Search

Thanhnga B. Truong

Examiner (ID: 2062)

Most Active Art Unit
2438
Art Unit(s)
2435, 2135, 2438, 2498
Total Applications
886
Issued Applications
752
Pending Applications
24
Abandoned Applications
114

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9663012 [patent_doc_number] => 08809996 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-19 [patent_title] => 'Package with passive devices and method of forming the same' [patent_app_type] => utility [patent_app_number] => 13/539149 [patent_app_country] => US [patent_app_date] => 2012-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 18 [patent_no_of_words] => 3848 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13539149 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/539149
Package with passive devices and method of forming the same Jun 28, 2012 Issued
Array ( [id] => 10864596 [patent_doc_number] => 08890302 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-18 [patent_title] => 'Hybrid package transmission line circuits' [patent_app_type] => utility [patent_app_number] => 13/538887 [patent_app_country] => US [patent_app_date] => 2012-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 6180 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13538887 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/538887
Hybrid package transmission line circuits Jun 28, 2012 Issued
Array ( [id] => 8604009 [patent_doc_number] => 20130009322 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-10 [patent_title] => 'Through-Substrate Via Having a Strip-Shaped Through-Hole Signal Conductor' [patent_app_type] => utility [patent_app_number] => 13/535377 [patent_app_country] => US [patent_app_date] => 2012-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5391 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13535377 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/535377
Through-substrate via having a strip-shaped through-hole signal conductor Jun 27, 2012 Issued
Array ( [id] => 9497255 [patent_doc_number] => 08736078 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-27 [patent_title] => 'Chip package and method for assembling chip package' [patent_app_type] => utility [patent_app_number] => 13/534247 [patent_app_country] => US [patent_app_date] => 2012-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1059 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13534247 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/534247
Chip package and method for assembling chip package Jun 26, 2012 Issued
Array ( [id] => 9184466 [patent_doc_number] => 08624404 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-01-07 [patent_title] => 'Integrated circuit package having offset vias' [patent_app_type] => utility [patent_app_number] => 13/532126 [patent_app_country] => US [patent_app_date] => 2012-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 15 [patent_no_of_words] => 6660 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13532126 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/532126
Integrated circuit package having offset vias Jun 24, 2012 Issued
Array ( [id] => 9227880 [patent_doc_number] => 08633550 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-21 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/531567 [patent_app_country] => US [patent_app_date] => 2012-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 51 [patent_figures_cnt] => 60 [patent_no_of_words] => 37612 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 280 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13531567 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/531567
Semiconductor device Jun 23, 2012 Issued
Array ( [id] => 8450888 [patent_doc_number] => 20120261834 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-18 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/530131 [patent_app_country] => US [patent_app_date] => 2012-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2799 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13530131 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/530131
SEMICONDUCTOR DEVICE Jun 21, 2012 Abandoned
Array ( [id] => 9621379 [patent_doc_number] => 08791554 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-29 [patent_title] => 'Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates' [patent_app_type] => utility [patent_app_number] => 13/530881 [patent_app_country] => US [patent_app_date] => 2012-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 21 [patent_no_of_words] => 6751 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13530881 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/530881
Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates Jun 21, 2012 Issued
Array ( [id] => 8603996 [patent_doc_number] => 20130009308 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-10 [patent_title] => 'SEMICONDUCTOR STACK PACKAGE APPARATUS' [patent_app_type] => utility [patent_app_number] => 13/530578 [patent_app_country] => US [patent_app_date] => 2012-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 10426 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13530578 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/530578
SEMICONDUCTOR STACK PACKAGE APPARATUS Jun 21, 2012 Abandoned
Array ( [id] => 9413421 [patent_doc_number] => 08697457 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-04-15 [patent_title] => 'Devices and methods for stacking individually tested devices to form multi-chip electronic modules' [patent_app_type] => utility [patent_app_number] => 13/529267 [patent_app_country] => US [patent_app_date] => 2012-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2830 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13529267 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/529267
Devices and methods for stacking individually tested devices to form multi-chip electronic modules Jun 20, 2012 Issued
Array ( [id] => 8932502 [patent_doc_number] => 08492200 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-23 [patent_title] => 'Method for fabricating a semiconductor and semiconductor package' [patent_app_type] => utility [patent_app_number] => 13/529315 [patent_app_country] => US [patent_app_date] => 2012-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 7151 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13529315 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/529315
Method for fabricating a semiconductor and semiconductor package Jun 20, 2012 Issued
Array ( [id] => 8439699 [patent_doc_number] => 20120256315 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-11 [patent_title] => 'SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE' [patent_app_type] => utility [patent_app_number] => 13/495687 [patent_app_country] => US [patent_app_date] => 2012-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6021 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13495687 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/495687
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Jun 12, 2012 Issued
Array ( [id] => 8726097 [patent_doc_number] => 08405219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-26 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/490871 [patent_app_country] => US [patent_app_date] => 2012-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3816 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490871 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/490871
Semiconductor device Jun 6, 2012 Issued
Array ( [id] => 8726097 [patent_doc_number] => 08405219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-26 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/490871 [patent_app_country] => US [patent_app_date] => 2012-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3816 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490871 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/490871
Semiconductor device Jun 6, 2012 Issued
Array ( [id] => 8726097 [patent_doc_number] => 08405219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-26 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/490871 [patent_app_country] => US [patent_app_date] => 2012-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3816 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490871 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/490871
Semiconductor device Jun 6, 2012 Issued
Array ( [id] => 8726097 [patent_doc_number] => 08405219 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-26 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/490871 [patent_app_country] => US [patent_app_date] => 2012-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3816 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490871 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/490871
Semiconductor device Jun 6, 2012 Issued
Array ( [id] => 8480972 [patent_doc_number] => 20120280379 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-08 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 13/464257 [patent_app_country] => US [patent_app_date] => 2012-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 50 [patent_figures_cnt] => 50 [patent_no_of_words] => 36082 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13464257 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/464257
Semiconductor device and method of manufacturing same May 3, 2012 Issued
Array ( [id] => 8749936 [patent_doc_number] => 08415770 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-04-09 [patent_title] => 'Apparatus and methods for uniform metal plating' [patent_app_type] => utility [patent_app_number] => 13/462651 [patent_app_country] => US [patent_app_date] => 2012-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 35 [patent_no_of_words] => 13593 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13462651 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/462651
Apparatus and methods for uniform metal plating May 1, 2012 Issued
Array ( [id] => 8356752 [patent_doc_number] => 20120211904 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-23 [patent_title] => 'Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die' [patent_app_type] => utility [patent_app_number] => 13/458289 [patent_app_country] => US [patent_app_date] => 2012-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4603 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13458289 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/458289
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Apr 26, 2012 Issued
Array ( [id] => 8664339 [patent_doc_number] => 08377800 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-02-19 [patent_title] => 'Alignment marks for polarized light lithography and method for use thereof' [patent_app_type] => utility [patent_app_number] => 13/453848 [patent_app_country] => US [patent_app_date] => 2012-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 17 [patent_no_of_words] => 6686 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13453848 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/453848
Alignment marks for polarized light lithography and method for use thereof Apr 22, 2012 Issued
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