
Thanhnga B. Truong
Examiner (ID: 2062)
| Most Active Art Unit | 2438 |
| Art Unit(s) | 2435, 2135, 2438, 2498 |
| Total Applications | 886 |
| Issued Applications | 752 |
| Pending Applications | 24 |
| Abandoned Applications | 114 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8578275
[patent_doc_number] => 08344486
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-01-01
[patent_title] => 'Semiconductor device and display apparatus'
[patent_app_type] => utility
[patent_app_number] => 12/737431
[patent_app_country] => US
[patent_app_date] => 2009-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 8109
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12737431
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/737431 | Semiconductor device and display apparatus | Jul 6, 2009 | Issued |
Array
(
[id] => 7518776
[patent_doc_number] => 07972877
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-05
[patent_title] => 'Fabricating method of light emitting diode package'
[patent_app_type] => utility
[patent_app_number] => 12/489445
[patent_app_country] => US
[patent_app_date] => 2009-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 24
[patent_no_of_words] => 6502
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 186
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/972/07972877.pdf
[firstpage_image] =>[orig_patent_app_number] => 12489445
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/489445 | Fabricating method of light emitting diode package | Jun 22, 2009 | Issued |
Array
(
[id] => 6571223
[patent_doc_number] => 20100320576
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-23
[patent_title] => 'Die-warpage compensation structures for thinned-die devices, and methods of assembling same'
[patent_app_type] => utility
[patent_app_number] => 12/456638
[patent_app_country] => US
[patent_app_date] => 2009-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5878
[patent_no_of_claims] => 28
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[pdf_file] => publications/A1/0320/20100320576.pdf
[firstpage_image] =>[orig_patent_app_number] => 12456638
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/456638 | Die-warpage compensation structures for thinned-die devices, and methods of assembling same | Jun 17, 2009 | Issued |
Array
(
[id] => 6503065
[patent_doc_number] => 20100013077
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-21
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/485965
[patent_app_country] => US
[patent_app_date] => 2009-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6428
[patent_no_of_claims] => 22
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0013/20100013077.pdf
[firstpage_image] =>[orig_patent_app_number] => 12485965
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/485965 | Semiconductor device | Jun 16, 2009 | Issued |
Array
(
[id] => 6369036
[patent_doc_number] => 20100314730
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-16
[patent_title] => 'Stacked hybrid interposer through silicon via (TSV) package'
[patent_app_type] => utility
[patent_app_number] => 12/457595
[patent_app_country] => US
[patent_app_date] => 2009-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3793
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0314/20100314730.pdf
[firstpage_image] =>[orig_patent_app_number] => 12457595
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/457595 | Stacked hybrid interposer through silicon via (TSV) package | Jun 15, 2009 | Abandoned |
Array
(
[id] => 6184391
[patent_doc_number] => 20110169276
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-07-14
[patent_title] => 'FIELD EFFECT POWER GENERATION DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/736852
[patent_app_country] => US
[patent_app_date] => 2009-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 71
[patent_figures_cnt] => 71
[patent_no_of_words] => 71643
[patent_no_of_claims] => 16
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0169/20110169276.pdf
[firstpage_image] =>[orig_patent_app_number] => 12736852
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/736852 | Field effect power generation device | Jun 15, 2009 | Issued |
Array
(
[id] => 8470452
[patent_doc_number] => 08299631
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-10-30
[patent_title] => 'Semiconductor element and display device provided with the same'
[patent_app_type] => utility
[patent_app_number] => 13/061456
[patent_app_country] => US
[patent_app_date] => 2009-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 7647
[patent_no_of_claims] => 11
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13061456
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/061456 | Semiconductor element and display device provided with the same | Jun 10, 2009 | Issued |
Array
(
[id] => 4583196
[patent_doc_number] => 07834432
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-11-16
[patent_title] => 'Chip package having asymmetric molding'
[patent_app_type] => utility
[patent_app_number] => 12/480105
[patent_app_country] => US
[patent_app_date] => 2009-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 4670
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 190
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/834/07834432.pdf
[firstpage_image] =>[orig_patent_app_number] => 12480105
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/480105 | Chip package having asymmetric molding | Jun 7, 2009 | Issued |
Array
(
[id] => 9100238
[patent_doc_number] => 08564118
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-10-22
[patent_title] => 'Power module substrate, power module, and method for manufacturing power module substrate'
[patent_app_type] => utility
[patent_app_number] => 12/737042
[patent_app_country] => US
