
Thanhnga B. Truong
Examiner (ID: 2062)
| Most Active Art Unit | 2438 |
| Art Unit(s) | 2435, 2135, 2438, 2498 |
| Total Applications | 886 |
| Issued Applications | 752 |
| Pending Applications | 24 |
| Abandoned Applications | 114 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5488279
[patent_doc_number] => 20090289350
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-26
[patent_title] => 'SEMICONDUCTOR PACKAGE, SUBSTRATE, ELECTRONIC DEVICE USING SUCH SEMICONDUCTOR PACKAGE OR SUBSTRATE, AND METHOD FOR CORRECTING WARPING OF SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/066795
[patent_app_country] => US
[patent_app_date] => 2006-07-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7555
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 9
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0289/20090289350.pdf
[firstpage_image] =>[orig_patent_app_number] => 12066795
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/066795 | SEMICONDUCTOR PACKAGE, SUBSTRATE, ELECTRONIC DEVICE USING SUCH SEMICONDUCTOR PACKAGE OR SUBSTRATE, AND METHOD FOR CORRECTING WARPING OF SEMICONDUCTOR PACKAGE | Jul 4, 2006 | Abandoned |
Array
(
[id] => 6410475
[patent_doc_number] => 20100140778
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-06-10
[patent_title] => 'PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/993739
[patent_app_country] => US
[patent_app_date] => 2006-07-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3297
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0140/20100140778.pdf
[firstpage_image] =>[orig_patent_app_number] => 11993739
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/993739 | PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF | Jul 3, 2006 | Abandoned |
Array
(
[id] => 4930489
[patent_doc_number] => 20080001264
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-03
[patent_title] => 'Exposed top side copper leadframe manufacturing'
[patent_app_type] => utility
[patent_app_number] => 11/480801
[patent_app_country] => US
[patent_app_date] => 2006-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4094
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20080001264.pdf
[firstpage_image] =>[orig_patent_app_number] => 11480801
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/480801 | Exposed top side copper leadframe manufacturing | Jul 2, 2006 | Abandoned |
Array
(
[id] => 5110550
[patent_doc_number] => 20070194465
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-23
[patent_title] => 'LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/309041
[patent_app_country] => US
[patent_app_date] => 2006-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 7250
[patent_no_of_claims] => 47
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0194/20070194465.pdf
[firstpage_image] =>[orig_patent_app_number] => 11309041
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/309041 | Light emitting diode package structure and fabricating method thereof | Jun 12, 2006 | Issued |
Array
(
[id] => 7599539
[patent_doc_number] => 07582909
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-09-01
[patent_title] => 'Mounting and adhesive layer for semiconductor components'
[patent_app_type] => utility
[patent_app_number] => 11/450902
[patent_app_country] => US
[patent_app_date] => 2006-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1407
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/582/07582909.pdf
[firstpage_image] =>[orig_patent_app_number] => 11450902
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/450902 | Mounting and adhesive layer for semiconductor components | Jun 8, 2006 | Issued |
Array
(
[id] => 5008222
[patent_doc_number] => 20070278699
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-06
[patent_title] => 'Microelectronic element chips'
[patent_app_type] => utility
[patent_app_number] => 11/445072
[patent_app_country] => US
[patent_app_date] => 2006-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5209
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0278/20070278699.pdf
[firstpage_image] =>[orig_patent_app_number] => 11445072
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/445072 | Microelectronic element chips | May 30, 2006 | Issued |
Array
(
[id] => 4795365
[patent_doc_number] => 20080006951
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'Copper bonding compatible bond pad structure and method'
[patent_app_type] => utility
[patent_app_number] => 11/444977
[patent_app_country] => US
[patent_app_date] => 2006-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1848
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20080006951.pdf
[firstpage_image] =>[orig_patent_app_number] => 11444977
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/444977 | Copper bonding compatible bond pad structure and method | May 30, 2006 | Issued |
Array
(
[id] => 8153200
[patent_doc_number] => 08169090
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-05-01
[patent_title] => 'Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/915806
[patent_app_country] => US
[patent_app_date] => 2006-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 13398
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/169/08169090.pdf
[firstpage_image] =>[orig_patent_app_number] => 11915806
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/915806 | Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same | May 29, 2006 | Issued |
Array
(
[id] => 5478694
[patent_doc_number] => 20090201651
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-13
[patent_title] => 'RESIN SEALING SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING RESIN SEALING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/302376
[patent_app_country] => US
[patent_app_date] => 2006-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 17813
[patent_no_of_claims] => 14
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0201/20090201651.pdf
[firstpage_image] =>[orig_patent_app_number] => 12302376
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/302376 | Resin sealing semiconductor device and electronic device using resin sealing semiconductor device | May 29, 2006 | Issued |
Array
(
[id] => 5008183
[patent_doc_number] => 20070278660
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-06
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 11/421051
