Search

Thanhnga B. Truong

Examiner (ID: 2062)

Most Active Art Unit
2438
Art Unit(s)
2435, 2135, 2438, 2498
Total Applications
886
Issued Applications
752
Pending Applications
24
Abandoned Applications
114

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8244840 [patent_doc_number] => 08202763 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-19 [patent_title] => 'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device' [patent_app_type] => utility [patent_app_number] => 12/899642 [patent_app_country] => US [patent_app_date] => 2010-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 36 [patent_no_of_words] => 5998 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/202/08202763.pdf [firstpage_image] =>[orig_patent_app_number] => 12899642 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/899642
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Oct 6, 2010 Issued
Array ( [id] => 8592512 [patent_doc_number] => 08350389 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-01-08 [patent_title] => 'Semiconductor device and information processing system including the same' [patent_app_type] => utility [patent_app_number] => 12/923789 [patent_app_country] => US [patent_app_date] => 2010-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 25 [patent_no_of_words] => 12851 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12923789 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/923789
Semiconductor device and information processing system including the same Oct 6, 2010 Issued
Array ( [id] => 8202950 [patent_doc_number] => 08188575 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-29 [patent_title] => 'Apparatus and method for uniform metal plating' [patent_app_type] => utility [patent_app_number] => 12/898622 [patent_app_country] => US [patent_app_date] => 2010-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 35 [patent_no_of_words] => 13550 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/188/08188575.pdf [firstpage_image] =>[orig_patent_app_number] => 12898622 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/898622
Apparatus and method for uniform metal plating Oct 4, 2010 Issued
Array ( [id] => 8190295 [patent_doc_number] => 08183693 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-22 [patent_title] => 'Electronic device, method of producing the same, and semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/897173 [patent_app_country] => US [patent_app_date] => 2010-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 6029 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/183/08183693.pdf [firstpage_image] =>[orig_patent_app_number] => 12897173 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/897173
Electronic device, method of producing the same, and semiconductor device Oct 3, 2010 Issued
Array ( [id] => 5993096 [patent_doc_number] => 20110014749 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-01-20 [patent_title] => 'Method for Packaging Semiconductor Dies Having Through-Silicon Vias' [patent_app_type] => utility [patent_app_number] => 12/883910 [patent_app_country] => US [patent_app_date] => 2010-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2216 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0014/20110014749.pdf [firstpage_image] =>[orig_patent_app_number] => 12883910 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883910
Method for packaging semiconductor dies having through-silicon vias Sep 15, 2010 Issued
Array ( [id] => 6007549 [patent_doc_number] => 20110059580 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-03-10 [patent_title] => 'HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAPABILITY AND METHODS OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/883044 [patent_app_country] => US [patent_app_date] => 2010-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 6585 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0059/20110059580.pdf [firstpage_image] =>[orig_patent_app_number] => 12883044 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883044
High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Sep 14, 2010 Issued
Array ( [id] => 9504285 [patent_doc_number] => 08742603 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-03 [patent_title] => 'Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)' [patent_app_type] => utility [patent_app_number] => 12/882525 [patent_app_country] => US [patent_app_date] => 2010-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 18 [patent_no_of_words] => 3916 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12882525 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/882525
Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) Sep 14, 2010 Issued
Array ( [id] => 8165843 [patent_doc_number] => 08174126 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-08 [patent_title] => 'Stacked multi-chip' [patent_app_type] => utility [patent_app_number] => 12/882805 [patent_app_country] => US [patent_app_date] => 2010-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1283 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 310 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/174/08174126.pdf [firstpage_image] =>[orig_patent_app_number] => 12882805 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/882805
Stacked multi-chip Sep 14, 2010 Issued
Array ( [id] => 7815239 [patent_doc_number] => 20120061859 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-15 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULANT CONTAINMENT AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 12/882856 [patent_app_country] => US [patent_app_date] => 2010-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3351 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20120061859.pdf [firstpage_image] =>[orig_patent_app_number] => 12882856 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/882856
Integrated circuit packaging system with encapsulant containment and method of manufacture thereof Sep 14, 2010 Issued
Array ( [id] => 7815234 [patent_doc_number] => 20120061854 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-15 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 12/881983 [patent_app_country] => US [patent_app_date] => 2010-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 10795 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20120061854.pdf [firstpage_image] =>[orig_patent_app_number] => 12881983 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/881983
