
Thanhnga B. Truong
Examiner (ID: 2062)
| Most Active Art Unit | 2438 |
| Art Unit(s) | 2435, 2135, 2438, 2498 |
| Total Applications | 886 |
| Issued Applications | 752 |
| Pending Applications | 24 |
| Abandoned Applications | 114 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 82892
[patent_doc_number] => 07745943
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Microelectonic packages and methods therefor'
[patent_app_type] => utility
[patent_app_number] => 11/799771
[patent_app_country] => US
[patent_app_date] => 2007-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 58
[patent_no_of_words] => 14973
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/745/07745943.pdf
[firstpage_image] =>[orig_patent_app_number] => 11799771
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/799771 | Microelectonic packages and methods therefor | May 2, 2007 | Issued |
Array
(
[id] => 4731364
[patent_doc_number] => 20080048342
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-28
[patent_title] => 'Multi-chip module'
[patent_app_type] => utility
[patent_app_number] => 11/796771
[patent_app_country] => US
[patent_app_date] => 2007-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 3617
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0048/20080048342.pdf
[firstpage_image] =>[orig_patent_app_number] => 11796771
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/796771 | Multi-chip module | Apr 29, 2007 | Issued |
Array
(
[id] => 5223005
[patent_doc_number] => 20070252271
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-01
[patent_title] => 'SEMICONDUCTOR MEMORY MODULE HAVING AN OBLIQUE MEMORY CHIP'
[patent_app_type] => utility
[patent_app_number] => 11/740821
[patent_app_country] => US
[patent_app_date] => 2007-04-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 10962
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0252/20070252271.pdf
[firstpage_image] =>[orig_patent_app_number] => 11740821
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/740821 | Semiconductor memory module having an oblique memory chip | Apr 25, 2007 | Issued |
Array
(
[id] => 143045
[patent_doc_number] => 07692208
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-06
[patent_title] => 'Semiconductor optical device'
[patent_app_type] => utility
[patent_app_number] => 11/739861
[patent_app_country] => US
[patent_app_date] => 2007-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 55
[patent_no_of_words] => 13072
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 314
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/692/07692208.pdf
[firstpage_image] =>[orig_patent_app_number] => 11739861
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/739861 | Semiconductor optical device | Apr 24, 2007 | Issued |
Array
(
[id] => 5066722
[patent_doc_number] => 20070187823
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-16
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/783983
[patent_app_country] => US
[patent_app_date] => 2007-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7486
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0187/20070187823.pdf
[firstpage_image] =>[orig_patent_app_number] => 11783983
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/783983 | Semiconductor device | Apr 12, 2007 | Abandoned |
Array
(
[id] => 24990
[patent_doc_number] => 07795727
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-14
[patent_title] => 'Semiconductor module having discrete components and method for producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/697191
[patent_app_country] => US
[patent_app_date] => 2007-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 17
[patent_no_of_words] => 7401
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/795/07795727.pdf
[firstpage_image] =>[orig_patent_app_number] => 11697191
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/697191 | Semiconductor module having discrete components and method for producing the same | Apr 4, 2007 | Issued |
Array
(
[id] => 7546654
[patent_doc_number] => 08054631
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-08
[patent_title] => 'Computer packaging system'
[patent_app_type] => utility
[patent_app_number] => 11/685361
[patent_app_country] => US
[patent_app_date] => 2007-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 3093
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 310
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/054/08054631.pdf
[firstpage_image] =>[orig_patent_app_number] => 11685361
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/685361 | Computer packaging system | Mar 12, 2007 | Issued |
Array
(
[id] => 8214923
[patent_doc_number] => 08193613
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-05
[patent_title] => 'Semiconductor die having increased usable area'
[patent_app_type] => utility
[patent_app_number] => 11/715241
[patent_app_country] => US
[patent_app_date] => 2007-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2288
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/193/08193613.pdf
[firstpage_image] =>[orig_patent_app_number] => 11715241
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/715241 | Semiconductor die having increased usable area | Mar 5, 2007 | Issued |
Array
(
[id] => 6393385
[patent_doc_number] => 20100164089
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-01
[patent_title] => 'Non-Conductive Planarization of Substrate Surface for Mold Cap'
[patent_app_type] => utility
[patent_app_number] => 12/278653
[patent_app_country] => US
[patent_app_date] => 2007-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2191
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0164/20100164089.pdf
[firstpage_image] =>[orig_patent_app_number] => 12278653
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/278653 | Non-Conductive Planarization of Substrate Surface for Mold Cap | Feb 13, 2007 | Abandoned |
Array
(
[id] => 6231351
[patent_doc_number] => 20100264544
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-10-21
[patent_title] => 'Device including contact structure and method of forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/655116
[patent_app_country] => US
[patent_app_date] => 2007-01-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 6375