[patent_app_country] => US
[patent_app_date] => 2006-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3334
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0278/20070278660.pdf
[firstpage_image] =>[orig_patent_app_number] => 11421051
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/421051 | Integrated circuit package system with edge connection system | May 29, 2006 | Issued |
Array
(
[id] => 5082991
[patent_doc_number] => 20070273042
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-29
[patent_title] => 'Copper-filled trench contact for transistor performance improvement'
[patent_app_type] => utility
[patent_app_number] => 11/396201
[patent_app_country] => US
[patent_app_date] => 2006-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7085
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0273/20070273042.pdf
[firstpage_image] =>[orig_patent_app_number] => 11396201
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/396201 | Copper-filled trench contact for transistor performance improvement | May 22, 2006 | Issued |
Array
(
[id] => 103677
[patent_doc_number] => 07723728
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-25
[patent_title] => 'Fan-out wire structure for a display panel'
[patent_app_type] => utility
[patent_app_number] => 11/438382
[patent_app_country] => US
[patent_app_date] => 2006-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2547
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/723/07723728.pdf
[firstpage_image] =>[orig_patent_app_number] => 11438382
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/438382 | Fan-out wire structure for a display panel | May 21, 2006 | Issued |
Array
(
[id] => 5730336
[patent_doc_number] => 20060255450
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Devices incorporating carbon nanotube thermal pads'
[patent_app_type] => utility
[patent_app_number] => 11/433311
[patent_app_country] => US
[patent_app_date] => 2006-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[pdf_file] => publications/A1/0255/20060255450.pdf
[firstpage_image] =>[orig_patent_app_number] => 11433311
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/433311 | Devices incorporating carbon nanotube thermal pads | May 10, 2006 | Abandoned |
Array
(
[id] => 5705318
[patent_doc_number] => 20060194366
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-31
[patent_title] => 'MULTI-CHIP BALL GRID ARRAY PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/382245
[patent_app_country] => US
[patent_app_date] => 2006-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
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[pdf_file] => publications/A1/0194/20060194366.pdf
[firstpage_image] =>[orig_patent_app_number] => 11382245
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/382245 | MULTI-CHIP BALL GRID ARRAY PACKAGE | May 7, 2006 | Abandoned |
Array
(
[id] => 341579
[patent_doc_number] => 07501337
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-10
[patent_title] => 'Dual metal stud bumping for flip chip applications'
[patent_app_type] => utility
[patent_app_number] => 11/404650
[patent_app_country] => US
[patent_app_date] => 2006-04-14
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/501/07501337.pdf
[firstpage_image] =>[orig_patent_app_number] => 11404650
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/404650 | Dual metal stud bumping for flip chip applications | Apr 13, 2006 | Issued |
Array
(
[id] => 5191900
[patent_doc_number] => 20070080382
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-12
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/401902
[patent_app_country] => US
[patent_app_date] => 2006-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 95
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[pdf_file] => publications/A1/0080/20070080382.pdf
[firstpage_image] =>[orig_patent_app_number] => 11401902
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/401902 | Semiconductor device | Apr 11, 2006 | Abandoned |
Array
(
[id] => 4582508
[patent_doc_number] => 07851268
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-12-14
[patent_title] => 'Integrated circuit package system using heat slug'
[patent_app_type] => utility
[patent_app_number] => 11/279131
[patent_app_country] => US
[patent_app_date] => 2006-04-10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/851/07851268.pdf
[firstpage_image] =>[orig_patent_app_number] => 11279131
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/279131 | Integrated circuit package system using heat slug | Apr 9, 2006 | Issued |
Array
(
[id] => 205383
[patent_doc_number] => 07629684
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[patent_kind] => B2
[patent_issue_date] => 2009-12-08
[patent_title] => 'Adjustable thickness thermal interposer and electronic package utilizing same'
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[pdf_file] => patents/07/629/07629684.pdf
[firstpage_image] =>[orig_patent_app_number] => 11396711
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/396711 | Adjustable thickness thermal interposer and electronic package utilizing same | Apr 3, 2006 | Issued |
Array
(
[id] => 4576933
[patent_doc_number] => 07829986
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[patent_kind] => B2
[patent_issue_date] => 2010-11-09
[patent_title] => 'Integrated circuit package system with net spacer'
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[pdf_file] => patents/07/829/07829986.pdf
[firstpage_image] =>[orig_patent_app_number] => 11278411
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/278411 | Integrated circuit package system with net spacer | Mar 31, 2006 | Issued |
Array
(
[id] => 589209
[patent_doc_number] => 07443037
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-28
[patent_title] => 'Stacked integrated circuit package system with connection protection'
[patent_app_type] => utility
[patent_app_number] => 11/278421
[patent_app_country] => US
[patent_app_date] => 2006-04-01
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/443/07443037.pdf
[firstpage_image] =>[orig_patent_app_number] => 11278421
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/278421 | Stacked integrated circuit package system with connection protection | Mar 31, 2006 | Issued |