Search

Thanhnga B. Truong

Examiner (ID: 2062)

Most Active Art Unit
2438
Art Unit(s)
2435, 2135, 2438, 2498
Total Applications
886
Issued Applications
752
Pending Applications
24
Abandoned Applications
114

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5123584 [patent_doc_number] => 20070235854 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH GROUND RING' [patent_app_type] => utility [patent_app_number] => 11/277991 [patent_app_country] => US [patent_app_date] => 2006-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3721 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235854.pdf [firstpage_image] =>[orig_patent_app_number] => 11277991 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/277991
Integrated circuit package system with ground ring Mar 29, 2006 Issued
Array ( [id] => 5123610 [patent_doc_number] => 20070235880 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/308492 [patent_app_country] => US [patent_app_date] => 2006-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4613 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235880.pdf [firstpage_image] =>[orig_patent_app_number] => 11308492 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/308492
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Mar 29, 2006 Abandoned
Array ( [id] => 5123592 [patent_doc_number] => 20070235862 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'Hybrid flip-chip and wire-bond connection package system' [patent_app_type] => utility [patent_app_number] => 11/393301 [patent_app_country] => US [patent_app_date] => 2006-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2045 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235862.pdf [firstpage_image] =>[orig_patent_app_number] => 11393301 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/393301
Hybrid flip-chip and wire-bond connection package system Mar 28, 2006 Abandoned
Array ( [id] => 5834797 [patent_doc_number] => 20060246628 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-02 [patent_title] => 'Chipcard with contact areas and method for producing contact areas' [patent_app_type] => utility [patent_app_number] => 11/392451 [patent_app_country] => US [patent_app_date] => 2006-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2172 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20060246628.pdf [firstpage_image] =>[orig_patent_app_number] => 11392451 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/392451
Chipcard with contact areas and method for producing contact areas Mar 28, 2006 Issued
Array ( [id] => 4974796 [patent_doc_number] => 20070216026 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-20 [patent_title] => 'Aluminum bump bonding for fine aluminum wire' [patent_app_type] => utility [patent_app_number] => 11/385022 [patent_app_country] => US [patent_app_date] => 2006-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1631 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0216/20070216026.pdf [firstpage_image] =>[orig_patent_app_number] => 11385022 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/385022
Aluminum bump bonding for fine aluminum wire Mar 19, 2006 Abandoned
Array ( [id] => 4974811 [patent_doc_number] => 20070216041 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-20 [patent_title] => 'Fiducial scheme adapted for stacked integrated circuits' [patent_app_type] => utility [patent_app_number] => 11/385941 [patent_app_country] => US [patent_app_date] => 2006-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3456 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0216/20070216041.pdf [firstpage_image] =>[orig_patent_app_number] => 11385941 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/385941
Fiducial scheme adapted for stacked integrated circuits Mar 19, 2006 Issued
Array ( [id] => 5758569 [patent_doc_number] => 20060209514 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'Semiconductor device and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 11/377861 [patent_app_country] => US [patent_app_date] => 2006-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4609 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0209/20060209514.pdf [firstpage_image] =>[orig_patent_app_number] => 11377861 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/377861
Semiconductor device and manufacturing method therefor Mar 16, 2006 Abandoned
Array ( [id] => 5754080 [patent_doc_number] => 20060223229 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-10-05 [patent_title] => 'Ball grid array package and process for manufacturing same' [patent_app_type] => utility [patent_app_number] => 11/377425 [patent_app_country] => US [patent_app_date] => 2006-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 4073 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0223/20060223229.pdf [firstpage_image] =>[orig_patent_app_number] => 11377425 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/377425
Ball grid array package and process for manufacturing same Mar 16, 2006 Abandoned
Array ( [id] => 5697468 [patent_doc_number] => 20060214152 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Light emitting device' [patent_app_type] => utility [patent_app_number] => 11/376842 [patent_app_country] => US [patent_app_date] => 2006-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 21597 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20060214152.pdf [firstpage_image] =>[orig_patent_app_number] => 11376842 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/376842
Light emitting device Mar 15, 2006 Issued
Array ( [id] => 5256812 [patent_doc_number] => 20070210444 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-13 [patent_title] => 'Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards' [patent_app_type] => utility [patent_app_number] => 11/373941 [patent_app_country] => US [patent_app_date] => 2006-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5110 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20070210444.pdf [firstpage_image] =>[orig_patent_app_number] => 11373941 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/373941
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Mar 12, 2006 Issued
