Thanhnga B. Truong

Array ( [id] => 6956559 [patent_doc_number] => 20050212929 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-29 [patent_title] => 'System and method of integrating optics into an IC package' [patent_app_type] => utility [patent_app_number] => 11/090432 [patent_app_country] => US [patent_app_date] => 2005-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2411 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20050212929.pdf [firstpage_image] =>[orig_patent_app_number] => 11090432 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7016474 [patent_doc_number] => 20050218491 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-06 [patent_title] => 'Circuit component module and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/090812 [patent_app_country] => US [patent_app_date] => 2005-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 9010 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0218/20050218491.pdf [firstpage_image] =>[orig_patent_app_number] => 11090812 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5760222 [patent_doc_number] => 20060211167 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC \nI/O CURRENT CAPABILITIES' [patent_app_type] => utility [patent_app_number] => 10/907062 [patent_app_country] => US [patent_app_date] => 2005-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3304 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0211/20060211167.pdf [firstpage_image] =>[orig_patent_app_number] => 10907062 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7108523 [patent_doc_number] => 20050205976 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-22 [patent_title] => 'Circuit device and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/082151 [patent_app_country] => US [patent_app_date] => 2005-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 8689 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0205/20050205976.pdf [firstpage_image] =>[orig_patent_app_number] => 11082151 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 918370 [patent_doc_number] => 07323779 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-29 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/080461 [patent_app_country] => US [patent_app_date] => 2005-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3446 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/323/07323779.pdf [firstpage_image] =>[orig_patent_app_number] => 11080461 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 452916 [patent_doc_number] => 07247520 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-07-24 [patent_title] => 'Microelectronic component assemblies and microelectronic component lead frame structures' [patent_app_type] => utility [patent_app_number] => 11/081236 [patent_app_country] => US [patent_app_date] => 2005-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 6173 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/247/07247520.pdf [firstpage_image] =>[orig_patent_app_number] => 11081236 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5780208 [patent_doc_number] => 20060202303 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-14 [patent_title] => 'Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs' [patent_app_type] => utility [patent_app_number] => 11/078052 [patent_app_country] => US [patent_app_date] => 2005-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4246 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0202/20060202303.pdf [firstpage_image] =>[orig_patent_app_number] => 11078052 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7036279 [patent_doc_number] => 20050155957 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-21 [patent_title] => 'Method of forming an opening or cavity in a substrate for receiving an electronic component' [patent_app_type] => utility [patent_app_number] => 11/070561 [patent_app_country] => US [patent_app_date] => 2005-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2799 [patent_no_of_claims] => 64 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20050155957.pdf [firstpage_image] =>[orig_patent_app_number] => 11070561 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7176703 [patent_doc_number] => 20050189635 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-01 [patent_title] => 'Packaged acoustic and electromagnetic transducer chips' [patent_app_type] => utility [patent_app_number] => 11/068831 [patent_app_country] => US [patent_app_date] => 2005-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 15580 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20050189635.pdf [firstpage_image] =>[orig_patent_app_number] => 11068831 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7176701 [patent_doc_number] => 20050189634 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-01 [patent_title] => 'Semiconductor module and method of manufacturing thereof' [patent_app_type] => utility [patent_app_number] => 11/063610 [patent_app_country] => US [patent_app_date] => 2005-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4241 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20050189634.pdf [firstpage_image] =>[orig_patent_app_number] => 11063610 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 422177 [patent_doc_number] => 07274110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-09-25 [patent_title] => 'Semiconductor component having a CSP housing' [patent_app_type] => utility [patent_app_number] => 11/061762 [patent_app_country] => US [patent_app_date] => 2005-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2263 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/274/07274110.pdf [firstpage_image] =>[orig_patent_app_number] => 11061762 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 925901 [patent_doc_number] => 07317199 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-01-08 [patent_title] => 'Circuit device' [patent_app_type] => utility [patent_app_number] => 11/057932 [patent_app_country] => US [patent_app_date] => 2005-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 25 [patent_no_of_words] => 8239 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/317/07317199.pdf [firstpage_image] =>[orig_patent_app_number] => 11057932 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 143242 [patent_doc_number] => 07692315 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-06 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/055652 [patent_app_country] => US [patent_app_date] => 2005-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 56 [patent_no_of_words] => 14584 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/692/07692315.pdf [firstpage_image] =>[orig_patent_app_number] => 11055652 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7002493 [patent_doc_number] => 20050167806 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-08-04 [patent_title] => 'Method and apparatus for providing an integrated circuit cover' [patent_app_type] => utility [patent_app_number] => 11/053862 [patent_app_country] => US [patent_app_date] => 2005-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 8823 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0167/20050167806.pdf [firstpage_image] =>[orig_patent_app_number] => 11053862 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7176752 [patent_doc_number] => 20050189646 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-09-01 [patent_title] => 'Packaged die on PCB with heat sink encapsulant and methods' [patent_app_type] => utility [patent_app_number] => 11/053082 [patent_app_country] => US [patent_app_date] => 2005-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3240 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20050189646.pdf [firstpage_image] =>[orig_patent_app_number] => 11053082 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5043796 [patent_doc_number] => 20070262467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-15 [patent_title] => 'Semiconductor Device Having a Chip Stack on a Rewiring Plate' [patent_app_type] => utility [patent_app_number] => 10/588401 [patent_app_country] => US [patent_app_date] => 2005-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5081 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0262/20070262467.pdf [firstpage_image] =>[orig_patent_app_number] => 10588401 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 915300 [patent_doc_number] => 07326973 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-05 [patent_title] => 'Method and an apparatus for a hard-coded bit value changeable in any layer of metal' [patent_app_type] => utility [patent_app_number] => 11/049435 [patent_app_country] => US [patent_app_date] => 2005-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 4071 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/326/07326973.pdf [firstpage_image] =>[orig_patent_app_number] => 11049435 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6927637 [patent_doc_number] => 20050240894 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-27 [patent_title] => 'Multidirectional wiring on a single metal layer' [patent_app_type] => utility [patent_app_number] => 11/031472 [patent_app_country] => US [patent_app_date] => 2005-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 7964 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0240/20050240894.pdf [firstpage_image] =>[orig_patent_app_number] => 11031472 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5628851 [patent_doc_number] => 20060145319 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-06 [patent_title] => 'Flip chip contact (FCC) power package' [patent_app_type] => utility [patent_app_number] => 11/027081 [patent_app_country] => US [patent_app_date] => 2004-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3490 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20060145319.pdf [firstpage_image] =>[orig_patent_app_number] => 11027081 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5628843 [patent_doc_number] => 20060145311 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-06 [patent_title] => 'Low cost lead-free preplated leadframe having improved adhesion and solderability' [patent_app_type] => utility [patent_app_number] => 11/026841 [patent_app_country] => US [patent_app_date] => 2004-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2753 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20060145311.pdf [firstpage_image] =>[orig_patent_app_number] => 11026841 [rel_patent_id] =>[rel_patent_doc_number] =>)