
Thanhha S. Pham
Examiner (ID: 11625)
| Most Active Art Unit | 2819 |
| Art Unit(s) | 2813, 2819, 2812, 2894 |
| Total Applications | 1754 |
| Issued Applications | 1445 |
| Pending Applications | 106 |
| Abandoned Applications | 230 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6540079
[patent_doc_number] => 20100124821
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-20
[patent_title] => 'METHODS FOR FORMING A CONDUCTIVE MATERIAL, METHODS FOR SELECTIVELY FORMING A CONDUCTIVE MATERIAL, METHODS FOR FORMING PLATINUM, AND METHODS FOR FORMING CONDUCTIVE STRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 12/274169
[patent_app_country] => US
[patent_app_date] => 2008-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4301
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[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0124/20100124821.pdf
[firstpage_image] =>[orig_patent_app_number] => 12274169
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/274169 | Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures | Nov 18, 2008 | Issued |
Array
(
[id] => 5409912
[patent_doc_number] => 20090123811
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-14
[patent_title] => 'ELECTROCHEMICAL CELL AND FUEL CELL INCLUDING IT'
[patent_app_type] => utility
[patent_app_number] => 12/269403
[patent_app_country] => US
[patent_app_date] => 2008-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2085
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[pdf_file] => publications/A1/0123/20090123811.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/269403 | ELECTROCHEMICAL CELL AND FUEL CELL INCLUDING IT | Nov 11, 2008 | Abandoned |
Array
(
[id] => 220965
[patent_doc_number] => 07608511
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2009-10-27
[patent_title] => 'Fabrication method of trenched power MOSFET with low gate impedance'
[patent_app_type] => utility
[patent_app_number] => 12/289860
[patent_app_country] => US
[patent_app_date] => 2008-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => patents/07/608/07608511.pdf
[firstpage_image] =>[orig_patent_app_number] => 12289860
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/289860 | Fabrication method of trenched power MOSFET with low gate impedance | Nov 5, 2008 | Issued |
Array
(
[id] => 6304211
[patent_doc_number] => 20100109046
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-05-06
[patent_title] => 'Methods of forming low interface resistance contacts and structures formed thereby'
[patent_app_type] => utility
[patent_app_number] => 12/290809
[patent_app_country] => US
[patent_app_date] => 2008-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2364
[patent_no_of_claims] => 30
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[firstpage_image] =>[orig_patent_app_number] => 12290809
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/290809 | Methods of forming low interface resistance contacts and structures formed thereby | Nov 2, 2008 | Abandoned |
Array
(
[id] => 5410177
[patent_doc_number] => 20090124076
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-14
[patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/262439
[patent_app_country] => US
[patent_app_date] => 2008-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[firstpage_image] =>[orig_patent_app_number] => 12262439
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/262439 | Method of manufacturing semiconductor device | Oct 30, 2008 | Issued |
Array
(
[id] => 4634915
[patent_doc_number] => 08013368
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[patent_kind] => B2
[patent_issue_date] => 2011-09-06
[patent_title] => 'Replacement gates to enhance transistor strain'
[patent_app_type] => utility
[patent_app_number] => 12/288937
[patent_app_country] => US
[patent_app_date] => 2008-10-24
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[pdf_file] => patents/08/013/08013368.pdf
[firstpage_image] =>[orig_patent_app_number] => 12288937
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/288937 | Replacement gates to enhance transistor strain | Oct 23, 2008 | Issued |
Array
(
[id] => 6448846
[patent_doc_number] => 20100105204
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-29
[patent_title] => 'METHOD TO MODULATE COVERAGE OF BARRIER AND SEED LAYER USING TITANIUM NITRIDE'
[patent_app_type] => utility
[patent_app_number] => 12/257279
[patent_app_country] => US
[patent_app_date] => 2008-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 5029
[patent_no_of_claims] => 24
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[pdf_file] => publications/A1/0105/20100105204.pdf
[firstpage_image] =>[orig_patent_app_number] => 12257279
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/257279 | Method to modulate coverage of barrier and seed layer using titanium nitride | Oct 22, 2008 | Issued |
Array
(
[id] => 5265050
[patent_doc_number] => 20090117735
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-07
[patent_title] => 'IMPLANTATION OF MULTIPLE SPECIES TO ADDRESS COPPER RELIABILITY'
[patent_app_type] => utility
[patent_app_number] => 12/255181
[patent_app_country] => US
[patent_app_date] => 2008-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4908
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[pdf_file] => publications/A1/0117/20090117735.pdf
[firstpage_image] =>[orig_patent_app_number] => 12255181
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/255181 | Implantation of multiple species to address copper reliability | Oct 20, 2008 | Issued |
Array
(
[id] => 141953
[patent_doc_number] => 07691738
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-06
[patent_title] => 'Metal line in semiconductor device and fabricating method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/254019
[patent_app_country] => US
[patent_app_date] => 2008-10-20
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[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/07/691/07691738.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/254019 | Metal line in semiconductor device and fabricating method thereof | Oct 19, 2008 | Issued |
Array
(
[id] => 5435726
[patent_doc_number] => 20090170313
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-02
[patent_title] => 'Method for Manufacturing Semiconductor Device'
[patent_app_type] => utility
[patent_app_number] => 12/251769
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/251769 | Method for Manufacturing Semiconductor Device | Oct 14, 2008 | Abandoned |
Array
(
[id] => 6356955
[patent_doc_number] => 20100087061
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-08
[patent_title] => 'INTEGRATED CIRCUIT SYSTEM EMPLOYING BACKSIDE ENERGY SOURCE FOR ELECTRICAL CONTACT FORMATION'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/247479 | Integrated circuit system employing backside energy source for electrical contact formation | Oct 7, 2008 | Issued |
Array
(
[id] => 236268
[patent_doc_number] => 07595249
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[patent_title] => 'Bipolar transistors with vertical structures'
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Array
(
[id] => 5508659
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[patent_title] => 'VAPOR DEPOSITION OF TUNGSTEN MATERIALS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/239046 | Vapor deposition of tungsten materials | Sep 25, 2008 | Issued |
Array
(
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[patent_title] => 'Tri-gate integration with embedded floating body memory cell using a high-K dual metal gate'
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Array
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Array
(
[id] => 121384
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/182148 | Post passivation interconnection process and structures | Jul 29, 2008 | Issued |