
Thao P. Le
Examiner (ID: 3443, Phone: (571)272-1785 , Office: P/2818 )
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818 |
| Total Applications | 2447 |
| Issued Applications | 2249 |
| Pending Applications | 77 |
| Abandoned Applications | 144 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19183850
[patent_doc_number] => 11990451
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-21
[patent_title] => Method for packaging semiconductor, semiconductor package structure, and package
[patent_app_type] => utility
[patent_app_number] => 17/372530
[patent_app_country] => US
[patent_app_date] => 2021-07-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5470
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 32
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17372530
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/372530 | Method for packaging semiconductor, semiconductor package structure, and package | Jul 11, 2021 | Issued |
Array
(
[id] => 19183850
[patent_doc_number] => 11990451
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-21
[patent_title] => Method for packaging semiconductor, semiconductor package structure, and package
[patent_app_type] => utility
[patent_app_number] => 17/372530
[patent_app_country] => US
[patent_app_date] => 2021-07-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5470
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 32
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17372530
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/372530 | Method for packaging semiconductor, semiconductor package structure, and package | Jul 11, 2021 | Issued |
Array
(
[id] => 18481219
[patent_doc_number] => 11694974
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-07-04
[patent_title] => Semiconductor die with warpage release layer structure in package and fabricating method thereof
[patent_app_type] => utility
[patent_app_number] => 17/370299
[patent_app_country] => US
[patent_app_date] => 2021-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 28
[patent_no_of_words] => 9527
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17370299
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/370299 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Jul 7, 2021 | Issued |
Array
(
[id] => 17188797
[patent_doc_number] => 20210335682
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-10-28
[patent_title] => METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT
[patent_app_type] => utility
[patent_app_number] => 17/366870
[patent_app_country] => US
[patent_app_date] => 2021-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5405
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 215
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17366870
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/366870 | Method for producing power semiconductor module arrangement | Jul 1, 2021 | Issued |
Array
(
[id] => 18431757
[patent_doc_number] => 11676989
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-06-13
[patent_title] => Display device and method for manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 17/366976
[patent_app_country] => US
[patent_app_date] => 2021-07-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 14
[patent_no_of_words] => 9656
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17366976
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/366976 | Display device and method for manufacturing the same | Jul 1, 2021 | Issued |
Array
(
[id] => 18608183
[patent_doc_number] => 11749661
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-09-05
[patent_title] => Package comprising a substrate and a multi-capacitor integrated passive device
[patent_app_type] => utility
[patent_app_number] => 17/364318
[patent_app_country] => US
[patent_app_date] => 2021-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 13090
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17364318
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/364318 | Package comprising a substrate and a multi-capacitor integrated passive device | Jun 29, 2021 | Issued |
Array
(
[id] => 17448383
[patent_doc_number] => 20220068888
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-03-03
[patent_title] => DIE TO DIE INTERFACE CIRCUIT
[patent_app_type] => utility
[patent_app_number] => 17/363121
[patent_app_country] => US
[patent_app_date] => 2021-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10090
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17363121
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/363121 | Die to die interface circuit | Jun 29, 2021 | Issued |
Array
(
[id] => 20204178
[patent_doc_number] => 12406963
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-09-02
[patent_title] => Wafer level integration of transducer elements, techniques and implementations
[patent_app_type] => utility
[patent_app_number] => 18/003364
[patent_app_country] => US
[patent_app_date] => 2021-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 25
[patent_no_of_words] => 4031
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18003364
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/003364 | Wafer level integration of transducer elements, techniques and implementations | Jun 28, 2021 | Issued |
Array
(
[id] => 18120648
[patent_doc_number] => 11552047
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-01-10
[patent_title] => Semiconductor package including plurality of semiconductor chips and method for manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 17/360173
[patent_app_country] => US
[patent_app_date] => 2021-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 27
[patent_no_of_words] => 12754
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17360173
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/360173 | Semiconductor package including plurality of semiconductor chips and method for manufacturing the same | Jun 27, 2021 | Issued |
Array
(
[id] => 17870860
[patent_doc_number] => 20220293597
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-09-15
[patent_title] => SEMICONDUCTOR AND CIRCUIT STRUCTURES, AND RELATED METHODS