Integrated circuit packaging system with package-on-package and method of manufacture thereof Sep 13, 2010 Issued
Array ( [id] => 7815237 [patent_doc_number] => 20120061857 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-15 [patent_title] => 'Electronic Packaging With A Variable Thickness Mold Cap' [patent_app_type] => utility [patent_app_number] => 12/881549 [patent_app_country] => US [patent_app_date] => 2010-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2767 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20120061857.pdf [firstpage_image] =>[orig_patent_app_number] => 12881549 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/881549
Electronic packaging with a variable thickness mold cap Sep 13, 2010 Issued
Array ( [id] => 7815238 [patent_doc_number] => 20120061858 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-15 [patent_title] => 'Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die' [patent_app_type] => utility [patent_app_number] => 12/882083 [patent_app_country] => US [patent_app_date] => 2010-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4677 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20120061858.pdf [firstpage_image] =>[orig_patent_app_number] => 12882083 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/882083
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Sep 13, 2010 Issued
Array ( [id] => 7815235 [patent_doc_number] => 20120061855 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-15 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 12/882067 [patent_app_country] => US [patent_app_date] => 2010-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 8365 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20120061855.pdf [firstpage_image] =>[orig_patent_app_number] => 12882067 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/882067
Integrated circuit packaging system with film encapsulation and method of manufacture thereof Sep 13, 2010 Issued
Array ( [id] => 4644924 [patent_doc_number] => 08022531 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-20 [patent_title] => 'Integrated circuit package system using heat slug' [patent_app_type] => utility [patent_app_number] => 12/880415 [patent_app_country] => US [patent_app_date] => 2010-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3955 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/022/08022531.pdf [firstpage_image] =>[orig_patent_app_number] => 12880415 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/880415
Integrated circuit package system using heat slug Sep 12, 2010 Issued
Array ( [id] => 6327517 [patent_doc_number] => 20100327307 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-30 [patent_title] => 'Optoelectronic Component' [patent_app_type] => utility [patent_app_number] => 12/879130 [patent_app_country] => US [patent_app_date] => 2010-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3745 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0327/20100327307.pdf [firstpage_image] =>[orig_patent_app_number] => 12879130 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/879130
Optoelectronic component Sep 9, 2010 Issued
Array ( [id] => 6004156 [patent_doc_number] => 20110057309 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-03-10 [patent_title] => 'STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN FCB PACKAGING' [patent_app_type] => utility [patent_app_number] => 12/877661 [patent_app_country] => US [patent_app_date] => 2010-09-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5502 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0057/20110057309.pdf [firstpage_image] =>[orig_patent_app_number] => 12877661 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/877661
Structure, method and system for assessing bonding of electrodes in FCB packaging Sep 7, 2010 Issued
Array ( [id] => 8283393 [patent_doc_number] => 08217492 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-10 [patent_title] => 'Inductively coupled integrated circuit with magnetic communication path and methods for use therewith' [patent_app_type] => utility [patent_app_number] => 12/841108 [patent_app_country] => US [patent_app_date] => 2010-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 76 [patent_no_of_words] => 29582 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12841108 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/841108
Inductively coupled integrated circuit with magnetic communication path and methods for use therewith Jul 20, 2010 Issued
Array ( [id] => 4639448 [patent_doc_number] => 08017475 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-09-13 [patent_title] => 'Process to improve high-performance capacitors in integrated MOS technologies' [patent_app_type] => utility [patent_app_number] => 12/804414 [patent_app_country] => US [patent_app_date] => 2010-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 5285 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/017/08017475.pdf [firstpage_image] =>[orig_patent_app_number] => 12804414 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/804414
Process to improve high-performance capacitors in integrated MOS technologies Jul 19, 2010 Issued
Array ( [id] => 8797604 [patent_doc_number] => 08436478 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-05-07 [patent_title] => 'Methods of fluxless micro-piercing of solder balls, and resulting devices' [patent_app_type] => utility [patent_app_number] => 12/827476 [patent_app_country] => US [patent_app_date] => 2010-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 2654 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12827476 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/827476
Methods of fluxless micro-piercing of solder balls, and resulting devices Jun 29, 2010 Issued
Array ( [id] => 7535714 [patent_doc_number] => 08049343 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-11-01 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/794505 [patent_app_country] => US [patent_app_date] => 2010-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 26 [patent_no_of_words] => 3827 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/049/08049343.pdf [firstpage_image] =>[orig_patent_app_number] => 12794505 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/794505
Semiconductor device and method of manufacturing the same Jun 3, 2010 Issued
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