Search

Thanhnga B. Truong

Examiner (ID: 2062)

Most Active Art Unit
2438
Art Unit(s)
2435, 2135, 2438, 2498
Total Applications
886
Issued Applications
752
Pending Applications
24
Abandoned Applications
114

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5488279 [patent_doc_number] => 20090289350 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-26 [patent_title] => 'SEMICONDUCTOR PACKAGE, SUBSTRATE, ELECTRONIC DEVICE USING SUCH SEMICONDUCTOR PACKAGE OR SUBSTRATE, AND METHOD FOR CORRECTING WARPING OF SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/066795 [patent_app_country] => US [patent_app_date] => 2006-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7555 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0289/20090289350.pdf [firstpage_image] =>[orig_patent_app_number] => 12066795 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/066795
SEMICONDUCTOR PACKAGE, SUBSTRATE, ELECTRONIC DEVICE USING SUCH SEMICONDUCTOR PACKAGE OR SUBSTRATE, AND METHOD FOR CORRECTING WARPING OF SEMICONDUCTOR PACKAGE Jul 4, 2006 Abandoned
Array ( [id] => 6410475 [patent_doc_number] => 20100140778 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-10 [patent_title] => 'PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF' [patent_app_type] => utility [patent_app_number] => 11/993739 [patent_app_country] => US [patent_app_date] => 2006-07-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3297 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20100140778.pdf [firstpage_image] =>[orig_patent_app_number] => 11993739 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/993739
PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF Jul 3, 2006 Abandoned
Array ( [id] => 4930489 [patent_doc_number] => 20080001264 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'Exposed top side copper leadframe manufacturing' [patent_app_type] => utility [patent_app_number] => 11/480801 [patent_app_country] => US [patent_app_date] => 2006-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4094 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20080001264.pdf [firstpage_image] =>[orig_patent_app_number] => 11480801 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/480801
Exposed top side copper leadframe manufacturing Jul 2, 2006 Abandoned
Array ( [id] => 5110550 [patent_doc_number] => 20070194465 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-23 [patent_title] => 'LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 11/309041 [patent_app_country] => US [patent_app_date] => 2006-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 7250 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0194/20070194465.pdf [firstpage_image] =>[orig_patent_app_number] => 11309041 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/309041
Light emitting diode package structure and fabricating method thereof Jun 12, 2006 Issued
Array ( [id] => 7599539 [patent_doc_number] => 07582909 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-01 [patent_title] => 'Mounting and adhesive layer for semiconductor components' [patent_app_type] => utility [patent_app_number] => 11/450902 [patent_app_country] => US [patent_app_date] => 2006-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1407 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/582/07582909.pdf [firstpage_image] =>[orig_patent_app_number] => 11450902 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/450902
Mounting and adhesive layer for semiconductor components Jun 8, 2006 Issued
Array ( [id] => 5008222 [patent_doc_number] => 20070278699 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-06 [patent_title] => 'Microelectronic element chips' [patent_app_type] => utility [patent_app_number] => 11/445072 [patent_app_country] => US [patent_app_date] => 2006-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5209 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20070278699.pdf [firstpage_image] =>[orig_patent_app_number] => 11445072 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/445072
Microelectronic element chips May 30, 2006 Issued
Array ( [id] => 4795365 [patent_doc_number] => 20080006951 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-10 [patent_title] => 'Copper bonding compatible bond pad structure and method' [patent_app_type] => utility [patent_app_number] => 11/444977 [patent_app_country] => US [patent_app_date] => 2006-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1848 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20080006951.pdf [firstpage_image] =>[orig_patent_app_number] => 11444977 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/444977
Copper bonding compatible bond pad structure and method May 30, 2006 Issued
Array ( [id] => 8153200 [patent_doc_number] => 08169090 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-01 [patent_title] => 'Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same' [patent_app_type] => utility [patent_app_number] => 11/915806 [patent_app_country] => US [patent_app_date] => 2006-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 13398 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/169/08169090.pdf [firstpage_image] =>[orig_patent_app_number] => 11915806 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/915806
Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same May 29, 2006 Issued
Array ( [id] => 5478694 [patent_doc_number] => 20090201651 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-13 [patent_title] => 'RESIN SEALING SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING RESIN SEALING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/302376 [patent_app_country] => US [patent_app_date] => 2006-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 17813 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0201/20090201651.pdf [firstpage_image] =>[orig_patent_app_number] => 12302376 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/302376
Resin sealing semiconductor device and electronic device using resin sealing semiconductor device May 29, 2006 Issued
Array ( [id] => 5008183 [patent_doc_number] => 20070278660 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-06 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EDGE CONNECTION SYSTEM' [patent_app_type] => utility [patent_app_number] => 11/421051 [patent_app_country] => US [patent_app_date] => 2006-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3334 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20070278660.pdf [firstpage_image] =>[orig_patent_app_number] => 11421051 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/421051