[patent_app_date] => 2009-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 33
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[patent_no_of_words] => 25274
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12737042
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/737042 | Power module substrate, power module, and method for manufacturing power module substrate | Jun 4, 2009 | Issued |
Array
(
[id] => 5955919
[patent_doc_number] => 20110180933
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-07-28
[patent_title] => 'SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 12/995320
[patent_app_country] => US
[patent_app_date] => 2009-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 8066
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0180/20110180933.pdf
[firstpage_image] =>[orig_patent_app_number] => 12995320
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/995320 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD | May 28, 2009 | Abandoned |
Array
(
[id] => 7544408
[patent_doc_number] => 08052373
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-08
[patent_title] => 'Multi-rotational crankshaft arrangement'
[patent_app_type] => utility
[patent_app_number] => 12/453775
[patent_app_country] => US
[patent_app_date] => 2009-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3159
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/052/08052373.pdf
[firstpage_image] =>[orig_patent_app_number] => 12453775
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/453775 | Multi-rotational crankshaft arrangement | May 20, 2009 | Issued |
Array
(
[id] => 7539014
[patent_doc_number] => 08056851
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-15
[patent_title] => 'Helicopter antitorque tail rotor'
[patent_app_type] => utility
[patent_app_number] => 12/469246
[patent_app_country] => US
[patent_app_date] => 2009-05-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => patents/08/056/08056851.pdf
[firstpage_image] =>[orig_patent_app_number] => 12469246
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/469246 | Helicopter antitorque tail rotor | May 19, 2009 | Issued |
Array
(
[id] => 5551700
[patent_doc_number] => 20090285686
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-19
[patent_title] => 'FAN BLADE RETENTION AND VARIABLE PITCH SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 12/465163
[patent_app_country] => US
[patent_app_date] => 2009-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => publications/A1/0285/20090285686.pdf
[firstpage_image] =>[orig_patent_app_number] => 12465163
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/465163 | Fan blade retention and variable pitch system | May 12, 2009 | Issued |
Array
(
[id] => 6106187
[patent_doc_number] => 20110187009
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-08-04
[patent_title] => 'ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/057322
[patent_app_country] => US
[patent_app_date] => 2009-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0187/20110187009.pdf
[firstpage_image] =>[orig_patent_app_number] => 13057322
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/057322 | Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device | Apr 29, 2009 | Issued |
Array
(
[id] => 7534144
[patent_doc_number] => 08047766
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-01
[patent_title] => 'Electromechanical drive for actuating valves'
[patent_app_type] => utility
[patent_app_number] => 12/423261
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[pdf_file] => patents/08/047/08047766.pdf
[firstpage_image] =>[orig_patent_app_number] => 12423261
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/423261 | Electromechanical drive for actuating valves | Apr 13, 2009 | Issued |
Array
(
[id] => 5925444
[patent_doc_number] => 20110037166
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[patent_issue_date] => 2011-02-17
[patent_title] => 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 12/735926
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[pdf_file] => publications/A1/0037/20110037166.pdf
[firstpage_image] =>[orig_patent_app_number] => 12735926
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/735926 | Semiconductor device | Apr 7, 2009 | Issued |
Array
(
[id] => 8578309
[patent_doc_number] => 08344522
[patent_country] => US
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[patent_issue_date] => 2013-01-01
[patent_title] => 'Solder structure, method for forming the solder structure, and semiconductor module including the solder structure'
[patent_app_type] => utility
[patent_app_number] => 12/935864
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/935864 | Solder structure, method for forming the solder structure, and semiconductor module including the solder structure | Mar 17, 2009 | Issued |
Array
(
[id] => 7535092
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[patent_title] => 'Structure of embedded active components and manufacturing method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/382526 | Structure of embedded active components and manufacturing method thereof | Mar 17, 2009 | Issued |
Array
(
[id] => 6130779
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[patent_title] => 'ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/736191 | Electronic device and manufacturing method therefor | Mar 16, 2009 | Issued |
Array
(
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[patent_issue_date] => 2015-03-10
[patent_title] => 'Lead-free solder connection structure and solder ball'
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12736053
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/736053 | Lead-free solder connection structure and solder ball | Mar 2, 2009 | Issued |