Search

Thanhnga B. Truong

Examiner (ID: 2062)

Most Active Art Unit
2438
Art Unit(s)
2435, 2135, 2438, 2498
Total Applications
886
Issued Applications
752
Pending Applications
24
Abandoned Applications
114

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4743383 [patent_doc_number] => 20080087984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Compound semiconductor modified surface by use of pulsed electron beam and ion implantation through a deposited metal layer' [patent_app_type] => utility [patent_app_number] => 11/998961 [patent_app_country] => US [patent_app_date] => 2007-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3757 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20080087984.pdf [firstpage_image] =>[orig_patent_app_number] => 11998961 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/998961
Compound semiconductor modified surface by use of pulsed electron beam and ion implantation through a deposited metal layer Dec 2, 2007 Abandoned
Array ( [id] => 33716 [patent_doc_number] => 07791193 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Pad over active circuit system and method with meshed support structure' [patent_app_type] => utility [patent_app_number] => 11/943381 [patent_app_country] => US [patent_app_date] => 2007-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 27 [patent_no_of_words] => 4340 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/791/07791193.pdf [firstpage_image] =>[orig_patent_app_number] => 11943381 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/943381
Pad over active circuit system and method with meshed support structure Nov 19, 2007 Issued
Array ( [id] => 124202 [patent_doc_number] => 07705468 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-27 [patent_title] => 'Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/940522 [patent_app_country] => US [patent_app_date] => 2007-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4185 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/705/07705468.pdf [firstpage_image] =>[orig_patent_app_number] => 11940522 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/940522
Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same Nov 14, 2007 Issued
Array ( [id] => 5275567 [patent_doc_number] => 20090127699 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-21 [patent_title] => 'LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE AND SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/940961 [patent_app_country] => US [patent_app_date] => 2007-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 1957 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20090127699.pdf [firstpage_image] =>[orig_patent_app_number] => 11940961 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/940961
Low temperature co-fired ceramics substrate and semiconductor package Nov 14, 2007 Issued
Array ( [id] => 5282419 [patent_doc_number] => 20090096093 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-16 [patent_title] => 'INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 11/939732 [patent_app_country] => US [patent_app_date] => 2007-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3669 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20090096093.pdf [firstpage_image] =>[orig_patent_app_number] => 11939732 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/939732
INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME Nov 13, 2007 Abandoned
Array ( [id] => 5262347 [patent_doc_number] => 20090115032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-07 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY' [patent_app_type] => utility [patent_app_number] => 11/936532 [patent_app_country] => US [patent_app_date] => 2007-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4571 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20090115032.pdf [firstpage_image] =>[orig_patent_app_number] => 11936532 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/936532
Integrated circuit package system with dual connectivity Nov 6, 2007 Issued
Array ( [id] => 4782715 [patent_doc_number] => 20080136044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-12 [patent_title] => 'Semiconductor package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/982751 [patent_app_country] => US [patent_app_date] => 2007-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4118 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0136/20080136044.pdf [firstpage_image] =>[orig_patent_app_number] => 11982751 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/982751
Semiconductor package and method of manufacturing the same Nov 4, 2007 Issued
Array ( [id] => 4701896 [patent_doc_number] => 20080061418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-13 [patent_title] => 'Three dimensional device integration method and integrated device' [patent_app_type] => utility [patent_app_number] => 11/980452 [patent_app_country] => US [patent_app_date] => 2007-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 12995 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0061/20080061418.pdf [firstpage_image] =>[orig_patent_app_number] => 11980452 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/980452
Three dimensional device integration method and integrated device Oct 30, 2007 Abandoned
Array ( [id] => 4479793 [patent_doc_number] => 07906860 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-15 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/925312 [patent_app_country] => US [patent_app_date] => 2007-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4423 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/906/07906860.pdf [firstpage_image] =>[orig_patent_app_number] => 11925312 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/925312
Semiconductor device Oct 25, 2007 Issued
Array ( [id] => 102469 [patent_doc_number] => 07723213 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-25 [patent_title] => 'Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/976521 [patent_app_country] => US [patent_app_date] => 2007-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 24 [patent_no_of_words] => 7031 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/723/07723213.pdf [firstpage_image] =>[orig_patent_app_number] => 11976521 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/976521
Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips Oct 24, 2007 Issued
Array ( [id] => 5582852 [patent_doc_number] => 20090102054 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-23 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/876241 [patent_app_country] => US [patent_app_date] => 2007-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3180 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20090102054.pdf [firstpage_image] =>[orig_patent_app_number] => 11876241 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/876241
Semiconductor package Oct 21, 2007 Issued
Array ( [id] => 4667192 [patent_doc_number] => 20080042252 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-21 [patent_title] => 'STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS' [patent_app_type] => utility [patent_app_number] => 11/874531 [patent_app_country] => US [patent_app_date] => 2007-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1683 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20080042252.pdf [firstpage_image] =>[orig_patent_app_number] => 11874531 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/874531
Stackable ceramic FBGA for high thermal applications Oct 17, 2007 Issued
Array ( [id] => 4743410 [patent_doc_number] => 20080088011 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/974441 [patent_app_country] => US [patent_app_date] => 2007-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6440 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0088/20080088011.pdf [firstpage_image] =>[orig_patent_app_number] => 11974441 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/974441
Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof Oct 11, 2007 Issued
Array ( [id] => 4583417 [patent_doc_number] => 07834464 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-16 [patent_title] => 'Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device' [patent_app_type] => utility [patent_app_number] => 11/869211 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 36 [patent_no_of_words] => 5967 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/834/07834464.pdf [firstpage_image] =>[orig_patent_app_number] => 11869211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/869211
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Oct 8, 2007 Issued
Array ( [id] => 6615016 [patent_doc_number] => 20100225003 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-09 [patent_title] => 'METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINABLE WITH SUCH A METHOD' [patent_app_type] => utility [patent_app_number] => 12/681119 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5591 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0225/20100225003.pdf [firstpage_image] =>[orig_patent_app_number] => 12681119 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/681119
Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method Oct 8, 2007 Issued
Array ( [id] => 7723496 [patent_doc_number] => 08096764 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-01-17 [patent_title] => 'System for rotating a wind turbine blade' [patent_app_type] => utility [patent_app_number] => 12/444439 [patent_app_country] => US [patent_app_date] => 2007-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5730 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/096/08096764.pdf [firstpage_image] =>[orig_patent_app_number] => 12444439 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/444439
System for rotating a wind turbine blade Oct 8, 2007 Issued
Array ( [id] => 4800514 [patent_doc_number] => 20080012101 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'Semiconductor Package Having Improved Adhesion and Solderability' [patent_app_type] => utility [patent_app_number] => 11/864233 [patent_app_country] => US [patent_app_date] => 2007-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4707 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012101.pdf [firstpage_image] =>[orig_patent_app_number] => 11864233 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/864233
Semiconductor Package Having Improved Adhesion and Solderability Sep 27, 2007 Abandoned
Array ( [id] => 4936449 [patent_doc_number] => 20080073763 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-27 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/860751 [patent_app_country] => US [patent_app_date] => 2007-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4666 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0073/20080073763.pdf [firstpage_image] =>[orig_patent_app_number] => 11860751 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/860751
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Sep 24, 2007 Abandoned
Array ( [id] => 5505859 [patent_doc_number] => 20090079066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-26 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS' [patent_app_type] => utility [patent_app_number] => 11/859462 [patent_app_country] => US [patent_app_date] => 2007-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3253 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20090079066.pdf [firstpage_image] =>[orig_patent_app_number] => 11859462 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/859462
Integrated circuit packaging system with passive components Sep 20, 2007 Issued
Array ( [id] => 8244885 [patent_doc_number] => 08202798 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-19 [patent_title] => 'Improvements for reducing electromigration effect in an integrated circuit' [patent_app_type] => utility [patent_app_number] => 12/675242 [patent_app_country] => US [patent_app_date] => 2007-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2084 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/202/08202798.pdf [firstpage_image] =>[orig_patent_app_number] => 12675242 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/675242
Improvements for reducing electromigration effect in an integrated circuit Sep 19, 2007 Issued
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