[patent_app_type] => utility
[patent_app_number] => 17/357803
[patent_app_country] => US
[patent_app_date] => 2021-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7487
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17357803
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/357803 | Semiconductor and circuit structures, and related methods | Jun 23, 2021 | Issued |
Array
(
[id] => 18081141
[patent_doc_number] => 20220406753
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-12-22
[patent_title] => MULTI-CHIP PACKAGE WITH RECESSED MEMORY
[patent_app_type] => utility
[patent_app_number] => 17/348802
[patent_app_country] => US
[patent_app_date] => 2021-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7170
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17348802
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/348802 | Multi-chip package with recessed memory | Jun 15, 2021 | Issued |
Array
(
[id] => 17130491
[patent_doc_number] => 20210305260
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-30
[patent_title] => SRAM Circuits with Aligned Gate Electrodes
[patent_app_type] => utility
[patent_app_number] => 17/345309
[patent_app_country] => US
[patent_app_date] => 2021-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4746
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17345309
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/345309 | SRAM circuits with aligned gate electrodes | Jun 10, 2021 | Issued |
Array
(
[id] => 18190641
[patent_doc_number] => 11581242
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-02-14
[patent_title] => Integrated high efficiency gate on gate cooling
[patent_app_type] => utility
[patent_app_number] => 17/344259
[patent_app_country] => US
[patent_app_date] => 2021-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 14
[patent_no_of_words] => 4173
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17344259
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/344259 | Integrated high efficiency gate on gate cooling | Jun 9, 2021 | Issued |
Array
(
[id] => 18608190
[patent_doc_number] => 11749668
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-09-05
[patent_title] => PSPI-based patterning method for RDL
[patent_app_type] => utility
[patent_app_number] => 17/343402
[patent_app_country] => US
[patent_app_date] => 2021-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 26
[patent_no_of_words] => 5269
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 50
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17343402
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/343402 | PSPI-based patterning method for RDL | Jun 8, 2021 | Issued |
Array
(
[id] => 17536683
[patent_doc_number] => 20220115292
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-04-14
[patent_title] => SEMICONDUCTOR CHIPS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/341463
[patent_app_country] => US
[patent_app_date] => 2021-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 14790
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 191
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17341463
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/341463 | Semiconductor chips and semiconductor packages including the same | Jun 7, 2021 | Issued |
Array
(
[id] => 18448362
[patent_doc_number] => 11683954
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-06-20
[patent_title] => Flexible display apparatus
[patent_app_type] => utility
[patent_app_number] => 17/341164
[patent_app_country] => US
[patent_app_date] => 2021-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5923
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 36
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17341164
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/341164 | Flexible display apparatus | Jun 6, 2021 | Issued |
Array
(
[id] => 17115560
[patent_doc_number] => 20210296157
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-23
[patent_title] => METHOD TO FORM A 3D SEMICONDUCTOR DEVICE AND STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/334928
[patent_app_country] => US
[patent_app_date] => 2021-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 20079
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17334928
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/334928 | Method to form a 3D semiconductor device and structure | May 30, 2021 | Issued |
Array
(
[id] => 17085647
[patent_doc_number] => 20210280654
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-09
[patent_title] => DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/330469
[patent_app_country] => US
[patent_app_date] => 2021-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13597
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 161
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17330469
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/330469 | Display device and method for manufacturing display device | May 25, 2021 | Issued |
Array
(
[id] => 17070716
[patent_doc_number] => 20210272933
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-02
[patent_title] => SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/324932
[patent_app_country] => US
[patent_app_date] => 2021-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 14451
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17324932
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/324932 | Semiconductor device, manufacturing method for semiconductor device, and electronic device | May 18, 2021 | Issued |
Array
(
[id] => 18721577
[patent_doc_number] => 11798934
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-24
[patent_title] => Integrated circuit including ESD protection modules
[patent_app_type] => utility
[patent_app_number] => 17/321063
[patent_app_country] => US
[patent_app_date] => 2021-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 4987
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17321063
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/321063 | Integrated circuit including ESD protection modules | May 13, 2021 | Issued |