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0264/20100264544.pdf
[firstpage_image] =>[orig_patent_app_number] => 11655116
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/655116 | Device including contact structure and method of forming the same | Jan 18, 2007 | Issued |
Array
(
[id] => 6311385
[patent_doc_number] => 20100193948
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-08-05
[patent_title] => 'SEMICONDUCTOR DEVICE, PRINTED WIRING BOARD FOR MOUNTING THE SEMICONDUCTOR DEVICE AND CONNECTING STRUCTURE FOR THESE'
[patent_app_type] => utility
[patent_app_number] => 12/160974
[patent_app_country] => US
[patent_app_date] => 2007-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 9633
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0193/20100193948.pdf
[firstpage_image] =>[orig_patent_app_number] => 12160974
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/160974 | Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these | Jan 9, 2007 | Issued |
Array
(
[id] => 4971560
[patent_doc_number] => 20070111562
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'Circuit Board Manufacturing Technique and Resulting Circuit Board'
[patent_app_type] => utility
[patent_app_number] => 11/621051
[patent_app_country] => US
[patent_app_date] => 2007-01-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2939
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0111/20070111562.pdf
[firstpage_image] =>[orig_patent_app_number] => 11621051
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/621051 | Circuit Board Manufacturing Technique and Resulting Circuit Board | Jan 7, 2007 | Abandoned |
Array
(
[id] => 7504793
[patent_doc_number] => 08035205
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-10-11
[patent_title] => 'Molding compound flow controller'
[patent_app_type] => utility
[patent_app_number] => 11/620561
[patent_app_country] => US
[patent_app_date] => 2007-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_claims] => 64
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/035/08035205.pdf
[firstpage_image] =>[orig_patent_app_number] => 11620561
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/620561 | Molding compound flow controller | Jan 4, 2007 | Issued |
Array
(
[id] => 4968577
[patent_doc_number] => 20070108579
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor'
[patent_app_type] => utility
[patent_app_number] => 11/646991
[patent_app_country] => US
[patent_app_date] => 2006-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 5996
[patent_no_of_claims] => 63
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20070108579.pdf
[firstpage_image] =>[orig_patent_app_number] => 11646991
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/646991 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor | Dec 27, 2006 | Issued |
Array
(
[id] => 383333
[patent_doc_number] => 07307285
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-12-11
[patent_title] => 'Optical semiconductor device and a method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/615170
[patent_app_country] => US
[patent_app_date] => 2006-12-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/307/07307285.pdf
[firstpage_image] =>[orig_patent_app_number] => 11615170
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/615170 | Optical semiconductor device and a method for manufacturing the same | Dec 21, 2006 | Issued |
Array
(
[id] => 220936
[patent_doc_number] => 07608482
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2009-10-27
[patent_title] => 'Integrated circuit package with molded insulation'
[patent_app_type] => utility
[patent_app_number] => 11/614281
[patent_app_country] => US
[patent_app_date] => 2006-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/608/07608482.pdf
[firstpage_image] =>[orig_patent_app_number] => 11614281
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/614281 | Integrated circuit package with molded insulation | Dec 20, 2006 | Issued |
Array
(
[id] => 5217545
[patent_doc_number] => 20070158856
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES'
[patent_app_type] => utility
[patent_app_number] => 11/612471
[patent_app_country] => US
[patent_app_date] => 2006-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0158/20070158856.pdf
[firstpage_image] =>[orig_patent_app_number] => 11612471
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/612471 | GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES | Dec 17, 2006 | Abandoned |
Array
(
[id] => 4980657
[patent_doc_number] => 20070085213
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-19
[patent_title] => 'Selective electroless-plated copper metallization'
[patent_app_type] => utility
[patent_app_number] => 11/639020
[patent_app_country] => US
[patent_app_date] => 2006-12-14
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0085/20070085213.pdf
[firstpage_image] =>[orig_patent_app_number] => 11639020
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/639020 | Selective electroless-plated copper metallization | Dec 13, 2006 | Abandoned |
Array
(
[id] => 43610
[patent_doc_number] => 07781852
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-08-24
[patent_title] => 'Membrane die attach circuit element package and method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/566731
[patent_app_country] => US
[patent_app_date] => 2006-12-05
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[pdf_file] => patents/07/781/07781852.pdf
[firstpage_image] =>[orig_patent_app_number] => 11566731
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/566731 | Membrane die attach circuit element package and method therefor | Dec 4, 2006 | Issued |
Array
(
[id] => 806623
[patent_doc_number] => 07419855
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2008-09-02
[patent_title] => 'Apparatus and method for miniature semiconductor packages'
[patent_app_type] => utility
[patent_app_number] => 11/607141
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/419/07419855.pdf
[firstpage_image] =>[orig_patent_app_number] => 11607141
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/607141 | Apparatus and method for miniature semiconductor packages | Nov 30, 2006 | Issued |