2023 | Issued |
Array
(
[id] => 20869758
[patent_doc_number] => 12696676
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-07-28
[patent_title] => Electrical planarization of carbon nanotube thin films for electronic device applications
[patent_app_type] => utility
[patent_app_number] => 18/199513
[patent_app_country] => US
[patent_app_date] => 2023-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 20
[patent_no_of_words] => 0
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18199513
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/199513 | ELECTRICAL PLANARIZATION OF CARBON NANOTUBE THIN FILMS FOR ELECTRONIC DEVICE APPLICATIONS | May 18, 2023 | Issued |
Array
(
[id] => 18959091
[patent_doc_number] => 20240047418
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-08
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/199553
[patent_app_country] => US
[patent_app_date] => 2023-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6698
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18199553
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/199553 | SEMICONDUCTOR PACKAGE | May 18, 2023 | Pending |
Array
(
[id] => 19589890
[patent_doc_number] => 20240387447
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-21
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/318240
[patent_app_country] => US
[patent_app_date] => 2023-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8062
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318240
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/318240 | Semiconductor device and method for forming the same | May 15, 2023 | Issued |
Array
(
[id] => 20375277
[patent_doc_number] => 12482721
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-11-25
[patent_title] => Semiconductor package including heat dissipation structure
[patent_app_type] => utility
[patent_app_number] => 18/197998
[patent_app_country] => US
[patent_app_date] => 2023-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 24
[patent_no_of_words] => 7936
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18197998
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/197998 | Semiconductor package including heat dissipation structure | May 15, 2023 | Issued |
Array
(
[id] => 18868087
[patent_doc_number] => 20230422524
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-28
[patent_title] => THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/196247
[patent_app_country] => US
[patent_app_date] => 2023-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 16791
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18196247
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/196247 | Three-dimensional memory devices and fabricating methods thereof | May 10, 2023 | Issued |
Array
(
[id] => 19023171
[patent_doc_number] => 20240079342
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-07
[patent_title] => SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/195429
[patent_app_country] => US
[patent_app_date] => 2023-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7552
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195429
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/195429 | SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME | May 9, 2023 | Pending |
Array
(
[id] => 19765909
[patent_doc_number] => 12224210
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-02-11
[patent_title] => Method for FinFet fabrication and structure thereof
[patent_app_type] => utility
[patent_app_number] => 18/313783
[patent_app_country] => US
[patent_app_date] => 2023-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 7815
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313783
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/313783 | Method for FinFet fabrication and structure thereof | May 7, 2023 | Issued |
Array
(
[id] => 20668772
[patent_doc_number] => 12610562
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-04-21
[patent_title] => Methods of forming bonding structures
[patent_app_type] => utility
[patent_app_number] => 18/313786
[patent_app_country] => US
[patent_app_date] => 2023-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 5856
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313786
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/313786 | Methods of forming bonding structures | May 7, 2023 | Issued |
Array
(
[id] => 19539452
[patent_doc_number] => 12132009
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-10-29
[patent_title] => Semiconductor package
[patent_app_type] => utility
[patent_app_number] => 18/143932
[patent_app_country] => US
[patent_app_date] => 2023-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 7750
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 265
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18143932
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/143932 | Semiconductor package | May 4, 2023 | Issued |
Array
(
[id] => 18757639
[patent_doc_number] => 20230361102
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-09
[patent_title] => ON CHIP INDUCTORS
[patent_app_type] => utility
[patent_app_number] => 18/142801
[patent_app_country] => US
[patent_app_date] => 2023-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2858
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 19
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18142801
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/142801 | On chip inductors | May 2, 2023 | Issued |
Array
(
[id] => 19087904
[patent_doc_number] => 20240114705
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-04-04
[patent_title] => PHASE CHANGE MATERIAL SWITCH FOR LOW POWER CONSUMPTION AND METHODS FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/310556
[patent_app_country] => US
[patent_app_date] => 2023-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10519
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18310556
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/310556 | PHASE CHANGE MATERIAL SWITCH FOR LOW POWER CONSUMPTION AND METHODS FOR FORMING THE SAME | May 1, 2023 | Pending |
Array
(
[id] => 18868083
[patent_doc_number] => 20230422520
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-28
[patent_title] => THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/141274
[patent_app_country] => US
[patent_app_date] => 2023-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 21865
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141274
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/141274 | Three-dimensional memory devices and fabricating methods thereof | Apr 27, 2023 | Issued |
Array
(
[id] => 19138060
[patent_doc_number] => 11973035
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-30
[patent_title] => Semiconductor memory device and electronic system including the same
[patent_app_type] => utility
[patent_app_number] => 18/135766
[patent_app_country] => US
[patent_app_date] => 2023-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 9357
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18135766
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/135766 | Semiconductor memory device and electronic system including the same | Apr 17, 2023 | Issued |
Array
(
[id] => 18555284
[patent_doc_number] => 20230253301
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-10
[patent_title] => Heterogeneous Fan-Out Structure and Method of Manufacture
[patent_app_type] => utility
[patent_app_number] => 18/302112
[patent_app_country] => US
[patent_app_date] => 2023-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11168
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18302112
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/302112 | Heterogeneous fan-out structure and method of manufacture | Apr 17, 2023 | Issued |