Search

Thao P. Le

Examiner (ID: 2034, Phone: (571)272-1785 , Office: P/2818 )

Most Active Art Unit
2818
Art Unit(s)
2818
Total Applications
2418
Issued Applications
2228
Pending Applications
71
Abandoned Applications
144

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17270352 [patent_doc_number] => 11195780 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-12-07 [patent_title] => Stacked silicon package assembly having thermal management using phase change material [patent_app_type] => utility [patent_app_number] => 16/828822 [patent_app_country] => US [patent_app_date] => 2020-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 5134 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16828822 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/828822
Stacked silicon package assembly having thermal management using phase change material Mar 23, 2020 Issued
Array ( [id] => 17270400 [patent_doc_number] => 11195828 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-12-07 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 16/826692 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 8072 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16826692 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/826692
Semiconductor device Mar 22, 2020 Issued
Array ( [id] => 17165960 [patent_doc_number] => 11152068 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-19 [patent_title] => Integrated circuit including vertical capacitors [patent_app_type] => utility [patent_app_number] => 16/823414 [patent_app_country] => US [patent_app_date] => 2020-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 4044 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823414 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/823414
Integrated circuit including vertical capacitors Mar 18, 2020 Issued
Array ( [id] => 16120623 [patent_doc_number] => 20200212334 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-02 [patent_title] => ORGANIC LIGHT EMITTING DISPLAY DEVICE AND LIGHTING APPARATUS FOR VEHICLES USING THE SAME [patent_app_type] => utility [patent_app_number] => 16/817778 [patent_app_country] => US [patent_app_date] => 2020-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8700 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -43 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16817778 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/817778
Organic light emitting display device and lighting apparatus for vehicles using the same Mar 12, 2020 Issued
Array ( [id] => 17100167 [patent_doc_number] => 20210287958 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => Stiffener Ring [patent_app_type] => utility [patent_app_number] => 16/815546 [patent_app_country] => US [patent_app_date] => 2020-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1499 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 12 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16815546 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/815546
Stiffener ring Mar 10, 2020 Issued
Array ( [id] => 17150845 [patent_doc_number] => 11143917 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-12 [patent_title] => Display panel and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 16/816144 [patent_app_country] => US [patent_app_date] => 2020-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 30 [patent_no_of_words] => 10072 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16816144 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/816144
Display panel and method of fabricating the same Mar 10, 2020 Issued
Array ( [id] => 18608107 [patent_doc_number] => 11749585 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-05 [patent_title] => High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package [patent_app_type] => utility [patent_app_number] => 16/805392 [patent_app_country] => US [patent_app_date] => 2020-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 6127 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16805392 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/805392
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package Feb 27, 2020 Issued
Array ( [id] => 17137685 [patent_doc_number] => 11139252 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-05 [patent_title] => Semiconductor package and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/802479 [patent_app_country] => US [patent_app_date] => 2020-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 71 [patent_no_of_words] => 14418 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16802479 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/802479
Semiconductor package and method for manufacturing the same Feb 25, 2020 Issued
Array ( [id] => 17055878 [patent_doc_number] => 20210265312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => INTEGRATED CIRCUIT DEVICE WITH STACKED DIES HAVING MIRRORED CIRCUITRY [patent_app_type] => utility [patent_app_number] => 16/798267 [patent_app_country] => US [patent_app_date] => 2020-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5197 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16798267 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/798267
Integrated circuit device with stacked dies having mirrored circuitry Feb 20, 2020 Issued
Array ( [id] => 18857340 [patent_doc_number] => 11854935 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Enhanced base die heat path using through-silicon vias [patent_app_type] => utility [patent_app_number] => 16/794789 [patent_app_country] => US [patent_app_date] => 2020-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 6950 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16794789 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/794789
Enhanced base die heat path using through-silicon vias Feb 18, 2020 Issued
Array ( [id] => 16846078 [patent_doc_number] => 11018175 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-05-25 [patent_title] => Solid-state imaging device, method for manufacturing same, and electronic device [patent_app_type] => utility [patent_app_number] => 16/789812 [patent_app_country] => US [patent_app_date] => 2020-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 14558 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16789812 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/789812
Solid-state imaging device, method for manufacturing same, and electronic device Feb 12, 2020 Issued
Array ( [id] => 17137682 [patent_doc_number] => 11139249 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-05 [patent_title] => Semiconductor devices and methods of forming the same [patent_app_type] => utility [patent_app_number] => 16/783392 [patent_app_country] => US [patent_app_date] => 2020-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 21 [patent_no_of_words] => 12325 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16783392 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/783392
Semiconductor devices and methods of forming the same Feb 5, 2020 Issued
Array ( [id] => 17137691 [patent_doc_number] => 11139258 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-05 [patent_title] => Bonding pads with thermal pathways [patent_app_type] => utility [patent_app_number] => 16/782298 [patent_app_country] => US [patent_app_date] => 2020-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5049 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16782298 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/782298
Bonding pads with thermal pathways Feb 4, 2020 Issued
Array ( [id] => 17551701 [patent_doc_number] => 20220123043 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => LIGHT EMITTING SUBSTRATE, WIRING SUBSTRATE AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/281293 [patent_app_country] => US [patent_app_date] => 2020-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16375 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17281293 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/281293
Light emitting substrate, wiring substrate and display device Jan 20, 2020 Issued
Array ( [id] => 17353165 [patent_doc_number] => 11227812 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-01-18 [patent_title] => Package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 16/745355 [patent_app_country] => US [patent_app_date] => 2020-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 10040 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16745355 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/745355
Package and manufacturing method thereof Jan 16, 2020 Issued
Array ( [id] => 16180478 [patent_doc_number] => 20200227447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-16 [patent_title] => SLT Integrated Circuit Capacitor Structure and Methods [patent_app_type] => utility [patent_app_number] => 16/737776 [patent_app_country] => US [patent_app_date] => 2020-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7249 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16737776 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/737776
SLT integrated circuit capacitor structure and methods Jan 7, 2020 Issued
Array ( [id] => 17196081 [patent_doc_number] => 11164848 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-11-02 [patent_title] => Semiconductor structure and method manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/737869 [patent_app_country] => US [patent_app_date] => 2020-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 65 [patent_no_of_words] => 17860 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16737869 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/737869
Semiconductor structure and method manufacturing the same Jan 7, 2020 Issued
Array ( [id] => 15873597 [patent_doc_number] => 20200144202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-07 [patent_title] => Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices [patent_app_type] => utility [patent_app_number] => 16/734889 [patent_app_country] => US [patent_app_date] => 2020-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8793 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16734889 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/734889
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices Jan 5, 2020 Issued
Array ( [id] => 16973754 [patent_doc_number] => 11069736 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-07-20 [patent_title] => Via support structure under pad areas for BSI bondability improvement [patent_app_type] => utility [patent_app_number] => 16/732646 [patent_app_country] => US [patent_app_date] => 2020-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 8082 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16732646 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/732646
Via support structure under pad areas for BSI bondability improvement Jan 1, 2020 Issued
Array ( [id] => 16904807 [patent_doc_number] => 20210183723 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-17 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/717933 [patent_app_country] => US [patent_app_date] => 2019-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6020 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16717933 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/717933
Semiconductor package structure and method of manufacturing the same Dec 16, 2019 Issued
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