Search

Thanhnga B. Truong

Examiner (ID: 2062)

Most Active Art Unit
2438
Art Unit(s)
2435, 2135, 2438, 2498
Total Applications
886
Issued Applications
752
Pending Applications
24
Abandoned Applications
114

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8519892 [patent_doc_number] => 20120319300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-20 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/161368 [patent_app_country] => US [patent_app_date] => 2011-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 6609 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13161368 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/161368
Integrated circuit packaging system with underfill and method of manufacture thereof Jun 14, 2011 Issued
Array ( [id] => 9232731 [patent_doc_number] => 08598035 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-12-03 [patent_title] => 'Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same' [patent_app_type] => utility [patent_app_number] => 13/151495 [patent_app_country] => US [patent_app_date] => 2011-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 6019 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13151495 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/151495
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same Jun 1, 2011 Issued
Array ( [id] => 8859147 [patent_doc_number] => 08461684 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-11 [patent_title] => 'Cobalt nitride layers for copper interconnects and methods for forming them' [patent_app_type] => utility [patent_app_number] => 13/150992 [patent_app_country] => US [patent_app_date] => 2011-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 8562 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13150992 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/150992
Cobalt nitride layers for copper interconnects and methods for forming them May 31, 2011 Issued
Array ( [id] => 8549188 [patent_doc_number] => 08324069 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-12-04 [patent_title] => 'Method of fabricating high-performance capacitors in integrated MOS technologies' [patent_app_type] => utility [patent_app_number] => 13/134159 [patent_app_country] => US [patent_app_date] => 2011-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 5342 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13134159 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/134159
Method of fabricating high-performance capacitors in integrated MOS technologies May 30, 2011 Issued
Array ( [id] => 8969217 [patent_doc_number] => 08508033 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-08-13 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/067154 [patent_app_country] => US [patent_app_date] => 2011-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 3840 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13067154 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/067154
Semiconductor device May 11, 2011 Issued
Array ( [id] => 8826020 [patent_doc_number] => 20130127065 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-05-23 [patent_title] => 'CMUT DEVICES AND FABRICATION METHODS' [patent_app_type] => utility [patent_app_number] => 13/696294 [patent_app_country] => US [patent_app_date] => 2011-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4946 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13696294 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/696294
CMUT devices and fabrication methods May 2, 2011 Issued
Array ( [id] => 6165978 [patent_doc_number] => 20110195565 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-11 [patent_title] => 'Semiconductor Devices and Methods of Manufacture Thereof' [patent_app_type] => utility [patent_app_number] => 13/091612 [patent_app_country] => US [patent_app_date] => 2011-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7558 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20110195565.pdf [firstpage_image] =>[orig_patent_app_number] => 13091612 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/091612
Semiconductor devices and methods of manufacture thereof Apr 20, 2011 Issued
Array ( [id] => 5955748 [patent_doc_number] => 20110180822 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-07-28 [patent_title] => 'Optoelectronic Component' [patent_app_type] => utility [patent_app_number] => 13/084149 [patent_app_country] => US [patent_app_date] => 2011-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3813 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20110180822.pdf [firstpage_image] =>[orig_patent_app_number] => 13084149 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/084149
Optoelectronic component Apr 10, 2011 Issued
Array ( [id] => 7496860 [patent_doc_number] => 20110260300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-27 [patent_title] => 'Wafer-Bump Structure' [patent_app_type] => utility [patent_app_number] => 13/083745 [patent_app_country] => US [patent_app_date] => 2011-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1331 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0260/20110260300.pdf [firstpage_image] =>[orig_patent_app_number] => 13083745 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/083745
Wafer-bump structure Apr 10, 2011 Issued
Array ( [id] => 8858508 [patent_doc_number] => 08461043 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-11 [patent_title] => 'Barrier layer for integrated circuit contacts' [patent_app_type] => utility [patent_app_number] => 13/083868 [patent_app_country] => US [patent_app_date] => 2011-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1679 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13083868 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/083868
Barrier layer for integrated circuit contacts Apr 10, 2011 Issued
