Search

Thao P. Le

Examiner (ID: 3443, Phone: (571)272-1785 , Office: P/2818 )

Most Active Art Unit
2818
Art Unit(s)
2818
Total Applications
2447
Issued Applications
2249
Pending Applications
77
Abandoned Applications
144

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19483942 [patent_doc_number] => 20240331984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-03 [patent_title] => PLASMA ENHANCED EPITAXIAL CHEMICAL VAPOR DEPOSITION SYSTEM [patent_app_type] => utility [patent_app_number] => 18/620464 [patent_app_country] => US [patent_app_date] => 2024-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8725 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18620464 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/620464
PLASMA ENHANCED EPITAXIAL CHEMICAL VAPOR DEPOSITION SYSTEM Mar 27, 2024 Pending
Array ( [id] => 19858301 [patent_doc_number] => 12261152 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-25 [patent_title] => Vertical interconnect structures in three-dimensional integrated circuits [patent_app_type] => utility [patent_app_number] => 18/620591 [patent_app_country] => US [patent_app_date] => 2024-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 10154 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18620591 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/620591
Vertical interconnect structures in three-dimensional integrated circuits Mar 27, 2024 Issued
Array ( [id] => 20125989 [patent_doc_number] => 20250241020 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-07-24 [patent_title] => SCHOTTKY DIODE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/618498 [patent_app_country] => US [patent_app_date] => 2024-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3803 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18618498 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/618498
SCHOTTKY DIODE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE SAME Mar 26, 2024 Pending
Array ( [id] => 19648540 [patent_doc_number] => 20240423060 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-19 [patent_title] => ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/611442 [patent_app_country] => US [patent_app_date] => 2024-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13930 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18611442 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/611442
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Mar 19, 2024 Pending
Array ( [id] => 19285857 [patent_doc_number] => 20240222334 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/605573 [patent_app_country] => US [patent_app_date] => 2024-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11545 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18605573 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/605573
Semiconductor package having pads with stepped structure Mar 13, 2024 Issued
Array ( [id] => 19285856 [patent_doc_number] => 20240222333 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS [patent_app_type] => utility [patent_app_number] => 18/604695 [patent_app_country] => US [patent_app_date] => 2024-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 27930 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 298 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18604695 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/604695
3D semiconductor device and structure with metal layers Mar 13, 2024 Issued
Array ( [id] => 20776930 [patent_doc_number] => 12660628 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-06-16 [patent_title] => Package structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 18/589645 [patent_app_country] => US [patent_app_date] => 2024-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 2207 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18589645 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/589645
Package structure and method for forming the same Feb 27, 2024 Issued
Array ( [id] => 19749591 [patent_doc_number] => 20250038156 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-30 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/442252 [patent_app_country] => US [patent_app_date] => 2024-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7524 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18442252 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/442252
SEMICONDUCTOR PACKAGE Feb 14, 2024 Issued
Array ( [id] => 20175921 [patent_doc_number] => 12394676 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-19 [patent_title] => Semiconductor package structure and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/439743 [patent_app_country] => US [patent_app_date] => 2024-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 8534 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18439743 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/439743
Semiconductor package structure and method for manufacturing the same Feb 11, 2024 Issued
Array ( [id] => 19384827 [patent_doc_number] => 20240274697 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/433803 [patent_app_country] => US [patent_app_date] => 2024-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9442 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 322 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18433803 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/433803
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Feb 5, 2024 Pending
Array ( [id] => 20720314 [patent_doc_number] => 12635587 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-05-19 [patent_title] => 3D stacked packaging structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/417789 [patent_app_country] => US [patent_app_date] => 2024-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3247 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18417789 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/417789
3D stacked packaging structure and manufacturing method thereof Jan 18, 2024 Issued
Array ( [id] => 19712850 [patent_doc_number] => 20250022992 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-16 [patent_title] => DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/416179 [patent_app_country] => US [patent_app_date] => 2024-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12924 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18416179 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/416179
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF Jan 17, 2024 Pending
Array ( [id] => 20103044 [patent_doc_number] => 20250232980 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-07-17 [patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/415574 [patent_app_country] => US [patent_app_date] => 2024-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18415574 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/415574
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE Jan 16, 2024 Pending
Array ( [id] => 19161281 [patent_doc_number] => 20240153988 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-09 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/415172 [patent_app_country] => US [patent_app_date] => 2024-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16647 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18415172 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/415172
SEMICONDUCTOR DEVICE Jan 16, 2024 Pending
Array ( [id] => 20418376 [patent_doc_number] => 12501681 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Semiconductor device and method for fabricating the same [patent_app_type] => utility [patent_app_number] => 18/414469 [patent_app_country] => US [patent_app_date] => 2024-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 0 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18414469 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/414469
Semiconductor device and method for fabricating the same Jan 16, 2024 Issued
Array ( [id] => 19765900 [patent_doc_number] => 12224201 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-11 [patent_title] => Single crystalline silicon stack formation and bonding to a cmos wafer [patent_app_type] => utility [patent_app_number] => 18/403866 [patent_app_country] => US [patent_app_date] => 2024-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 11497 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18403866 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/403866
Single crystalline silicon stack formation and bonding to a cmos wafer Jan 3, 2024 Issued
Array ( [id] => 19146327 [patent_doc_number] => 20240145357 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => ELECTRONIC ASSEMBLY [patent_app_type] => utility [patent_app_number] => 18/402649 [patent_app_country] => US [patent_app_date] => 2024-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7301 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18402649 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/402649
ELECTRONIC ASSEMBLY Jan 1, 2024 Pending
Array ( [id] => 19384704 [patent_doc_number] => 20240274574 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM [patent_app_type] => utility [patent_app_number] => 18/396340 [patent_app_country] => US [patent_app_date] => 2023-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2948 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18396340 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/396340
CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM Dec 25, 2023 Pending
Array ( [id] => 19108713 [patent_doc_number] => 11961827 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2024-04-16 [patent_title] => 3D semiconductor device and structure with metal layers [patent_app_type] => utility [patent_app_number] => 18/395546 [patent_app_country] => US [patent_app_date] => 2023-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 61 [patent_figures_cnt] => 66 [patent_no_of_words] => 26960 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18395546 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/395546
3D semiconductor device and structure with metal layers Dec 22, 2023 Issued
Array ( [id] => 19101100 [patent_doc_number] => 20240120328 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-11 [patent_title] => POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES [patent_app_type] => utility [patent_app_number] => 18/542230 [patent_app_country] => US [patent_app_date] => 2023-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8893 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18542230 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/542230
Power module package for direct cooling multiple power modules Dec 14, 2023 Issued
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