Search

Thao P. Le

Examiner (ID: 9374)

Most Active Art Unit
2818
Art Unit(s)
2818
Total Applications
2401
Issued Applications
2209
Pending Applications
77
Abandoned Applications
143

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18249018 [patent_doc_number] => 11605616 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2023-03-14 [patent_title] => 3D semiconductor device and structure with metal layers [patent_app_type] => utility [patent_app_number] => 17/986831 [patent_app_country] => US [patent_app_date] => 2022-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 61 [patent_figures_cnt] => 66 [patent_no_of_words] => 24676 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17986831 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/986831
3D semiconductor device and structure with metal layers Nov 13, 2022 Issued
Array ( [id] => 18258240 [patent_doc_number] => 20230085280 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER [patent_app_type] => utility [patent_app_number] => 17/984259 [patent_app_country] => US [patent_app_date] => 2022-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9713 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17984259 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/984259
Package structure with buffer layer embedded in lid layer Nov 9, 2022 Issued
Array ( [id] => 19161207 [patent_doc_number] => 20240153914 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-09 [patent_title] => MICROELECTRONIC DEVICE PACKAGES INCLUDING WIREBONDING AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS [patent_app_type] => utility [patent_app_number] => 18/054103 [patent_app_country] => US [patent_app_date] => 2022-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7448 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054103 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/054103
MICROELECTRONIC DEVICE PACKAGES INCLUDING WIREBONDING AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS Nov 8, 2022 Pending
Array ( [id] => 18225213 [patent_doc_number] => 20230064207 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/982347 [patent_app_country] => US [patent_app_date] => 2022-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11842 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17982347 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/982347
HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME Nov 6, 2022 Pending
Array ( [id] => 19294697 [patent_doc_number] => 12034062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-09 [patent_title] => Semiconductor device structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/980656 [patent_app_country] => US [patent_app_date] => 2022-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 9360 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980656 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/980656
Semiconductor device structure and method for forming the same Nov 3, 2022 Issued
Array ( [id] => 18679996 [patent_doc_number] => 20230317654 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/980740 [patent_app_country] => US [patent_app_date] => 2022-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12933 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980740 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/980740
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Nov 3, 2022 Pending
Array ( [id] => 18473149 [patent_doc_number] => 20230207437 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => MULTI-CHANNEL DEVICE STACKING [patent_app_type] => utility [patent_app_number] => 18/052399 [patent_app_country] => US [patent_app_date] => 2022-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10890 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18052399 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/052399
MULTI-CHANNEL DEVICE STACKING Nov 2, 2022 Pending
Array ( [id] => 18195388 [patent_doc_number] => 20230048907 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-16 [patent_title] => INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/978225 [patent_app_country] => US [patent_app_date] => 2022-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8817 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17978225 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/978225
Integrated circuit, package structure, and manufacturing method of package structure Oct 31, 2022 Issued
Array ( [id] => 19146427 [patent_doc_number] => 20240145457 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE [patent_app_type] => utility [patent_app_number] => 18/050099 [patent_app_country] => US [patent_app_date] => 2022-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9580 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18050099 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/050099
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE Oct 26, 2022 Issued
Array ( [id] => 18379782 [patent_doc_number] => 20230154871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM [patent_app_type] => utility [patent_app_number] => 17/973731 [patent_app_country] => US [patent_app_date] => 2022-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10807 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17973731 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/973731
Semiconductor device, semiconductor package, and memory system Oct 25, 2022 Issued
Array ( [id] => 19183860 [patent_doc_number] => 11990461 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Integrated circuit package for high bandwidth memory [patent_app_type] => utility [patent_app_number] => 17/970237 [patent_app_country] => US [patent_app_date] => 2022-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8004 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17970237 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/970237
Integrated circuit package for high bandwidth memory Oct 19, 2022 Issued
Array ( [id] => 18307443 [patent_doc_number] => 20230111343 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-13 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/961954 [patent_app_country] => US [patent_app_date] => 2022-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8329 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17961954 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/961954
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Oct 6, 2022 Pending
Array ( [id] => 20404440 [patent_doc_number] => 12494421 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Semiconductor package including redistribution structure, and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/938672 [patent_app_country] => US [patent_app_date] => 2022-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 5003 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17938672 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/938672
Semiconductor package including redistribution structure, and method of manufacturing the same Oct 5, 2022 Issued
Array ( [id] => 18456344 [patent_doc_number] => 20230197626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => PACKAGE SUBSTRATES AND SEMICONDUCTOR PACKAGES HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 17/938665 [patent_app_country] => US [patent_app_date] => 2022-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12820 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 285 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17938665 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/938665
Package substrates and semiconductor packages having the same Oct 5, 2022 Issued
Array ( [id] => 18967499 [patent_doc_number] => 11901280 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Ground via clustering for crosstalk mitigation [patent_app_type] => utility [patent_app_number] => 17/956766 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7682 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 234 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17956766 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/956766
Ground via clustering for crosstalk mitigation Sep 28, 2022 Issued
Array ( [id] => 18284062 [patent_doc_number] => 20230099534 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/955778 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5418 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17955778 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/955778
SEMICONDUCTOR DEVICE Sep 28, 2022 Pending
Array ( [id] => 18473193 [patent_doc_number] => 20230207481 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 17/936640 [patent_app_country] => US [patent_app_date] => 2022-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7394 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17936640 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/936640
Printed circuit board and semiconductor package including the same Sep 28, 2022 Issued
Array ( [id] => 20201592 [patent_doc_number] => 12404361 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-02 [patent_title] => Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same [patent_app_type] => utility [patent_app_number] => 17/935886 [patent_app_country] => US [patent_app_date] => 2022-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5644 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17935886 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/935886
Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same Sep 26, 2022 Issued
Array ( [id] => 18440070 [patent_doc_number] => 20230187365 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip [patent_app_type] => utility [patent_app_number] => 17/952249 [patent_app_country] => US [patent_app_date] => 2022-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 134952 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17952249 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/952249
Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip Sep 23, 2022 Pending
Array ( [id] => 20418312 [patent_doc_number] => 12501616 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-16 [patent_title] => Memory system, semiconductor device and fabrication method therefor [patent_app_type] => utility [patent_app_number] => 17/951980 [patent_app_country] => US [patent_app_date] => 2022-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 24 [patent_no_of_words] => 4698 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17951980 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/951980
MEMORY SYSTEM, SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR Sep 22, 2022 Issued
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