
Thanhnga B. Truong
Examiner (ID: 2062)
| Most Active Art Unit | 2438 |
| Art Unit(s) | 2435, 2135, 2438, 2498 |
| Total Applications | 886 |
| Issued Applications | 752 |
| Pending Applications | 24 |
| Abandoned Applications | 114 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5628852
[patent_doc_number] => 20060145320
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-06
[patent_title] => 'Embedded heat spreader'
[patent_app_type] => utility
[patent_app_number] => 11/027291
[patent_app_country] => US
[patent_app_date] => 2004-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1875
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0145/20060145320.pdf
[firstpage_image] =>[orig_patent_app_number] => 11027291
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/027291 | Embedded heat spreader | Dec 29, 2004 | Issued |
Array
(
[id] => 5652891
[patent_doc_number] => 20060138626
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'Microelectronic packages using a ceramic substrate having a window and a conductive surface region'
[patent_app_type] => utility
[patent_app_number] => 11/025432
[patent_app_country] => US
[patent_app_date] => 2004-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 7473
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0138/20060138626.pdf
[firstpage_image] =>[orig_patent_app_number] => 11025432
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/025432 | Microelectronic packages using a ceramic substrate having a window and a conductive surface region | Dec 28, 2004 | Abandoned |
Array
(
[id] => 7101443
[patent_doc_number] => 20050104169
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-19
[patent_title] => 'Stress-free lead frame'
[patent_app_type] => utility
[patent_app_number] => 11/022071
[patent_app_country] => US
[patent_app_date] => 2004-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1498
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0104/20050104169.pdf
[firstpage_image] =>[orig_patent_app_number] => 11022071
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/022071 | Stress-free lead frame | Dec 22, 2004 | Issued |
Array
(
[id] => 865583
[patent_doc_number] => 07368825
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-06
[patent_title] => 'Power semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/019741
[patent_app_country] => US
[patent_app_date] => 2004-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 2567
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/368/07368825.pdf
[firstpage_image] =>[orig_patent_app_number] => 11019741
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/019741 | Power semiconductor device | Dec 22, 2004 | Issued |
Array
(
[id] => 7002489
[patent_doc_number] => 20050167802
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-04
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/019242
[patent_app_country] => US
[patent_app_date] => 2004-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 7748
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0167/20050167802.pdf
[firstpage_image] =>[orig_patent_app_number] => 11019242
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/019242 | Semiconductor device | Dec 22, 2004 | Abandoned |
Array
(
[id] => 6936591
[patent_doc_number] => 20050110152
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-26
[patent_title] => 'Method for forming openings in low dielectric constant material layer'
[patent_app_type] => utility
[patent_app_number] => 11/021411
[patent_app_country] => US
[patent_app_date] => 2004-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 3325
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20050110152.pdf
[firstpage_image] =>[orig_patent_app_number] => 11021411
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/021411 | Method for forming openings in low dielectric constant material layer | Dec 22, 2004 | Abandoned |
Array
(
[id] => 7183379
[patent_doc_number] => 20050161782
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-28
[patent_title] => 'HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 10/905251
[patent_app_country] => US
[patent_app_date] => 2004-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 4974
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0161/20050161782.pdf
[firstpage_image] =>[orig_patent_app_number] => 10905251
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/905251 | HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME | Dec 21, 2004 | Abandoned |
Array
(
[id] => 6903478
[patent_doc_number] => 20050098873
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-12
[patent_title] => 'Stacked module systems and methods'
[patent_app_type] => utility
[patent_app_number] => 11/015521
[patent_app_country] => US
[patent_app_date] => 2004-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 4265
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0098/20050098873.pdf
[firstpage_image] =>[orig_patent_app_number] => 11015521
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/015521 | Stacked module systems and methods | Dec 16, 2004 | Abandoned |
Array
(
[id] => 7599483
[patent_doc_number] => 07582965
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-09-01
[patent_title] => 'Electronic device and method for bonding an electronic device'
[patent_app_type] => utility
[patent_app_number] => 10/586942
[patent_app_country] => US
[patent_app_date] => 2004-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 1366
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/582/07582965.pdf
[firstpage_image] =>[orig_patent_app_number] => 10586942
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/586942 | Electronic device and method for bonding an electronic device | Dec 13, 2004 | Issued |
Array
(
[id] => 830492
[patent_doc_number] => 07400047
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-15
[patent_title] => 'Integrated circuit with stacked-die configuration utilizing substrate conduction'
[patent_app_type] => utility
[patent_app_number] => 11/010721
[patent_app_country] => US
[patent_app_date] => 2004-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4510
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/400/07400047.pdf
[firstpage_image] =>[orig_patent_app_number] => 11010721
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/010721 | Integrated circuit with stacked-die configuration utilizing substrate conduction | Dec 12, 2004 | Issued |
