
Thao P. Le
Examiner (ID: 9374)
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818 |
| Total Applications | 2401 |
| Issued Applications | 2209 |
| Pending Applications | 77 |
| Abandoned Applications | 143 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18249018
[patent_doc_number] => 11605616
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2023-03-14
[patent_title] => 3D semiconductor device and structure with metal layers
[patent_app_type] => utility
[patent_app_number] => 17/986831
[patent_app_country] => US
[patent_app_date] => 2022-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 61
[patent_figures_cnt] => 66
[patent_no_of_words] => 24676
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17986831
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/986831 | 3D semiconductor device and structure with metal layers | Nov 13, 2022 | Issued |
Array
(
[id] => 18258240
[patent_doc_number] => 20230085280
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-16
[patent_title] => PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER
[patent_app_type] => utility
[patent_app_number] => 17/984259
[patent_app_country] => US
[patent_app_date] => 2022-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9713
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17984259
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/984259 | Package structure with buffer layer embedded in lid layer | Nov 9, 2022 | Issued |
Array
(
[id] => 19161207
[patent_doc_number] => 20240153914
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-09
[patent_title] => MICROELECTRONIC DEVICE PACKAGES INCLUDING WIREBONDING AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
[patent_app_type] => utility
[patent_app_number] => 18/054103
[patent_app_country] => US
[patent_app_date] => 2022-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7448
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 61
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054103
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/054103 | MICROELECTRONIC DEVICE PACKAGES INCLUDING WIREBONDING AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | Nov 8, 2022 | Pending |
Array
(
[id] => 18225213
[patent_doc_number] => 20230064207
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-02
[patent_title] => HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/982347
[patent_app_country] => US
[patent_app_date] => 2022-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11842
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17982347
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/982347 | HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME | Nov 6, 2022 | Pending |
Array
(
[id] => 19294697
[patent_doc_number] => 12034062
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-07-09
[patent_title] => Semiconductor device structure and method for forming the same
[patent_app_type] => utility
[patent_app_number] => 17/980656
[patent_app_country] => US
[patent_app_date] => 2022-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 38
[patent_figures_cnt] => 38
[patent_no_of_words] => 9360
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980656
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/980656 | Semiconductor device structure and method for forming the same | Nov 3, 2022 | Issued |
Array
(
[id] => 18679996
[patent_doc_number] => 20230317654
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-05
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/980740
[patent_app_country] => US
[patent_app_date] => 2022-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12933
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 170
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980740
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/980740 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Nov 3, 2022 | Pending |
Array
(
[id] => 18473149
[patent_doc_number] => 20230207437
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-29
[patent_title] => MULTI-CHANNEL DEVICE STACKING
[patent_app_type] => utility
[patent_app_number] => 18/052399
[patent_app_country] => US
[patent_app_date] => 2022-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10890
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18052399
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/052399 | MULTI-CHANNEL DEVICE STACKING | Nov 2, 2022 | Pending |
Array
(
[id] => 18195388
[patent_doc_number] => 20230048907
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-02-16
[patent_title] => INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/978225
[patent_app_country] => US
[patent_app_date] => 2022-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8817
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17978225
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/978225 | Integrated circuit, package structure, and manufacturing method of package structure | Oct 31, 2022 | Issued |
Array
(
[id] => 19146427
[patent_doc_number] => 20240145457
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-02
[patent_title] => FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/050099
[patent_app_country] => US
[patent_app_date] => 2022-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9580
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -22
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18050099
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/050099 | FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE | Oct 26, 2022 | Issued |
Array
(
[id] => 18379782
[patent_doc_number] => 20230154871
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-18
[patent_title] => SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM
[patent_app_type] => utility
[patent_app_number] => 17/973731
[patent_app_country] => US
[patent_app_date] => 2022-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10807
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17973731
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/973731 | Semiconductor device, semiconductor package, and memory system | Oct 25, 2022 | Issued |
Array
(
[id] => 19183860
[patent_doc_number] => 11990461
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-05-21
[patent_title] => Integrated circuit package for high bandwidth memory
[patent_app_type] => utility
[patent_app_number] => 17/970237
[patent_app_country] => US
[patent_app_date] => 2022-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 8004
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17970237
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/970237 | Integrated circuit package for high bandwidth memory | Oct 19, 2022 | Issued |
Array
(
[id] => 18307443
[patent_doc_number] => 20230111343
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-13
[patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/961954
[patent_app_country] => US
[patent_app_date] => 2022-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8329
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17961954
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/961954 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Oct 6, 2022 | Pending |
Array
(
[id] => 20404440
[patent_doc_number] => 12494421
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-09
[patent_title] => Semiconductor package including redistribution structure, and method of manufacturing the same
[patent_app_type] => utility
[patent_app_number] => 17/938672
[patent_app_country] => US
[patent_app_date] => 2022-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 5003
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 159
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17938672
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/938672 | Semiconductor package including redistribution structure, and method of manufacturing the same | Oct 5, 2022 | Issued |
Array
(
[id] => 18456344
[patent_doc_number] => 20230197626
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-22
[patent_title] => PACKAGE SUBSTRATES AND SEMICONDUCTOR PACKAGES HAVING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/938665
[patent_app_country] => US
[patent_app_date] => 2022-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12820
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 285
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17938665
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/938665 | Package substrates and semiconductor packages having the same | Oct 5, 2022 | Issued |
Array
(
[id] => 18967499
[patent_doc_number] => 11901280
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-02-13
[patent_title] => Ground via clustering for crosstalk mitigation
[patent_app_type] => utility
[patent_app_number] => 17/956766
[patent_app_country] => US
[patent_app_date] => 2022-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 7682
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 234
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17956766
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/956766 | Ground via clustering for crosstalk mitigation | Sep 28, 2022 | Issued |
Array
(
[id] => 18284062
[patent_doc_number] => 20230099534
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-30
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/955778
[patent_app_country] => US
[patent_app_date] => 2022-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5418
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17955778
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/955778 | SEMICONDUCTOR DEVICE | Sep 28, 2022 | Pending |
Array
(
[id] => 18473193
[patent_doc_number] => 20230207481
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-29
[patent_title] => PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/936640
[patent_app_country] => US
[patent_app_date] => 2022-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7394
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17936640
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/936640 | Printed circuit board and semiconductor package including the same | Sep 28, 2022 | Issued |
Array
(
[id] => 20201592
[patent_doc_number] => 12404361
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-09-02
[patent_title] => Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same
[patent_app_type] => utility
[patent_app_number] => 17/935886
[patent_app_country] => US
[patent_app_date] => 2022-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5644
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 171
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17935886
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/935886 | Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same | Sep 26, 2022 | Issued |
Array
(
[id] => 18440070
[patent_doc_number] => 20230187365
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-15
[patent_title] => Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip
[patent_app_type] => utility
[patent_app_number] => 17/952249
[patent_app_country] => US
[patent_app_date] => 2022-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 134952
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -23
[patent_words_short_claim] => 221
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17952249
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/952249 | Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip | Sep 23, 2022 | Pending |
Array
(
[id] => 20418312
[patent_doc_number] => 12501616
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-16
[patent_title] => Memory system, semiconductor device and fabrication method therefor
[patent_app_type] => utility
[patent_app_number] => 17/951980
[patent_app_country] => US
[patent_app_date] => 2022-09-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 24
[patent_no_of_words] => 4698
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17951980
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/951980 | MEMORY SYSTEM, SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR | Sep 22, 2022 | Issued |