Integrated circuit package system with edge connection system May 29, 2006 Issued
Array ( [id] => 5082991 [patent_doc_number] => 20070273042 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-29 [patent_title] => 'Copper-filled trench contact for transistor performance improvement' [patent_app_type] => utility [patent_app_number] => 11/396201 [patent_app_country] => US [patent_app_date] => 2006-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7085 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0273/20070273042.pdf [firstpage_image] =>[orig_patent_app_number] => 11396201 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/396201
Copper-filled trench contact for transistor performance improvement May 22, 2006 Issued
Array ( [id] => 103677 [patent_doc_number] => 07723728 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-25 [patent_title] => 'Fan-out wire structure for a display panel' [patent_app_type] => utility [patent_app_number] => 11/438382 [patent_app_country] => US [patent_app_date] => 2006-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2547 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/723/07723728.pdf [firstpage_image] =>[orig_patent_app_number] => 11438382 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/438382
Fan-out wire structure for a display panel May 21, 2006 Issued
Array ( [id] => 5730336 [patent_doc_number] => 20060255450 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-16 [patent_title] => 'Devices incorporating carbon nanotube thermal pads' [patent_app_type] => utility [patent_app_number] => 11/433311 [patent_app_country] => US [patent_app_date] => 2006-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 8912 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0255/20060255450.pdf [firstpage_image] =>[orig_patent_app_number] => 11433311 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/433311
Devices incorporating carbon nanotube thermal pads May 10, 2006 Abandoned
Array ( [id] => 5705318 [patent_doc_number] => 20060194366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-08-31 [patent_title] => 'MULTI-CHIP BALL GRID ARRAY PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/382245 [patent_app_country] => US [patent_app_date] => 2006-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 13282 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0194/20060194366.pdf [firstpage_image] =>[orig_patent_app_number] => 11382245 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/382245
MULTI-CHIP BALL GRID ARRAY PACKAGE May 7, 2006 Abandoned
Array ( [id] => 341579 [patent_doc_number] => 07501337 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-10 [patent_title] => 'Dual metal stud bumping for flip chip applications' [patent_app_type] => utility [patent_app_number] => 11/404650 [patent_app_country] => US [patent_app_date] => 2006-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3139 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/501/07501337.pdf [firstpage_image] =>[orig_patent_app_number] => 11404650 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/404650
Dual metal stud bumping for flip chip applications Apr 13, 2006 Issued
Array ( [id] => 5191900 [patent_doc_number] => 20070080382 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-12 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/401902 [patent_app_country] => US [patent_app_date] => 2006-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 95 [patent_figures_cnt] => 95 [patent_no_of_words] => 65682 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0080/20070080382.pdf [firstpage_image] =>[orig_patent_app_number] => 11401902 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/401902
Semiconductor device Apr 11, 2006 Abandoned
Array ( [id] => 4582508 [patent_doc_number] => 07851268 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-14 [patent_title] => 'Integrated circuit package system using heat slug' [patent_app_type] => utility [patent_app_number] => 11/279131 [patent_app_country] => US [patent_app_date] => 2006-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3891 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/851/07851268.pdf [firstpage_image] =>[orig_patent_app_number] => 11279131 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/279131
Integrated circuit package system using heat slug Apr 9, 2006 Issued
Array ( [id] => 205383 [patent_doc_number] => 07629684 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-08 [patent_title] => 'Adjustable thickness thermal interposer and electronic package utilizing same' [patent_app_type] => utility [patent_app_number] => 11/396711 [patent_app_country] => US [patent_app_date] => 2006-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 5038 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/629/07629684.pdf [firstpage_image] =>[orig_patent_app_number] => 11396711 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/396711
Adjustable thickness thermal interposer and electronic package utilizing same Apr 3, 2006 Issued
Array ( [id] => 4576933 [patent_doc_number] => 07829986 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-09 [patent_title] => 'Integrated circuit package system with net spacer' [patent_app_type] => utility [patent_app_number] => 11/278411 [patent_app_country] => US [patent_app_date] => 2006-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 33 [patent_no_of_words] => 7358 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/829/07829986.pdf [firstpage_image] =>[orig_patent_app_number] => 11278411 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/278411
Integrated circuit package system with net spacer Mar 31, 2006 Issued
Array ( [id] => 589209 [patent_doc_number] => 07443037 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-10-28 [patent_title] => 'Stacked integrated circuit package system with connection protection' [patent_app_type] => utility [patent_app_number] => 11/278421 [patent_app_country] => US [patent_app_date] => 2006-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3792 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/443/07443037.pdf [firstpage_image] =>[orig_patent_app_number] => 11278421 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/278421
Stacked integrated circuit package system with connection protection Mar 31, 2006 Issued
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