Array ( [id] => 5256815 [patent_doc_number] => 20070210447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-13 [patent_title] => 'Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems and methods' [patent_app_type] => utility [patent_app_number] => 11/369571 [patent_app_country] => US [patent_app_date] => 2006-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 10314 [patent_no_of_claims] => 90 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20070210447.pdf [firstpage_image] =>[orig_patent_app_number] => 11369571 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/369571
Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems Mar 6, 2006 Issued
Array ( [id] => 163252 [patent_doc_number] => 07671458 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-03-02 [patent_title] => 'Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same' [patent_app_type] => utility [patent_app_number] => 11/367272 [patent_app_country] => US [patent_app_date] => 2006-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 6898 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/671/07671458.pdf [firstpage_image] =>[orig_patent_app_number] => 11367272 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/367272
Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same Mar 5, 2006 Issued
Array ( [id] => 7592840 [patent_doc_number] => 07652361 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-01-26 [patent_title] => 'Land patterns for a semiconductor stacking structure and method therefor' [patent_app_type] => utility [patent_app_number] => 11/367171 [patent_app_country] => US [patent_app_date] => 2006-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2413 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/652/07652361.pdf [firstpage_image] =>[orig_patent_app_number] => 11367171 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/367171
Land patterns for a semiconductor stacking structure and method therefor Mar 2, 2006 Issued
Array ( [id] => 4983078 [patent_doc_number] => 20070087636 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-19 [patent_title] => 'Contact member, connector, substrate and contact system' [patent_app_type] => utility [patent_app_number] => 11/362837 [patent_app_country] => US [patent_app_date] => 2006-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3950 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0087/20070087636.pdf [firstpage_image] =>[orig_patent_app_number] => 11362837 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/362837
Contact member, connector, substrate and contact system Feb 27, 2006 Abandoned
Array ( [id] => 160238 [patent_doc_number] => 07675180 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-03-09 [patent_title] => 'Stacked electronic component package having film-on-wire spacer' [patent_app_type] => utility [patent_app_number] => 11/356921 [patent_app_country] => US [patent_app_date] => 2006-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 12698 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/675/07675180.pdf [firstpage_image] =>[orig_patent_app_number] => 11356921 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/356921
Stacked electronic component package having film-on-wire spacer Feb 16, 2006 Issued
Array ( [id] => 289357 [patent_doc_number] => 07547973 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-16 [patent_title] => 'Tamper-resistant semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/354331 [patent_app_country] => US [patent_app_date] => 2006-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5722 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/547/07547973.pdf [firstpage_image] =>[orig_patent_app_number] => 11354331 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/354331
Tamper-resistant semiconductor device Feb 14, 2006 Issued
Array ( [id] => 315229 [patent_doc_number] => 07525201 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-28 [patent_title] => 'Semiconductor chip having solder bumps and dummy bumps' [patent_app_type] => utility [patent_app_number] => 11/352352 [patent_app_country] => US [patent_app_date] => 2006-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 3472 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/525/07525201.pdf [firstpage_image] =>[orig_patent_app_number] => 11352352 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/352352
Semiconductor chip having solder bumps and dummy bumps Feb 12, 2006 Issued
Array ( [id] => 338369 [patent_doc_number] => 07504714 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-17 [patent_title] => 'Chip package with asymmetric molding' [patent_app_type] => utility [patent_app_number] => 11/351651 [patent_app_country] => US [patent_app_date] => 2006-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 3819 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/504/07504714.pdf [firstpage_image] =>[orig_patent_app_number] => 11351651 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/351651
Chip package with asymmetric molding Feb 9, 2006 Issued
Array ( [id] => 256739 [patent_doc_number] => 07576416 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-08-18 [patent_title] => 'Chip package having with asymmetric molding and turbulent plate downset design' [patent_app_type] => utility [patent_app_number] => 11/352001 [patent_app_country] => US [patent_app_date] => 2006-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 4639 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 228 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/576/07576416.pdf [firstpage_image] =>[orig_patent_app_number] => 11352001 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/352001
Chip package having with asymmetric molding and turbulent plate downset design Feb 9, 2006 Issued
Array ( [id] => 75321 [patent_doc_number] => 07750482 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-06 [patent_title] => 'Integrated circuit package system including zero fillet resin' [patent_app_type] => utility [patent_app_number] => 11/307482 [patent_app_country] => US [patent_app_date] => 2006-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2593 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/750/07750482.pdf [firstpage_image] =>[orig_patent_app_number] => 11307482 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/307482
Integrated circuit package system including zero fillet resin Feb 8, 2006 Issued
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