Array ( [id] => 7496865 [patent_doc_number] => 20110260305 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-27 [patent_title] => 'Power Semiconductor Device Packaging' [patent_app_type] => utility [patent_app_number] => 13/083531 [patent_app_country] => US [patent_app_date] => 2011-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 8073 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0260/20110260305.pdf [firstpage_image] =>[orig_patent_app_number] => 13083531 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/083531
Power semiconductor device packaging Apr 8, 2011 Issued
Array ( [id] => 8591851 [patent_doc_number] => 08349727 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-01-08 [patent_title] => 'Integrated method for high-density interconnection of electronic components through stretchable interconnects' [patent_app_type] => utility [patent_app_number] => 13/083111 [patent_app_country] => US [patent_app_date] => 2011-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3978 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13083111 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/083111
Integrated method for high-density interconnection of electronic components through stretchable interconnects Apr 7, 2011 Issued
Array ( [id] => 8642539 [patent_doc_number] => 08367522 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-02-05 [patent_title] => 'Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads' [patent_app_type] => utility [patent_app_number] => 13/082384 [patent_app_country] => US [patent_app_date] => 2011-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5317 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 220 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13082384 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/082384
Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Apr 6, 2011 Issued
Array ( [id] => 8439707 [patent_doc_number] => 20120256323 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-11 [patent_title] => 'METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DEPOSITION DEVICE' [patent_app_type] => utility [patent_app_number] => 13/080813 [patent_app_country] => US [patent_app_date] => 2011-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 12281 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 16 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13080813 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/080813
Method for processing a semiconductor wafer or die, and particle deposition device Apr 5, 2011 Issued
Array ( [id] => 8630442 [patent_doc_number] => 08362515 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-01-29 [patent_title] => 'Chip package and method for forming the same' [patent_app_type] => utility [patent_app_number] => 13/081346 [patent_app_country] => US [patent_app_date] => 2011-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 21 [patent_no_of_words] => 6155 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13081346 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/081346
Chip package and method for forming the same Apr 5, 2011 Issued
Array ( [id] => 8571643 [patent_doc_number] => 08338288 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-12-25 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/081160 [patent_app_country] => US [patent_app_date] => 2011-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 44 [patent_no_of_words] => 20814 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13081160 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/081160
Method of manufacturing semiconductor device Apr 5, 2011 Issued
Array ( [id] => 8439690 [patent_doc_number] => 20120256306 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-11 [patent_title] => 'EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING' [patent_app_type] => utility [patent_app_number] => 13/080320 [patent_app_country] => US [patent_app_date] => 2011-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2625 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13080320 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/080320
Exposed die package for direct surface mounting Apr 4, 2011 Issued
Array ( [id] => 8533304 [patent_doc_number] => 08309458 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-13 [patent_title] => 'Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising same' [patent_app_type] => utility [patent_app_number] => 13/079941 [patent_app_country] => US [patent_app_date] => 2011-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 5035 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13079941 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/079941
Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising same Apr 4, 2011 Issued
Array ( [id] => 8469734 [patent_doc_number] => 08298911 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-30 [patent_title] => 'Methods of forming wiring structures' [patent_app_type] => utility [patent_app_number] => 13/080001 [patent_app_country] => US [patent_app_date] => 2011-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 35 [patent_no_of_words] => 15329 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13080001 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/080001
Methods of forming wiring structures Apr 4, 2011 Issued
Array ( [id] => 8871187 [patent_doc_number] => 08466566 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-18 [patent_title] => 'Semiconductor device, method for manufacturing of semiconductor device, and switching circuit' [patent_app_type] => utility [patent_app_number] => 13/077999 [patent_app_country] => US [patent_app_date] => 2011-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 10299 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13077999 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/077999
Semiconductor device, method for manufacturing of semiconductor device, and switching circuit Mar 31, 2011 Issued
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