Array
(
[id] => 5233913
[patent_doc_number] => 20070126068
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-07
[patent_title] => 'Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent'
[patent_app_type] => utility
[patent_app_number] => 10/582521
[patent_app_country] => US
[patent_app_date] => 2004-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1643
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0126/20070126068.pdf
[firstpage_image] =>[orig_patent_app_number] => 10582521
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/582521 | Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent | Dec 12, 2004 | Issued |
Array
(
[id] => 5898316
[patent_doc_number] => 20060043549
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-02
[patent_title] => 'Micro-electronic package structure and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/008972
[patent_app_country] => US
[patent_app_date] => 2004-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4001
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0043/20060043549.pdf
[firstpage_image] =>[orig_patent_app_number] => 11008972
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/008972 | Micro-electronic package structure and method for fabricating the same | Dec 12, 2004 | Abandoned |
Array
(
[id] => 4971350
[patent_doc_number] => 20070111352
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'Wafer with optical control modules in dicing paths'
[patent_app_type] => utility
[patent_app_number] => 10/584102
[patent_app_country] => US
[patent_app_date] => 2004-12-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3801
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0111/20070111352.pdf
[firstpage_image] =>[orig_patent_app_number] => 10584102
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/584102 | Wafer with optical control modules in dicing paths | Dec 8, 2004 | Issued |
Array
(
[id] => 428991
[patent_doc_number] => 07268427
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-09-11
[patent_title] => 'Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board'
[patent_app_type] => utility
[patent_app_number] => 11/003402
[patent_app_country] => US
[patent_app_date] => 2004-12-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 11
[patent_no_of_words] => 5904
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/268/07268427.pdf
[firstpage_image] =>[orig_patent_app_number] => 11003402
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/003402 | Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board | Dec 5, 2004 | Issued |
Array
(
[id] => 5838289
[patent_doc_number] => 20060118947
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-08
[patent_title] => 'Thermal expansion compensating flip chip ball grid array package structure'
[patent_app_type] => utility
[patent_app_number] => 11/002192
[patent_app_country] => US
[patent_app_date] => 2004-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2408
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0118/20060118947.pdf
[firstpage_image] =>[orig_patent_app_number] => 11002192
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/002192 | Thermal expansion compensating flip chip ball grid array package structure | Dec 2, 2004 | Abandoned |
Array
(
[id] => 5838281
[patent_doc_number] => 20060118939
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-08
[patent_title] => 'Stacked electronics for sensors'
[patent_app_type] => utility
[patent_app_number] => 11/003602
[patent_app_country] => US
[patent_app_date] => 2004-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6119
[patent_no_of_claims] => 40
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0118/20060118939.pdf
[firstpage_image] =>[orig_patent_app_number] => 11003602
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/003602 | Stacked electronics for sensors | Dec 2, 2004 | Issued |
Array
(
[id] => 7067045
[patent_doc_number] => 20050242427
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-03
[patent_title] => 'FCBGA package structure'
[patent_app_type] => utility
[patent_app_number] => 10/997343
[patent_app_country] => US
[patent_app_date] => 2004-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2555
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0242/20050242427.pdf
[firstpage_image] =>[orig_patent_app_number] => 10997343
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/997343 | FCBGA package structure | Nov 23, 2004 | Abandoned |
Array
(
[id] => 4997611
[patent_doc_number] => 20070040245
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Anisotropic conductive sheet, manufacturing method thereof, and product using the same'
[patent_app_type] => utility
[patent_app_number] => 10/579342
[patent_app_country] => US
[patent_app_date] => 2004-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 39372
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0040/20070040245.pdf
[firstpage_image] =>[orig_patent_app_number] => 10579342
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/579342 | Anisotropic conductive sheet, manufacturing method thereof, and product using the same | Nov 14, 2004 | Abandoned |
Array
(
[id] => 14542
[patent_doc_number] => 07808115
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-05
[patent_title] => 'Test circuit under pad'
[patent_app_type] => utility
[patent_app_number] => 10/990122
[patent_app_country] => US
[patent_app_date] => 2004-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5094
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/808/07808115.pdf
[firstpage_image] =>[orig_patent_app_number] => 10990122
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/990122 | Test circuit under pad | Nov 14, 2004 | Issued |
Array
(
[id] => 4971565
[patent_doc_number] => 20070111567
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'Method and device for connecting chips'
[patent_app_type] => utility
[patent_app_number] => 10/577142
[patent_app_country] => US
[patent_app_date] => 2004-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2529
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0111/20070111567.pdf
[firstpage_image] =>[orig_patent_app_number] => 10577142
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/577142 | Method and device for connecting chips | Oct 27, 2004 | Issued |