
Thao P. Le
Examiner (ID: 9374)
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818 |
| Total Applications | 2401 |
| Issued Applications | 2209 |
| Pending Applications | 77 |
| Abandoned Applications | 143 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19337121
[patent_doc_number] => 20240251551
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-25
[patent_title] => THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION
[patent_app_type] => utility
[patent_app_number] => 18/358727
[patent_app_country] => US
[patent_app_date] => 2023-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 25836
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 174
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358727
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/358727 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION | Jul 24, 2023 | Pending |
Array
(
[id] => 18774240
[patent_doc_number] => 20230369071
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-16
[patent_title] => LOW COST PACKAGE WARPAGE SOLUTION
[patent_app_type] => utility
[patent_app_number] => 18/226129
[patent_app_country] => US
[patent_app_date] => 2023-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9084
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18226129
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/226129 | Low cost package warpage solution | Jul 24, 2023 | Issued |
Array
(
[id] => 18757581
[patent_doc_number] => 20230361044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-09
[patent_title] => HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS
[patent_app_type] => utility
[patent_app_number] => 18/224794
[patent_app_country] => US
[patent_app_date] => 2023-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7866
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 182
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18224794
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/224794 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Jul 20, 2023 | Issued |
Array
(
[id] => 19444547
[patent_doc_number] => 12094838
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-17
[patent_title] => Crack stop ring trench to prevent epitaxy crack propagation
[patent_app_type] => utility
[patent_app_number] => 18/355470
[patent_app_country] => US
[patent_app_date] => 2023-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 31
[patent_no_of_words] => 10314
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355470
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/355470 | Crack stop ring trench to prevent epitaxy crack propagation | Jul 19, 2023 | Issued |
Array
(
[id] => 19912562
[patent_doc_number] => 12288781
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-04-29
[patent_title] => PSPI-based patterning method for RDL
[patent_app_type] => utility
[patent_app_number] => 18/355906
[patent_app_country] => US
[patent_app_date] => 2023-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 26
[patent_no_of_words] => 1031
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355906
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/355906 | PSPI-based patterning method for RDL | Jul 19, 2023 | Issued |
Array
(
[id] => 19239416
[patent_doc_number] => 20240196612
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-06-13
[patent_title] => THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/354283
[patent_app_country] => US
[patent_app_date] => 2023-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 28807
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354283
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/354283 | THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Jul 17, 2023 | Pending |
Array
(
[id] => 18757693
[patent_doc_number] => 20230361156
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-09
[patent_title] => SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
[patent_app_type] => utility
[patent_app_number] => 18/353307
[patent_app_country] => US
[patent_app_date] => 2023-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6659
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 30
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353307
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/353307 | Semiconductor device structure with magnetic element | Jul 16, 2023 | Issued |
Array
(
[id] => 19575077
[patent_doc_number] => 20240379369
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-14
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/222815
[patent_app_country] => US
[patent_app_date] => 2023-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6351
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222815
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/222815 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | Jul 16, 2023 | Pending |
Array
(
[id] => 18757750
[patent_doc_number] => 20230361213
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-09
[patent_title] => FERROELECTRIC MFM INDUCTOR AND RELATED CIRCUITS
[patent_app_type] => utility
[patent_app_number] => 18/343687
[patent_app_country] => US
[patent_app_date] => 2023-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7344
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18343687
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/343687 | Ferroelectric MFM inductor and related circuits | Jun 27, 2023 | Issued |
Array
(
[id] => 19123589
[patent_doc_number] => 11967583
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-23
[patent_title] => 3D semiconductor device and structure with metal layers
[patent_app_type] => utility
[patent_app_number] => 18/214524
[patent_app_country] => US
[patent_app_date] => 2023-06-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 61
[patent_figures_cnt] => 66
[patent_no_of_words] => 26011
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18214524
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/214524 | 3D semiconductor device and structure with metal layers | Jun 26, 2023 | Issued |
Array
(
[id] => 18913050
[patent_doc_number] => 11876037
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2024-01-16
[patent_title] => Chip stacking and packaging structure
[patent_app_type] => utility
[patent_app_number] => 18/340881
[patent_app_country] => US
[patent_app_date] => 2023-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 7063
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 473
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340881
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/340881 | Chip stacking and packaging structure | Jun 24, 2023 | Issued |
Array
(
[id] => 20132283
[patent_doc_number] => 12374601
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-07-29
[patent_title] => Three-dimensional device cooling
[patent_app_type] => utility
[patent_app_number] => 18/340680
[patent_app_country] => US
[patent_app_date] => 2023-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 3582
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340680
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/340680 | Three-dimensional device cooling | Jun 22, 2023 | Issued |
Array
(
[id] => 18714815
[patent_doc_number] => 20230337460
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-19
[patent_title] => FLEXIBLE DISPLAY APPARATUS
[patent_app_type] => utility
[patent_app_number] => 18/337320
[patent_app_country] => US
[patent_app_date] => 2023-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5949
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18337320
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/337320 | Flexible display apparatus | Jun 18, 2023 | Issued |
Array
(
[id] => 19646543
[patent_doc_number] => 20240421063
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-12-19
[patent_title] => MIM Capacitor in IC Heterogenous Integration
[patent_app_type] => utility
[patent_app_number] => 18/336413
[patent_app_country] => US
[patent_app_date] => 2023-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8995
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 237
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18336413
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/336413 | MIM Capacitor in IC Heterogenous Integration | Jun 15, 2023 | Pending |
Array
(
[id] => 18696478
[patent_doc_number] => 20230326917
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-12
[patent_title] => PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/334390
[patent_app_country] => US
[patent_app_date] => 2023-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8268
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18334390
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/334390 | Package structure and method of forming the same | Jun 13, 2023 | Issued |
Array
(
[id] => 19384715
[patent_doc_number] => 20240274585
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-15
[patent_title] => INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING
[patent_app_type] => utility
[patent_app_number] => 18/330074
[patent_app_country] => US
[patent_app_date] => 2023-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 26788
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18330074
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/330074 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING | Jun 5, 2023 | Pending |
Array
(
[id] => 18821229
[patent_doc_number] => 20230395570
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-07
[patent_title] => THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS
[patent_app_type] => utility
[patent_app_number] => 18/205916
[patent_app_country] => US
[patent_app_date] => 2023-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9945
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18205916
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/205916 | Thermal management of three-dimensional integrated circuits | Jun 4, 2023 | Issued |
Array
(
[id] => 19627143
[patent_doc_number] => 12165992
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-10
[patent_title] => Package structure and fabricating method thereof
[patent_app_type] => utility
[patent_app_number] => 18/327076
[patent_app_country] => US
[patent_app_date] => 2023-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 15
[patent_no_of_words] => 7285
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327076
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/327076 | Package structure and fabricating method thereof | May 31, 2023 | Issued |
Array
(
[id] => 18653133
[patent_doc_number] => 20230298973
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-21
[patent_title] => PACKAGE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/325104
[patent_app_country] => US
[patent_app_date] => 2023-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10099
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325104
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/325104 | Package and manufacturing method thereof | May 28, 2023 | Issued |
Array
(
[id] => 19589809
[patent_doc_number] => 20240387366
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-21
[patent_title] => SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE
[patent_app_type] => utility
[patent_app_number] => 18/317462
[patent_app_country] => US
[patent_app_date] => 2023-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 17639
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317462
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/317462 | SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE | May 14, 2023 | Pending |